公开(公告)号：US06645643B2

公开(公告)日：2003-11-11

申请号：US09844505

申请日：2001-04-27

申请人： Roberto Zafarana ,  Antonino Scandurra ,  Salvatore Pignataro ,  Yuichi Tenya ,  Akira Yoshizumi

发明人： Roberto Zafarana ,  Antonino Scandurra ,  Salvatore Pignataro ,  Yuichi Tenya ,  Akira Yoshizumi

IPC分类号： H01L2912

CPC分类号： H01L23/296 ,  C08K3/36 ,  C08L63/00 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/12528 ,  C08L83/00 ,  H01L2924/00

摘要： A polymeric composition for making semiconductor device packaging includes at least one epoxy resin, at least one curing agent in an amount between 30 and 110 parts by weight per 100 parts by weight of the epoxy resin, at least one silica-based reinforcing filler in an amount between 300 and 2300 parts by weight per 100 parts of the epoxy resin, and at least one control agent for a rheology of the polymeric composition. The at least one control agent may be substantially free from polar groups and present in an amount between 0.1 and 50 parts by weight per 100 parts by weight of the epoxy resin. The invention also relates to a plastic packaging material for microelectronic applications which may be obtained from the above polymeric composition, and to a semiconductor electronic device including such packaging material.

公开(公告)号：US5641997A

公开(公告)日：1997-06-24

申请号：US305478

申请日：1994-09-13

申请人： Hideo Ohta ,  Tetsuo Okuyama ,  Shinetsu Fujieda ,  Sadao Kajiura ,  Akira Yoshizumi

发明人： Hideo Ohta ,  Tetsuo Okuyama ,  Shinetsu Fujieda ,  Sadao Kajiura ,  Akira Yoshizumi

IPC分类号： C08L63/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/433

CPC分类号： C08L63/00 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/1815

摘要： A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.

摘要翻译： 半导体芯片位于封装片之间。 封装片各自具有高粘合性的表面和较少粘合剂的表面。 高度粘合的封装片的表面接触芯片。 粘合剂较少的表面与模具接触。 随后，通过模塑进行包封。 可以在不降低脱模性的情况下改善耐焊接性。

公开(公告)号：US5216077A

公开(公告)日：1993-06-01

申请号：US874226

申请日：1992-04-27

申请人： Akira Yoshizumi ,  Shinetsu Fujieda ,  Ken Uchida ,  Naoko Kihara ,  Kazuhiro Sawai ,  Tsutomu Nagata ,  Shinji Murakami ,  Shigeyuki Kouchiyama

发明人： Akira Yoshizumi ,  Shinetsu Fujieda ,  Ken Uchida ,  Naoko Kihara ,  Kazuhiro Sawai ,  Tsutomu Nagata ,  Shinji Murakami ,  Shigeyuki Kouchiyama

IPC分类号： C08L61/06 ,  C08L63/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08L61/06 ,  C08L63/00

摘要： A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

摘要翻译： 橡胶改性酚醛树脂组合物含有酚醛清漆型酚醛树脂，其中至少一种选自ABS树脂和MBS树脂的改性剂均匀分散。 该组合物具有良好的抗冲击性和耐热冲击性。 通过将上述至少一种改性剂加入到其软化点或更高温度下被加热和熔化的酚醛清漆型酚醛树脂来制备组合物，使得改性剂均匀分散在树脂中。 树脂组合物适合用作环氧树脂密封剂用于密封电子器件的固化剂。

公开(公告)号：US5043211A

公开(公告)日：1991-08-27

申请号：US175225

申请日：1988-03-30

申请人： Akira Yoshizumi ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Ken Uchida

发明人： Akira Yoshizumi ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Ken Uchida

IPC分类号： C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08G59/62 ,  C08K9/06 ,  C08K9/08 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/296 ,  C08K9/08 ,  C08L63/00 ,  H01L23/295 ,  H01L2924/0002 ,  Y10T428/239 ,  Y10T428/259 ,  Y10T428/31511

摘要： An epoxy resin composition useful for sealing a semiconductor device includes 100 parts by weight of epoxy resin, 30-75 parts by weight of phenolic resin, 320-570 parts by weight of silica powder, and 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer. The surface of the silica powder is treated, at room temperature, by 0.05-1.00% by weight of silane coupling agent, 0.05-1.00% by weight of a silicone base surface active agent, and 0.15-3.00% by weight of thermosetting silicone rubber.

公开(公告)号：US20050239959A1

公开(公告)日：2005-10-27

申请号：US10515962

申请日：2003-05-26

申请人： Osamu Hisashi ,  Kenichi Michiwaki ,  Masami Motouri ,  Akira Yoshizumi

发明人： Osamu Hisashi ,  Kenichi Michiwaki ,  Masami Motouri ,  Akira Yoshizumi

IPC分类号： C04B41/46 ,  C04B41/52 ,  C04B41/62 ,  C04B41/70 ,  C04B41/71 ,  B05D3/00 ,  C08K3/00

CPC分类号： C04B41/009 ,  C04B41/46 ,  C04B41/52 ,  C04B41/62 ,  C04B41/70 ,  C04B41/4556 ,  C04B41/48 ,  C04B28/02

摘要： A method for improving the adhesiveness between hardened cement compositions and resin coating materials by spraying an aqueous solution containing organic acid(s) which will react with the surface to produce calcium compounds on the hardened cement surface before a resin coating material is applied, thus removing the carbonate membrane of hydrated cement compositions. This improves the adhesiveness between the hardened cement compositions and the resin coating material.

摘要翻译： 在施加树脂涂层材料之前，通过喷涂含有有机酸的水溶液来改善硬化水泥组合物和树脂涂料之间的粘合性的方法，其将与表面反应以在硬化的水泥表面上产生钙化合物，从而除去 水泥水泥组合物的碳酸盐膜。 这改善了硬化水泥组合物和树脂涂料之间的粘合性。

公开(公告)号：US5853952A

公开(公告)日：1998-12-29

申请号：US705265

申请日：1996-08-29

申请人： Toru Ushirogouchi ,  Makoto Nakase ,  Akira Yoshizumi ,  Naoko Kihara ,  Takuya Naito ,  Naomi Shida ,  Koji Asakawa

发明人： Toru Ushirogouchi ,  Makoto Nakase ,  Akira Yoshizumi ,  Naoko Kihara ,  Takuya Naito ,  Naomi Shida ,  Koji Asakawa

IPC分类号： C08G12/06 ,  C08G73/00 ,  G02B5/22 ,  G03F7/00 ,  G03F7/004 ,  G03F7/105 ,  G03C1/73

CPC分类号： C08G12/06 ,  G03F7/0007 ,  G03F7/0045 ,  G03F7/105 ,  G02B5/22 ,  Y10S430/163

摘要： There is disclosed a color developing resin composition comprising a base polymer, a dialdehyde represented by the general formula OHC--R.sup.1' --CHO, a diamine represented by the general formula H.sub.2 N--R.sup.2' --NH.sub.2 (at least one of R.sup.1' and R.sup.2' is an aromatic group), a compound which produces an acid by light irradiating and a resin which is crosslinked with the acid.

摘要翻译： 公开了一种显色树脂组合物，其包含基础聚合物，由通式OHC-R1'-CHO表示的二醛，由通式H2N-R2'-NH2表示的二胺（R1'和R2'中的至少一个） 是芳族基团），通过光照射产生酸的化合物和与酸交联的树脂。

公开(公告)号：US5272377A

公开(公告)日：1993-12-21

申请号：US785812

申请日：1991-10-31

申请人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Michiya Higashi ,  Akira Yoshizumi

发明人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Michiya Higashi ,  Akira Yoshizumi

IPC分类号： C08L61/06 ,  C08K5/14 ,  C08K5/5313 ,  C08L35/00 ,  C08L61/04 ,  C08L79/08 ,  H01B3/30 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L23/293 ,  C08K5/14 ,  C08K5/5313 ,  C08L79/085 ,  H01B3/306 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1433

摘要： The device characteristics is in containing a maleimide resin with a content of 0.2 weight percent of less of an organic acid, a phenolic resin, and a combination of a basic catalyst and a peroxide as a curing catalyst. In addition, additives as a mold release agent such as a polyethylene wax and an inorganic filler are contained. The maleimide resin composition is prepared in such a manner that a part of the phenolic resin is preblended with the curing catalyst in advance of other components, while the remainder of the phenolic resin is added to the maleimide resin to prepolymerize, and then, the preblend and the prepolyer are blended the other components. The maleimide resin composition has excellent moldability by improvement of curing characteristics through combined use of a basic catalyst and a peroxide as a curing agent. Besides, a resin encapsulated semiconductor device manufactured by encapsulating a semiconductor element with the resin composition has excellent heat resistance and moisture-resistance reliability.

摘要翻译： 该装置的特征在于含有0.2重量％以下的有机酸，酚醛树脂，碱性催化剂和过氧化物的组合的马来酰亚胺树脂作为固化催化剂。 此外，含有作为脱模剂的添加剂如聚乙烯蜡和无机填料。 马来酰亚胺树脂组合物的制备方法是将一部分酚醛树脂与其它组分预先与固化催化剂预混合，同时将剩余的酚醛树脂加入到马来酰亚胺树脂中进行预聚合，然后将预混物 并将预分散器与其它组分混合。 马来酰亚胺树脂组合物通过组合使用碱性催化剂和作为固化剂的过氧化物来改善固化特性，具有优异的成型性。 此外，通过用树脂组合物封装半导体元件制造的树脂封装的半导体器件具有优异的耐热性和耐湿可靠性。

公开(公告)号：US5252639A

公开(公告)日：1993-10-12

申请号：US796896

申请日：1991-11-25

申请人： Shinetsu Fujieda ,  Akira Yoshizumi ,  Kazutaka Matsumoto ,  Hisayuki Hirai

发明人： Shinetsu Fujieda ,  Akira Yoshizumi ,  Kazutaka Matsumoto ,  Hisayuki Hirai

IPC分类号： C08K5/00 ,  H01L23/29 ,  C08K5/09

CPC分类号： H01L23/293 ,  C08K5/00 ,  C08K5/0091 ,  H01L2924/0002

摘要： The molding resin composition of this invention comprises a resin contained a releasing a agents formulated with a release agent and a metal chelate compound.This resin composition is improved an good adhesivity, high moisture resistivity and a good moldability.

摘要翻译： 本发明的成型树脂组合物包含含有脱模剂和金属螯合物配制的试剂的树脂。 该树脂组合物具有良好的粘合性，高的耐湿性和良好的成型性。

公开(公告)号：US4921537A

公开(公告)日：1990-05-01

申请号：US601832

申请日：1984-04-19

申请人： Kazuo Horiguchi ,  Kazuyoshi Hosaka ,  Akira Yoshizumi

发明人： Kazuo Horiguchi ,  Kazuyoshi Hosaka ,  Akira Yoshizumi

IPC分类号： C04B22/06 ,  C04B7/34 ,  C04B22/00 ,  C04B22/14 ,  C04B24/06 ,  C04B24/22 ,  C04B28/02 ,  C04B28/04 ,  C04B28/06

CPC分类号： C04B22/008 ,  C04B28/06 ,  C04B7/34 ,  C04B2111/34

摘要： A shrinkage compensated mortar or grout can be made with about 40 to 60% by weight of fine aggregate and 40 to 60% by weight of a hydraulic composition which in turn is made with 60 to 80% by weight of mixture of rapid hardening cement and 20 to 40% portland cement; and based on the weight of cement, 5 to 8% by weight of silica powder; 0.2 to 0.4% by weight of a hydroxycarboxylic acid or a salt thereof; and 2 to 3% by weight of a high performance water-reducer. Such shrinkage compensated mortars or grouts are useful in the installation of machinery, foundations for major structures and the like.

摘要翻译： 收缩补偿砂浆或浆料可以用约40-60％重量的细骨料和40-60％重量的水硬性组合物制成，水硬性组合物依次由60-80％重量的快速硬化水泥和 20〜40％硅酸盐水泥; 并以水泥重量计，5〜8重量％的二氧化硅粉末; 0.2〜0.4重量％的羟基羧酸或其盐; 和2〜3重量％的高性能减水剂。 这种收缩补偿的砂浆或浆料可用于机械的安装，主要结构的基础等。

公开(公告)号：US20130230294A1

公开(公告)日：2013-09-05

申请号：US13817353

申请日：2011-08-19

申请人： Atsushi Sassa ,  Akinori Kouchi ,  Tomohiro Aikawa ,  Masaru Fujii ,  Kei Takahashi ,  Masashi Hohya ,  Akira Yoshizumi ,  Takayuki Koizumi

发明人： Atsushi Sassa ,  Akinori Kouchi ,  Tomohiro Aikawa ,  Masaru Fujii ,  Kei Takahashi ,  Masashi Hohya ,  Akira Yoshizumi ,  Takayuki Koizumi

IPC分类号： H04N7/18

CPC分类号： H04N7/18 ,  H04N5/2354 ,  H04N5/33 ,  H04N5/77 ,  H04N9/8042

摘要： The purpose of the present invention is to provide an image monitoring system which can be used in a place where a network cannot be established and has excellent portability. When an image is captured during the daytime or in a bright place, a camera (10) is equipped with a near-infrared cut filter, captures an image of a subject, and outputs a color image. On the other hand, when an image is captured during the nighttime or in a dark place, the near-infrared cut filter is removed from the camera (10), an LED light (11) irradiates the subject with near-infrared light in synchronization with the shutter speed of the camera (10), and the camera (10) captures an image of the near-infrared light reflected by the subject and outputs a monochrome image. The image outputted from the camera (10) is inputted to a recording device via a dedicated cable.

摘要翻译： 本发明的目的是提供一种图像监视系统，其可以在不能建立网络并且具有优异的便携性的地方使用。 当在白天或在明亮的地方捕获图像时，相机（10）配备有近红外截止滤光器，捕获被摄体的图像，并输出彩色图像。 另一方面，当在夜间或暗处拍摄图像时，从相机（10）去除近红外截止滤光器，LED灯（11）同步地以近红外光照射被摄体 具有相机（10）的快门速度，并且相机（10）捕获由被摄体反射的近红外光的图像并输出单色图像。 从照相机（10）输出的图像通过专用电缆输入到记录装置。