公开(公告)号：USD448776S1

公开(公告)日：2001-10-02

申请号：US29130565

申请日：2000-10-04

申请人： Chien-sen Weng ,  Hsiang-tsun Yen

设计人： Chien-sen Weng ,  Hsiang-tsun Yen

公开(公告)号：US20130029476A1

公开(公告)日：2013-01-31

申请号：US13540781

申请日：2012-07-03

申请人： Chien-Sen WENG ,  Mong-Yeng Xing ,  Yu-Ching Chang ,  Wei-Chang Yu ,  Yao-Hui Lin

发明人： Chien-Sen WENG ,  Mong-Yeng Xing ,  Yu-Ching Chang ,  Wei-Chang Yu ,  Yao-Hui Lin

IPC分类号： H01L21/78

CPC分类号： B28D5/0011 ,  B28D5/0052 ,  Y02P80/30

摘要： A dicing process is provided for cutting a wafer along a plurality of predetermined scribe lines into a plurality of dies that are releasably adhered to a release film. The dicing process includes: (a) disposing a wafer-breaking carrier on a supporting device, the wafer-breaking carrier having a chipping unit; (b) disposing the wafer above the supporting device such that the chipping unit is at a position corresponding to the scribe lines; and (c) adhering a release surface of the release film to the wafer by applying a force to the release film to contact the chipping unit of the wafer-breaking carrier with the wafer, such that the wafer is split along the scribe lines into the dies.

摘要翻译： 提供了一种切割工艺，用于沿着多条预定划线将晶片切割成可剥离地粘附到脱模膜上的多个模具。 切割工艺包括：（a）在支撑装置上设置晶片破坏载体，晶片断开载体具有切屑单元; （b）将所述晶片设置在所述支撑装置上方，使得所述切屑单元处于与所述划线对应的位置; 并且（c）通过向剥离膜施加力使脱模膜的释放表面附着到晶片上，以将晶片破坏载体的切屑单元与晶片接触，使得晶片沿着划线分裂成 死了

公开(公告)号：US08314898B2

公开(公告)日：2012-11-20

申请号：US13050950

申请日：2011-03-18

申请人： Mao-Yi Chang ,  Chia-Tien Peng ,  Chih-Wei Chao ,  Chien-Sen Weng ,  Chao-Shun Liao

发明人： Mao-Yi Chang ,  Chia-Tien Peng ,  Chih-Wei Chao ,  Chien-Sen Weng ,  Chao-Shun Liao

IPC分类号： G02F1/137

CPC分类号： G02F1/13452 ,  G02F1/133382

摘要： A display device includes a first substrate, a heating layer formed on the first substrate, an insulating layer having a first opening formed on the heating layer, at least one switching device, two contact pads formed on the insulating layer, and respectively electrically connected to the scan line and the data line, a capacitor, a passivation layer covering the switching device and the capacitor, and a pixel electrode formed on the passivation layer and electrically connected to the drain of the switching device. The source of the switching device is connected to the data line. The passivation layer has a plurality of second openings exposing the contact pads.

摘要翻译： 显示装置包括第一基板，形成在第一基板上的加热层，形成在加热层上的第一开口的绝缘层，至少一个开关装置，形成在绝缘层上的两个接触焊盘，分别电连接到 扫描线和数据线，电容器，覆盖开关器件和电容器的钝化层，以及形成在钝化层上并电连接到开关器件的漏极的像素电极。 开关器件的源极连接到数据线。 钝化层具有暴露接触焊盘的多个第二开口。

公开(公告)号：US08283188B2

公开(公告)日：2012-10-09

申请号：US13220693

申请日：2011-08-30

申请人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

发明人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

IPC分类号： H01L21/00

CPC分类号： H01L33/387 ,  H01L33/382 ,  H01L33/44

摘要： A method for fabricating a light emitting diode chip is provided. Firstly, a semiconductor device layer is formed on a substrate. Afterwards, a current spreading layer is formed on a portion of the semiconductor device layer. Then, a current blocking layer and a passivation layer are formed on a portion of the semiconductor device layer not covered by the current spreading layer. Finally, a first electrode is formed on the current blocking layer and the current spreading layer. Moreover, a second electrode is formed on the semiconductor device layer.

摘要翻译： 提供一种制造发光二极管芯片的方法。 首先，在基板上形成半导体器件层。 之后，在半导体器件层的一部分上形成电流扩散层。 然后，在未被电流扩展层覆盖的半导体器件层的一部分上形成电流阻挡层和钝化层。 最后，在电流阻挡层和电流扩展层上形成第一电极。 此外，在半导体器件层上形成第二电极。

公开(公告)号：US08101440B2

公开(公告)日：2012-01-24

申请号：US13220694

申请日：2011-08-30

申请人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

发明人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

IPC分类号： H01L33/00

CPC分类号： H01L33/387 ,  H01L33/382 ,  H01L33/44

摘要： A method for fabricating a light emitting diode chip is provided. Firstly, a semiconductor device layer is formed on a substrate. Afterwards, a current spreading layer is formed on a portion of the semiconductor device layer. Then, a current blocking layer and a passivation layer are formed on a portion of the semiconductor device layer not covered by the current spreading layer. Finally, a first electrode is formed on the current blocking layer and the current spreading layer. Moreover, a second electrode is formed on the semiconductor device layer.

公开(公告)号：US08043873B2

公开(公告)日：2011-10-25

申请号：US12398165

申请日：2009-03-04

申请人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

发明人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

IPC分类号： H01L33/00

CPC分类号： H01L33/387 ,  H01L33/382 ,  H01L33/44

摘要： A method for fabricating a light emitting diode chip is provided. Firstly, a semiconductor device layer is formed on a substrate. Afterwards, a current spreading layer is formed on a portion of the semiconductor device layer. Then, a current blocking layer and a passivation layer are formed on a portion of the semiconductor device layer not covered by the current spreading layer. Finally, a first electrode is formed on the current blocking layer and the current spreading layer. Moreover, a second electrode is formed on the semiconductor device layer.

摘要翻译： 提供一种制造发光二极管芯片的方法。 首先，在基板上形成半导体器件层。 之后，在半导体器件层的一部分上形成电流扩散层。 然后，在未被电流扩展层覆盖的半导体器件层的一部分上形成电流阻挡层和钝化层。 最后，在电流阻挡层和电流扩展层上形成第一电极。 此外，在半导体器件层上形成第二电极。

公开(公告)号：US20110241064A1

公开(公告)日：2011-10-06

申请号：US13159430

申请日：2011-06-14

申请人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

发明人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

IPC分类号： H01L33/36

CPC分类号： H01L33/145 ,  H01L33/387

摘要： A LED chip including a substrate, a semiconductor device layer, a current blocking layer, a current spread layer, a first electrode and a second electrode is provided. The semiconductor device layer is disposed on the substrate. The current blocking layer is disposed on a part of the semiconductor device layer and includes a current blocking segment and a current distribution adjusting segment. The current spread layer is disposed on a part of the semiconductor device layer and covers the current blocking layer. The first electrode is disposed on the current spread layer, wherein a part of the current blocking segment is overlapped with the first electrode. Contours of the current blocking segment and the first electrode are similar figures. Contour of the first electrode and is within contour of the current blocking segment. The current distribution adjusting segment is not overlapped with the first electrode.

摘要翻译： 提供了包括衬底，半导体器件层，电流阻挡层，电流扩散层，第一电极和第二电极的LED芯片。 半导体器件层设置在基板上。 电流阻挡层设置在半导体器件层的一部分上，并且包括电流阻挡段和电流分布调节段。 电流扩展层设置在半导体器件层的一部分上并覆盖电流阻挡层。 第一电极设置在电流扩展层上，其中电流阻挡段的一部分与第一电极重叠。 当前阻挡段和第一电极的轮廓是相似的图。 第一个电极的等高线并且在当前阻挡段的轮廓内。 电流分布调节段不与第一电极重叠。

公开(公告)号：US20110159623A1

公开(公告)日：2011-06-30

申请号：US13046584

申请日：2011-03-11

申请人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

发明人： Kuo-Lung Fang ,  Chien-Sen Weng ,  Chih-Wei Chao

IPC分类号： H01L33/44

CPC分类号： H01L33/44 ,  H01L33/387 ,  Y10S438/951

摘要： A method for fabricating a light emitting diode chip is provided. In the method, a half-tone mask process, a gray-tone mask process or a multi-tone mask process is applied and combined with a lift-off process to further reduce process steps of the light emitting diode chip. In the present invention, some components may also be simultaneously formed by an identical process to reduce the process steps of the light emitting diode chip. Consequently, the fabricating method of the light emitting diode provided in the present invention reduces the cost and time for the fabrication of the light emitting diode.

公开(公告)号：US07932987B2

公开(公告)日：2011-04-26

申请号：US12748471

申请日：2010-03-29

申请人： Mao-Yi Chang ,  Chia-Tien Peng ,  Chih-Wei Chao ,  Chien-Sen Weng ,  Chao-Shun Liao

发明人： Mao-Yi Chang ,  Chia-Tien Peng ,  Chih-Wei Chao ,  Chien-Sen Weng ,  Chao-Shun Liao

IPC分类号： G02F1/1333 ,  G02F1/1345 ,  G02F1/1343

CPC分类号： G02F1/13452 ,  G02F1/133382

摘要： An LCD includes a first substrate, a heating layer formed on the first substrate, an insulating layer having a first opening formed on the heating layer, at least one switching device, two contact pads formed on the insulating layer, and respectively electrically connected to the scan line and the data line, a capacitor, a bridge electrode formed in the first opening, a passivation layer covering the switching device and the capacitor, a pixel electrode formed on the passivation layer and electrically connected to the drain of the switching device, a second substrate having a common electrode disposed on the first substrate, and a liquid crystal layer. The source of the switching device is connected to the data line. The passivation layer has a plurality of second openings respectively exposing the contact pads and the bridge electrode, wherein the bridge electrode is electrically disconnected from the contact pads.

摘要翻译： LCD包括第一基板，形成在第一基板上的加热层，形成在加热层上的第一开口的绝缘层，至少一个开关装置，形成在绝缘层上的两个接触焊盘，并分别电连接到 扫描线和数据线，电容器，形成在第一开口中的桥电极，覆盖开关器件和电容器的钝化层，形成在钝化层上并电连接到开关器件的漏极的像素电极， 具有设置在第一基板上的公共电极的第二基板和液晶层。 开关器件的源极连接到数据线。 钝化层具有分别暴露接触焊盘和桥接电极的多个第二开口，其中桥接电极与接触焊盘电断开。

公开(公告)号：US07764273B2

公开(公告)日：2010-07-27

申请号：US11020197

申请日：2004-12-27

申请人： Chien-Sen Weng ,  Masataka Itoh

发明人： Chien-Sen Weng ,  Masataka Itoh

IPC分类号： G06F3/041 ,  G06F3/044

CPC分类号： G06F3/047 ,  G06F3/0416 ,  G06K9/0002

摘要： A touch panel includes a TFT array having a plurality of thin film transistors; a plurality of signal lines disposed within the TFT array, each of the signal lines being electrically connected to a respective one of the transistors; a transparent conductive pattern layer disposed above the plurality of signal lines and electrically connected to each of the transistors; a flexible conductive layer; and a spacing pattern layer supporting flexible conductive layer to space the flexible conductive layer apart from the transparent conductive pattern layer. When pressure is applied onto the flexible conductive layer, the flexible conductive layer contacts the transparent conductive pattern layer to transmit an electrical signal via the signal lines into the TFTs to indicate the point of contact.

摘要翻译： 触摸面板包括具有多个薄膜晶体管的TFT阵列; 设置在TFT阵列内的多条信号线，每条信号线电连接到晶体管的相应一个; 透明导电图案层，其设置在所述多个信号线上方并电连接到所述晶体管中的每一个; 柔性导电层; 以及支撑柔性导电层以将柔性导电层与透明导电图案层隔开的间隔图案层。 当压力施加到柔性导电层上时，柔性导电层接触透明导电图案层，以经由信号线将电信号传输到TFT中以指示接触点。