公开(公告)号：US20190054658A1

公开(公告)日：2019-02-21

申请号：US16116132

申请日：2018-08-29

申请人： LatticeGear, LLC

发明人： Gal Moyal

IPC分类号： B28D5/00 ,  B26D5/00 ,  B26F3/00

CPC分类号： B28D5/0011 ,  B26D5/007 ,  B26F3/002 ,  B28D5/0023 ,  B28D5/0052

摘要： A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis perpendicular to the top surface of the sample; providing a breaking pin located under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, a cleaving bar for applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin. Further, the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.

公开(公告)号：US20160163907A1

公开(公告)日：2016-06-09

申请号：US14826129

申请日：2015-08-13

申请人： SolarCity Corporation

发明人： Pablo Gonzalez ,  Bobby Yang

IPC分类号： H01L31/18

CPC分类号： H01L31/18 ,  B28D5/0052 ,  B28D5/0094 ,  B32B38/10 ,  B32B43/006 ,  H01L21/3043 ,  H01L21/683 ,  H01L21/6838 ,  H01L21/68735 ,  H01L21/68778 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1967 ,  Y10T156/1983

摘要： A cleaving system is described. The system can include a holding apparatus to retain a photovoltaic structure at a center section of a cleaving platform. The system can further include a contact apparatus to make contact with the photovoltaic structure and separate it into a plurality of strips. During operation, the system can activate an actuator to move the contact apparatus against the photovoltaic structure, thereby separating the photovoltaic structure into strips.

摘要翻译： 描述劈裂系统。 该系统可以包括保持装置，以将光伏结构保持在劈裂平台的中心部分。 该系统还可以包括与光伏结构接触并将其分离成多个条的接触装置。 在操作期间，系统可以启动致动器以使接触装置抵靠光伏结构移动，从而将光伏结构分离成条带。

公开(公告)号：US08991673B2

公开(公告)日：2015-03-31

申请号：US13293772

申请日：2011-11-10

申请人： Olivier Rayssac ,  Fabrice Letertre

发明人： Olivier Rayssac ,  Fabrice Letertre

IPC分类号： B26F3/00 ,  H01L21/762 ,  B28D5/00 ,  H01L21/20

CPC分类号： H01L21/76254 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0052 ,  B28D5/0064 ,  H01L21/2007 ,  Y10T29/53274 ,  Y10T83/0267 ,  Y10T83/04 ,  Y10T83/364 ,  Y10T156/1059 ,  Y10T156/1184 ,  Y10T156/1189 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1972 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/30 ,  Y10T225/307 ,  Y10T225/35 ,  Y10T225/386

摘要： An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the material so that the cutting mechanism detaches the layer from the source substrate along the weakened zone. The cutting device also includes a control mechanism for adjusting at least two different portions of the assembly during detachment of the layer to facilitate a more precise detachment.

摘要翻译： 描述了用于切割组件的自动切割装置。 组件包括其中具有弱化区的材料，其限定有用层并且附接到源基底。 切割装置包括切割机构和与切割机构可操作地相关联的保持和定位机构。 保持定位机构使材料定位，使得切割机构沿着弱化区域从源基板分离出层。 该切割装置还包括一个控制机构，用于在分离该层期间调节组件的至少两个不同部分，以便于更精确的拆卸。

公开(公告)号：US20120318838A1

公开(公告)日：2012-12-20

申请号：US13580152

申请日：2011-05-24

申请人： Takayoshi Saitoh

发明人： Takayoshi Saitoh

IPC分类号： C03B33/02

CPC分类号： B28D5/0011 ,  B28D5/0052 ,  B65G2249/045 ,  C03B33/033 ,  C03B33/04 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/321

摘要： Provided is a method for cutting a glass sheet whereby even a thin glass sheet having a thickness of 1 mm or less can be suitably cut. A nick (20a) is formed on a section of a planned cutting line (L) of a glass sheet (20). The glass sheet (20) is placed on a surface (10a) of a jig (10) in which an uneven portion (10b) having a shape corresponding to the planned cutting line (L) is formed. The glass sheet (20) is cut by deforming a portion thereof located above the uneven portion (10b) and developing a crack originating from the nick (20a).

摘要翻译： 提供一种用于切割玻璃板的方法，由此即使能够适当地切割厚度为1mm以下的薄玻璃板。 在玻璃板（20）的规划切割线（L）的一部分上形成有切口（20a）。 将玻璃板（20）放置在具有与规划切割线（L）对应的形状的凹凸部（10b）的夹具（10）的表面（10a）上。 玻璃板（20）通过使其位于不平坦部分（10b）上方的部分变形并且形成来自切口（20a）的裂纹来切割。

公开(公告)号：US20090081851A1

公开(公告)日：2009-03-26

申请号：US11667538

申请日：2005-11-10

申请人： Takeshi Sakamoto ,  Ryuji Sugiura

发明人： Takeshi Sakamoto ,  Ryuji Sugiura

IPC分类号： H01L21/304

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052 ,  C03B33/074 ,  C03B33/091

摘要： A laser processing method is provided, which, when cutting an object to be processed comprising a substrate and a multilayer part, formed on a front face of the substrate, including a functional device, can cut the multilayer part with a high precision in particular.In a state where a protective tape 22 is attached to the front face 16a of a multilayer part 16, a substrate 4 is irradiated with laser light L while using its rear face 4b as a laser light entrance surface, so as to form a modified region 7 within the substrate 4 along a line to cut, thereby generating a fracture 24 reaching the front face 4a of the substrate 4 from a front-side end part 7a of the modified region 7. Attaching an expandable tape to the rear face 4b of the substrate 4 and expanding it in the state where such a fracture 24 is generated can cut not only the substrate 4 but also the multilayer part 16 on the line to cut, i.e., interlayer insulating films 17a, 17b, with a favorable precision along the line to cut.

摘要翻译： 提供一种激光加工方法，其可以在包括功能元件的基板的正面上形成的包括基板和多层部的被加工物进行切割时，能够高精度地切割多层部。 在保护带22附着到多层部16的前表面16a的状态下，用激光L照射基板4，同时使用其背面4b作为激光入射面，从而形成改质区域 沿着切割线在衬底4内部，从而从修改区域7的前侧端部7a产生到达衬底4的前表面4a的断裂24.将可膨胀带附接到 在产生这种断裂的状态下使基板4膨胀的状态不仅可以切割基板4而且还可以切割线路上的多层部16即线间绝缘膜17a，17b， 切割。

公开(公告)号：US20090061596A1

公开(公告)日：2009-03-05

申请号：US12197418

申请日：2008-08-25

申请人： Wataru TAKAHASHI ,  Takayoshi MIZUNO

发明人： Wataru TAKAHASHI ,  Takayoshi MIZUNO

IPC分类号： H01L21/304 ,  B24B23/02 ,  B24B1/00

CPC分类号： B28D5/0052 ,  B28D5/0011

摘要： There is provided an expanding tool used for dividing a wafer on an expanding tape by applying a radial tensile force to the expanding tape. The expanding tool includes a dividing frame having a first opening, an outer expanding ring having a contact portion that can be made contact with the dividing frame, the contact portion being provided at an outer periphery side of the outer expanding ring, and having a second opening smaller than the first opening, and an inner expanding ring having an outer shape smaller than the second opening.

摘要翻译： 提供了一种用于通过对扩张带施加径向张力来在扩张带上分割晶片的扩展工具。 膨胀工具包括具有第一开口的分隔框架，具有可与分隔框架接触的接触部分的外部扩张环，接触部分设置在外部扩张环的外周侧，并且具有第二 开口小于第一开口，以及内扩张环，其外形小于第二开口。

公开(公告)号：US07449396B2

公开(公告)日：2008-11-11

申请号：US11047585

申请日：2005-02-02

申请人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

发明人： Masahiro Murata ,  Yusuke Nagai ,  Yukio Morishige ,  Satoshi Kobayashi ,  Naoki Ohmiya

IPC分类号： H01L21/301

CPC分类号： H01L21/6836 ,  B23K26/40 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052 ,  H01L21/78 ,  H01L2221/68327

摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, comprising: a frame holding step for affixing the back surface of the wafer to a dicing tape mounted on an annular frame; a deteriorated layer forming step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines, from the side of the front surface of the wafer held on the frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a picking up step for picking up each chip from the expanded dicing tape.

摘要翻译： 沿着分割线划分具有由在前表面上以格子图案形成的分割线划分的区域中形成的功能元件的晶片的方法，包括：框架保持步骤，用于将晶片的背面固定到切割带 安装在环形框架上; 劣化层形成步骤，用于通过从晶片的前表面侧沿分割线施加能够穿过晶片的脉冲激光束沿晶片内部的分割线形成劣化层; 在框架上举行 分割步骤，通过沿着由保持在框架上的晶片形成劣化层的分割线施加外力，沿着分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及用于从扩展的切割胶带拾取每个芯片的拾取步骤。

公开(公告)号：US20080207094A1

公开(公告)日：2008-08-28

申请号：US11712846

申请日：2007-02-28

申请人： Tao Feng ,  Ming Sun

发明人： Tao Feng ,  Ming Sun

IPC分类号： B24B1/00 ,  B05D1/00 ,  B24B41/06

CPC分类号： B24B7/228 ,  B24B41/06 ,  B28D5/0011 ,  B28D5/0052 ,  H01L24/06 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/06181 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/03 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support structure. An ultra thin wafer or diced wafer is adhered to the tape within the ring for wafer backside processing. The wafer backside processing includes ion implantation, annealing, etching, sputtering and evaporation while the wafer is in the support structure. Alternative uses of the support structure are also disclosed including the fabrication of dies having metalized side walls.

摘要翻译： 公开了一种用于超薄晶片背面处理的方法和装置。 该装置包括保持高温研磨和/或切割胶带以形成支撑结构的外圈。 超薄晶片或切片晶片粘附在环内用于晶片背面处理的带子上。 晶片背面处理包括离子注入，退火，蚀刻，溅射和蒸发，而晶片处于支撑结构中。 还公开了支撑结构的替代用途，包括制造具有金属化侧壁的模具。

公开(公告)号：US07410831B2

公开(公告)日：2008-08-12

申请号：US10555448

申请日：2004-04-30

申请人： Yasuyuki Sakaya ,  Masayuki Azuma

发明人： Yasuyuki Sakaya ,  Masayuki Azuma

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L21/78 ,  H01L21/46 ,  H01L21/301

CPC分类号： H01L21/67132 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052

摘要： In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.

摘要翻译： 在本发明的板状部件分割方法和装置中，通过在由硬脆材料形成的板状部件的表面上形成线状改质区域，或者在 该板状构件沿该改质区域分割板状构件。 分割板状构件的方法包括：带状粘贴步骤，其包括在板状构件的表面上粘贴带，改性区域形成步骤，其包括在板状构件的表面上形成改质区域， 板状构件的内部，以及扩展步骤，其包括在改性区域形成步骤之后通过向其施加张力来拉长带材。 在扩展步骤中，用紫外线照射胶带。 其结果是，可以积极制造具有良好的端面形状的超薄芯片，其中不会发生未切割部分，碎裂和断裂。

公开(公告)号：US20060016443A1

公开(公告)日：2006-01-26

申请号：US11183828

申请日：2005-07-19

申请人： Naoki Ohmiya ,  Yusuke Nagai ,  Masaru Nakamura

发明人： Naoki Ohmiya ,  Yusuke Nagai ,  Masaru Nakamura

IPC分类号： B28D1/02

CPC分类号： B28D5/0052 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0023 ,  Y10T225/325

摘要： A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed on the front surface in a lattice pattern, along the dividing lines, comprising: a tape affixing step for affixing a protective tape to one surface side of the wafer; a holding step for positioning a first suction-holding member and a second suction-holding member on both sides of a dividing line and suction-holding the wafer on the first suction-holding member and the second suction-holding member through the protective tape; and a dividing step for moving the first suction-holding member and the second suction-holding member in a direction for separating them from each other to exert tensile force in a direction perpendicular to the dividing line.