Triple mating configurations of connector
    21.
    发明申请
    Triple mating configurations of connector 有权
    连接器的三重配合配置

    公开(公告)号:US20090111330A1

    公开(公告)日:2009-04-30

    申请号:US12290219

    申请日:2008-10-28

    CPC classification number: H01R12/7023 H01R13/6582 H01R27/00

    Abstract: An electrical connector includes: an insulative housing defining a front mating cavity; a mating tongue extending into the front mating cavity and defining thereon first and second mating faces opposite to each other, said mating tongue dividing said mating cavity into a first mating space confronting the first mating face for mating with a first complementary connector, and a second mating space confronting the second mating face for mutually exclusively mating with second and third complementary connector; a plurality of first type contacts disposed on the first mating face for connecting with the first complementary connector, a plurality of second type contacts disposed on the second mating face for connecting with the second complementary connector, and a plurality of third type contacts located between the first type contacts and the second type contacts with front ends of the third type contacts exposed to the second mating space.

    Abstract translation: 电连接器包括:绝缘壳体,其限定前配合腔; 一个配合的舌片延伸到前配合空腔中并且在其上限定彼此相对的第一和第二配合面,所述配合舌片将所述配合腔分成面对第一配合面的第一配合空间,用于与第一互补连接器配合, 与第二配合面相对的配合空间与第二和第三互补连接器相互独立地配合; 设置在第一配合面上用于与第一互补连接器连接的多个第一类型触点,设置在第二配合面上用于与第二互补连接器连接的多个第二类型触点,以及位于第二互补连接器之间的多个第三类型触点 第一类型接触件和第二类型接触件暴露于第二配合空间的第三类型接触件的前端。

    Leadframe based flip chip semiconductor package and lead frame thereof
    22.
    发明申请
    Leadframe based flip chip semiconductor package and lead frame thereof 审中-公开
    基于引线框的倒装芯片半导体封装及其引线框架

    公开(公告)号:US20080230878A1

    公开(公告)日:2008-09-25

    申请号:US12077489

    申请日:2008-03-19

    Abstract: A flip chip semiconductor package is disclosed according to the present invention, the flip chip semiconductor package comprises a chip that is mounted on and electrically connects to a leadframe via a plurality of solder bumps by means of flip chip, and an encapsulate that encapsulates the chip, the plurality of solder bumps, and the leadframe, wherein, the leadframe further comprises a plurality of leads and a ground plane that is located between the plurality of leads, and also a slit is formed on the ground plane, and then a molding compound that makes up the encapsulant should be capable of filling within the slit, thus to enhance the adhesion between the ground plane and the encapsulant, and then avoid delamination between the ground plane and the encapsulant in subsequent thermal cycle processes, thereby increasing the reliability of fabricated products.

    Abstract translation: 根据本发明公开了一种倒装芯片半导体封装,所述倒装芯片半导体封装包括通过倒装芯片经由多个焊料凸块安装在引线框架上并与其电连接的芯片,以及封装芯片 多个焊料凸块和引线框架,其中引线框还包括多个引线和位于多个引线之间的接地平面,并且在接地平面上形成狭缝,然后形成模塑料 这样构成的密封剂应该能够在狭缝内填充,从而增强接地层与密封剂之间的密合性,然后避免在随后的热循环过程中接地层与密封剂之间的分层,从而提高制造的可靠性 产品。

    Keyboard
    23.
    发明授权
    Keyboard 失效
    键盘

    公开(公告)号:US07126499B2

    公开(公告)日:2006-10-24

    申请号:US10856295

    申请日:2004-05-28

    CPC classification number: G06F3/0202

    Abstract: A keyboard. The keyboard comprises at least one key, a base, a membrane assembly and a circuit board. The membrane assembly is disposed between the base and the key. At least part of the circuit board is disposed in the key. The keyboard is connected to a notebook computer or a personal computer via a connection member.

    Abstract translation: 键盘。 键盘包括至少一个键,基座,膜组件和电路板。 膜组件设置在基座和键之间。 电路板的至少一部分设置在钥匙中。 键盘通过连接构件连接到笔记本电脑或个人计算机。

    USB/ESATA combo receptable featured with ground layer retarding interfaces therebetween
    24.
    发明授权
    USB/ESATA combo receptable featured with ground layer retarding interfaces therebetween 有权
    USB / ESATA组合接口,其间具有接地层延迟接口

    公开(公告)号:US08109795B2

    公开(公告)日:2012-02-07

    申请号:US12763225

    申请日:2010-04-20

    CPC classification number: H01R13/6461

    Abstract: An electrical connector includes an insulative housing defining a mating cavity, two parallel and stacked mating portions respectively forwards extending into the mating cavity, sets of contact retained in the housing and a grounding member retained in the housing. The first mating portion defines thereon a first surface; the second mating portion spaces from the first mating portion and defines thereon a second surface opposite to the first surface. The sets of contact include a first set of contacts each defining a contacting section exposed upon the first surface and a second set of contacts each defining a deflectable cantilevered beam accessible from the second face. The grounding member is disposed between the first and second mating portions to reduce the cross-talk between the first and second sets of contacts.

    Abstract translation: 电连接器包括限定配合腔的绝缘壳体,分别向前延伸到配合空腔中的两个平行和堆叠的配合部分,保持在壳体中的一组触点和保持在壳体中的接地构件。 第一配合部分在其上限定第一表面; 所述第二配合部分与所述第一配合部分间隔开并在其上限定与所述第一表面相对的第二表面。 该组触点包括:第一组触点,每个触点限定暴露在第一表面上的接触部分;以及第二组触头,每个触点限定可从第二面接近的可偏转的悬臂梁。 接地构件设置在第一和第二配合部分之间,以减少第一组和第二组触点之间的串扰。

    Triple mating configurations of connector
    25.
    发明授权
    Triple mating configurations of connector 有权
    连接器的三重配合配置

    公开(公告)号:US07833065B2

    公开(公告)日:2010-11-16

    申请号:US12290219

    申请日:2008-10-28

    CPC classification number: H01R12/7023 H01R13/6582 H01R27/00

    Abstract: An electrical connector includes: an insulative housing defining a front mating cavity; a mating tongue extending into the front mating cavity and defining thereon first and second mating faces opposite to each other, said mating tongue dividing said mating cavity into a first mating space confronting the first mating face for mating with a first complementary connector, and a second mating space confronting the second mating face for mutually exclusively mating with second and third complementary connector; a plurality of first type contacts disposed on the first mating face for connecting with the first complementary connector, a plurality of second type contacts disposed on the second mating face for connecting with the second complementary connector, and a plurality of third type contacts located between the first type contacts and the second type contacts with front ends of the third type contacts exposed to the second mating space.

    Abstract translation: 电连接器包括:绝缘壳体,其限定前配合腔; 一个配合的舌片延伸到前配合空腔中并且在其上限定彼此相对的第一和第二配合面,所述配合舌片将所述配合腔分成面对第一配合面的第一配合空间,用于与第一互补连接器配合, 与第二配合面相对的配合空间与第二和第三互补连接器相互独立地配合; 设置在第一配合面上用于与第一互补连接器连接的多个第一类型触点,设置在第二配合面上用于与第二互补连接器连接的多个第二类型触点,以及位于第二互补连接器之间的多个第三类型触点 第一类型接触件和第二类型接触件暴露于第二配合空间的第三类型接触件的前端。

    ELECTRICAL CONNECTOR INCORPORATED WITH SIGNAL CONTROLLING CIRCUITRY
    26.
    发明申请
    ELECTRICAL CONNECTOR INCORPORATED WITH SIGNAL CONTROLLING CIRCUITRY 有权
    配有信号控制电路的电气连接器

    公开(公告)号:US20100255702A1

    公开(公告)日:2010-10-07

    申请号:US12753314

    申请日:2010-04-02

    Abstract: An electrical connector assembly includes an insulating housing, a plurality of first contacts received in the insulating housing, at least one detecting pin and a controlling circuitry. At least partial first contacts unitarily includes first contacting portions transferring first data signals and second contacting portions transferring second data signals. The detecting pin produces two sets of different detecting signals corresponding to the first data signals and the second data signals. The controlling circuitry controls said data signals output data signals through different output terminals.

    Abstract translation: 电连接器组件包括绝缘壳体,容纳在绝缘壳体中的多个第一触点,至少一个检测引脚和控制电路。 至少部分第一触点一体地包括传送第一数据信号的第一接触部分和传送第二数据信号的第二接触部分。 检测引脚产生对应于第一数据信号和第二数据信号的两组不同的检测信号。 控制电路通过不同的输出端控制所述数据信号的输出数据信号。

    ELECTRICAL CONNECTOR FEATURED USB/ESATA INTERFACES INCORPORATED WITH ADDITIONAL POWER CONTACT
    27.
    发明申请
    ELECTRICAL CONNECTOR FEATURED USB/ESATA INTERFACES INCORPORATED WITH ADDITIONAL POWER CONTACT 有权
    电气连接器特色USB / ESATA接口与其他电源接触

    公开(公告)号:US20100216340A1

    公开(公告)日:2010-08-26

    申请号:US12702293

    申请日:2010-02-09

    Abstract: An electrical connector includes an insulative housing having a mating cavity, a tongue portion extending into the mating cavity and defining thereon first and second faces opposite to each other, and a plurality of contacts retained to the housing. The plurality of contacts defines a first and second set of contacts and expanded contacts. The first set of contacts each defines a first blade contacting section exposed onto the first face, the second set of contacts each defines a deflectable cantilevered beam exposed onto the second face, and the expanded contacts include at least one power contact for power transmission. The at least one power contact defines a second contacting section arranged between two adjacent cantilevered beams and projecting out of the second face.

    Abstract translation: 电连接器包括具有配合腔的绝缘壳体,延伸到配合腔中的舌部并且在其上限定彼此相对的第一和第二面以及保持在壳体上的多个触点。 多个触点限定第一和第二组触点和扩展的触点。 第一组接触件限定暴露在第一面上的第一叶片接触部分,第二组接触件限定暴露在第二面上的可偏转的悬臂梁,并且膨胀的接触件包括用于动力传递的至少一个电力接触件。 所述至少一个动力触头限定布置在两个相邻的悬臂梁之间的第二接触部分并从第二面突出。

    System and Method for Coupling an Integrated Circuit to a Circuit Board
    28.
    发明申请
    System and Method for Coupling an Integrated Circuit to a Circuit Board 有权
    将集成电路耦合到电路板的系统和方法

    公开(公告)号:US20080318454A1

    公开(公告)日:2008-12-25

    申请号:US11766204

    申请日:2007-06-21

    Abstract: An information handling system circuit board has an opening formed through it proximate a coupling point of an integrated circuit to the circuit board. The opening manages stress at the coupling point of the integrated circuit to the circuit board to reduce the risk of damage to the coupling point during deformation of the circuit board, such as when the circuit board is coupled to a chassis or when a component is pressed into the circuit board. In one embodiment, rectangular openings are formed at diagonally opposed corners of a BSA integrated circuit. In alternative embodiments, openings of varying shape, such as slots or curved slots, are formed at selected corners of the integrated circuit.

    Abstract translation: 信息处理系统电路板具有通过其形成的开口,其靠近集成电路到电路板的耦合点。 开口处理集成电路到电路板的耦合点处的应力,以减少在电路板变形期间对耦合点的损坏的风险,例如当电路板耦合到底盘或当部件被按压时 进入电路板。 在一个实施例中,在BSA集成电路的对角相对的角上形成矩形开口。 在替代实施例中,在集成电路的选定角处形成变化形状的开口,例如槽或弯曲槽。

    ELECTRONIC PRODUCT AND TOUCHPAD STRUCTURE THEREOF AND METHOD FOR FORMING THE SAME
    29.
    发明申请
    ELECTRONIC PRODUCT AND TOUCHPAD STRUCTURE THEREOF AND METHOD FOR FORMING THE SAME 审中-公开
    电子产品及其触摸屏结构及其形成方法

    公开(公告)号:US20080185191A1

    公开(公告)日:2008-08-07

    申请号:US12023862

    申请日:2008-01-31

    Applicant: Chih-Nan Lin

    Inventor: Chih-Nan Lin

    CPC classification number: G06F3/044

    Abstract: A touchpad comprises a first insulating layer and a second insulating layer. The first insulating layer has a sensor surface and a plurality of metal sensors disposed on the sensor surface. The second insulating layer has a touch surface and a connecting surface. The connecting surface is opposite to the touch surface and covers the metal sensors. An electronic product comprises a main body and a touchpad. The main body has an exterior. The touchpad is disposed in the main body and exposed to the exterior of the main body. A method for forming a touchpad comprises locating a plurality of metal sensors on a sensor surface of a first insulating layer, and then connecting the first insulating layer and a second insulating layer, with the metal sensors sandwiched between the first insulating layer and the second insulating layer.

    Abstract translation: 触摸板包括第一绝缘层和第二绝缘层。 第一绝缘层具有传感器表面和设置在传感器表面上的多个金属传感器。 第二绝缘层具有触摸表面和连接表面。 连接表面与触摸表面相对并覆盖金属传感器。 电子产品包括主体和触摸板。 主体有外观。 触摸板设置在主体中并暴露于主体的外部。 一种用于形成触摸板的方法包括将多个金属传感器定位在第一绝缘层的传感器表面上,然后连接第一绝缘层和第二绝缘层,金属传感器夹在第一绝缘层和第二绝缘层之间 层。

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