摘要:
A method for producing a hybrid integrated optical circuit which utilizes a molding tool having holding devices for an electrooptic semiconductor component and negative molds for a waveguide trench and holding devices for an optical waveguide. The holding devices of the molding tool adjust the electrooptic semiconductor component with respect to the negative mold of the waveguide trench during reshaping with a polymer. The basic unit produced consists of the electrooptic semiconductor component, which is adjusted with respect to the waveguide trench molded in the polymer. Adjoining the waveguide trench are holding devices, which are molded in the polymer and by means of which an optical waveguide can be coupled to the waveguide trench in a self-adjusting fashion. The basic unit and the optical waveguide are permanently connected to one another with the aid of a cover, the waveguide trench being filled with an optically transparent material, as a result of which a waveguide is formed.
摘要:
A method for making a cover for an integrated optical circuit, a cover for an integrated optical circuit, and an integrated optical circuit made with this cover are proposed. The method serves to minimize the effort and expense in integrating optical components in fiberoptical systems. An optical element 29 is placed in a molding die (10) with adjusting elements (13) that adjust the optical component (29) in its position, and a curable liquid is cast all around the optical component (29), and after it solidifies, this liquid forms the cover (25).
摘要:
In an integrated optical circuit with waveguides applied on a substrate, a layer of high conductivity and a layer of lower index of refraction than the waveguides are arranged between the substrate and the waveguide cores. The circuit permits a favorable coupling of opto-electronic components arranged in the substrate with the waveguides and it can be manufactured by well-known methods.