METHOD FOR FORMING RING PATTERN
    21.
    发明申请
    METHOD FOR FORMING RING PATTERN 有权
    形成环形图案的方法

    公开(公告)号:US20080206684A1

    公开(公告)日:2008-08-28

    申请号:US11742272

    申请日:2007-04-30

    IPC分类号: C23F1/02 G03C5/56

    CPC分类号: H01L21/31144 H01L21/0337

    摘要: A method for forming a ring pattern is disclosed. The ring pattern has a first wall and a second wall. The method includes the following steps: (a) providing a substrate; (b) forming a dielectric layer on the substrate; (c) forming a first patterned photoresist layer on the dielectric layer, the first patterned photoresist layer defining the first wall; (d) etching the dielectric layer to a predetermined depth by using the first patterned photoresist as a mask, and then removing the first patterned photoresist layer; (e) forming a second patterned photoresist layer on the dielectric layer, the second patterned photoresist layer defining the second wall; (f) etching the dielectric layer by using the second patterned photoresist layer as a mask so as to form the ring pattern having the first wall and the second wall.

    摘要翻译: 公开了一种形成环形图案的方法。 环形图案具有第一壁和第二壁。 该方法包括以下步骤:(a)提供衬底; (b)在基板上形成电介质层; (c)在所述电介质层上形成第一图案化光致抗蚀剂层,所述第一图案化光刻胶层限定所述第一壁; (d)通过使用第一图案化的光致抗蚀剂作为掩模将电介质层蚀刻到预定的深度,然后去除第一图案化的光致抗蚀剂层; (e)在所述电介质层上形成第二图案化光致抗蚀剂层,所述第二图案化光致抗蚀剂层限定所述第二壁; (f)通过使用第二图案化光致抗蚀剂层作为掩模蚀刻介电层,以便形成具有第一壁和第二壁的环形图案。