摘要:
A maintenance method for an ink jet imaging device comprises ejecting drops from a plurality of ink jets to successively form a plurality of images on the image receiver. Inter-image intervals between the ejection of drops to form one image in the plurality of images and the ejection of drops to form a successive image in the plurality of images are detected. A plurality of drops is ejected from at least a portion of the ink jets in the plurality of ink jets during at least one detected inter-image interval. The plurality of ejected drops having at least one drop ejecting characteristic selected from: a drop mass for the plurality of drops being greater than a standard drop mass; a drop ejecting frequency for the plurality of drops being lower than a standard drop ejecting frequency; and a substantially sequential drop ejecting pattern for the plurality of drops.
摘要:
A method and apparatus for forming a high resolution LED array. A plurality of LED chips are provided to form the LED array. Each LED chip has an electrode that is inward biased at each end of the chip by a predetermined amount. The size of each LED chip is removed by reducing, at each end of each chip, an amount of chip material substantially equal to the predetermined amount. The array is formed by placing each chip end to end with a gap between each chip, wherein the gap is suitably large for placement accuracies and a consistent pitch of 21.2 &mgr;m is maintained between each LED on each chip.
摘要:
A method for forming a printhead including one or more channels. The method can include depositing and selectively sintering a first layer of powder into a sintered layer that forms a first discrete cross-sectional region of a printhead structure for the printhead. A plurality of layers of powder can be sequentially deposited and selectively sintered into a plurality of sintered layers that form discrete cross-sectional regions of the printhead structure and form at least a portion of at least one or more channels. Each of the plurality of layers of powder is deposited directly onto at least one sintered layer. Each of the plurality of sintered layers is integrally bonded to at least one other sintered layer.
摘要:
A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
摘要:
A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.
摘要:
A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, and forming a plurality of patterned conductive traces on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.
摘要:
A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.
摘要:
A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.
摘要:
A printing medium baffle for protecting printheads printing on an image transfer member from particulates associated with the printing medium. The baffle may have one or more adhesive surfaces.
摘要:
A full width read and/or write assemblies, such as a full width thermal ink jet printbar, is disclosed, having materials with both a high thermal coefficient of expansion and a low thermal coefficient of expansion. A suitable adhesive which provides lateral give while firmly holding the respective components together provides dimensional stability to the printbar element having a low thermal coefficient of expansion when components having high thermal coefficient of expansion are assembled thereto. The flexible or floating mounting enabled by lateral give of the adhesive allows for the application of cost effective materials with a high thermal coefficient of expansion to be used for support functions such as, for example, circuit boards and ink manifolds. The flexible or floating mounting relieves shear stress cased by a differential in the expansion or contraction of materials having a different thermal coefficient of expansion. Since the thermal expansion of the various components expand and contract from a center location thereof, this center location is bonded by an adhesive which does not provide lateral give, so that alignment between parts are maintained while the remainder of the respective components float relative to each other and prevent thermally induced stresses which tend to cause warpage.