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公开(公告)号：US08931879B2
公开(公告)日：2015-01-13
申请号：US13401061
申请日：2012-02-21
申请人： Peter J Nystrom , Mark A. Cellura , Bijoyraj Sahu
发明人： Peter J Nystrom , Mark A. Cellura , Bijoyraj Sahu
IPC分类号： B41J2/015
CPC分类号： B41J2/161 , B41J2/1634 , B41J2002/14403 , Y10T29/49401
摘要： A method for assembling a printhead such as an ink jet printhead can include the use of a laser to bond two or more printhead layers together. In an embodiment, a laser beam is directed through a transparent layer to an energy-absorbing layer, where the energy-absorbing layer is melted such that after removal of the laser beam the melted layer solidifies to adhere the energy-absorbing layer to the transparent layer. In another embodiment, heating the energy-absorbing layer melts the transparent layer to adhere the energy-absorbing layer to the transparent layer after removal of the laser beam. The laser transmission lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
摘要翻译： 用于组装诸如喷墨打印头的打印头的方法可以包括使用激光将两个或更多个打印头层粘合在一起。 在一个实施例中，激光束被引导通过透明层到能量吸收层，其中能量吸收层被熔化，使得在去除激光束之后，熔融层固化以将能量吸收层粘附到透明 层。 在另一个实施例中，加热能量吸收层使透明层熔化，从而在除去激光束之后将能量吸收层粘附到透明层。 所描述的激光透射层压方法可以产生流体密封，其在基于粘合剂的工艺上需要较少的处理时间和材料。
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公开(公告)号：US08919915B2
公开(公告)日：2014-12-30
申请号：US13401178
申请日：2012-02-21
申请人： Peter J. Nystrom , Mark A. Cellura , Bijoyraj Sahu
发明人： Peter J. Nystrom , Mark A. Cellura , Bijoyraj Sahu
IPC分类号： B41J2/01
CPC分类号： B41J2/1621 , B32B27/34 , B32B2310/028 , B41J2/161 , B41J2002/14403
摘要： A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
摘要翻译： 用于组装诸如喷墨打印头的打印头的方法可以包括使用超声波接合工艺将两个或更多个打印头层粘合在一起。 在一个实施例中，超声波频率被引导到第一层和第二层之间的界面，以在界面处产生热量。 在一个实施例中，热量熔化第一层和第二层中的至少一层，并且将层冷却以固化熔融层。 在另一个实施例中，使用超声频率产生的热量固化在第一层和第二层之间的粘合剂层。 所描述的超声波层压方法可以产生流体密封，其在基于粘合剂的方法上需要较少的处理时间和材料。
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公开(公告)号：US20130215186A1
公开(公告)日：2013-08-22
申请号：US13401178
申请日：2012-02-21
申请人： Peter J. Nystrom , Mark A. Cellura , Bijoyraj Sahu
发明人： Peter J. Nystrom , Mark A. Cellura , Bijoyraj Sahu
CPC分类号： B41J2/1621 , B32B27/34 , B32B2310/028 , B41J2/161 , B41J2002/14403
摘要： A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
摘要翻译： 用于组装诸如喷墨打印头的打印头的方法可以包括使用超声波接合工艺将两个或更多个打印头层粘合在一起。 在一个实施例中，超声波频率被引导到第一层和第二层之间的界面，以在界面处产生热量。 在一个实施例中，热量熔化第一层和第二层中的至少一个，并且将层冷却以固化熔融层。 在另一个实施例中，使用超声频率产生的热量固化在第一层和第二层之间的粘合剂层。 所描述的超声波层压方法可以产生流体密封，其在基于粘合剂的方法上需要较少的处理时间和材料。
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公开(公告)号：US20130215185A1
公开(公告)日：2013-08-22
申请号：US13401061
申请日：2012-02-21
申请人： Peter J. Nystrom , Mark A. Cellura , Bijoyraj Sahu
发明人： Peter J. Nystrom , Mark A. Cellura , Bijoyraj Sahu
CPC分类号： B41J2/161 , B41J2/1634 , B41J2002/14403 , Y10T29/49401
摘要： A method for assembling a printhead such as an ink jet printhead can include the use of a laser to bond two or more printhead layers together. In an embodiment, a laser beam is directed through a transparent layer to an energy-absorbing layer, where the energy-absorbing layer is melted such that after removal of the laser beam the melted layer solidifies to adhere the energy-absorbing layer to the transparent layer. In another embodiment, heating the energy-absorbing layer melts the transparent layer to adhere the energy-absorbing layer to the transparent layer after removal of the laser beam. The laser transmission lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
摘要翻译： 用于组装诸如喷墨打印头的打印头的方法可以包括使用激光将两个或更多个打印头层粘合在一起。 在一个实施例中，激光束被引导通过透明层到能量吸收层，其中能量吸收层被熔化，使得在去除激光束之后，熔融层固化以将能量吸收层粘附到透明 层。 在另一个实施例中，加热能量吸收层使透明层熔化，从而在除去激光束之后将能量吸收层粘附到透明层。 所描述的激光透射层压方法可以产生流体密封，其在基于粘合剂的工艺上需要较少的处理时间和材料。
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公开(公告)号：US08727508B2
公开(公告)日：2014-05-20
申请号：US13293235
申请日：2011-11-10
申请人： Peter J Nystrom , Bijoyraj Sahu
发明人： Peter J Nystrom , Bijoyraj Sahu
CPC分类号： B41J2/1629 , B41J2/161 , B41J2/1631 , B41J2/1642 , B41J2/1646 , B41J2002/14241
摘要： A print head including a jet stack can be formed using semiconductor device manufacturing techniques. A blanket metal layer, a blanket piezoelectric element layer, and a blanket conductive layer can be formed over a semiconductor substrate such as a semiconductor wafer or wafer section. The piezoelectric element layer and the blanket conductive layer can be patterned to provide a plurality of transducer piezoelectric elements and top electrodes respectively, while the metal layer forms a bottom electrode for the plurality of transducers. Subsequently, the semiconductor substrate can be patterned to form a body plate for the print head jet stack. Forming a print head jet stack using semiconductor device manufacturing techniques can provide a high resolution device with small feature sizes.
摘要翻译： 可以使用半导体器件制造技术形成包括喷射堆叠的打印头。 可以在诸如半导体晶片或晶片部分的半导体衬底上形成覆盖金属层，覆盖层压电元件层和覆盖层导电层。 压电元件层和覆盖层导电层可以被图案化以分别提供多个换能器压电元件和顶电极，而金属层形成用于多个换能器的底电极。 随后，可以对半导体衬底进行图案化以形成用于打印头喷射叠层的主体板。 使用半导体器件制造技术形成打印头喷射堆叠可以提供具有小特征尺寸的高分辨率设备。
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公开(公告)号：US20130120505A1
公开(公告)日：2013-05-16
申请号：US13293235
申请日：2011-11-10
申请人： Peter J. Nystrom , Bijoyraj Sahu
发明人： Peter J. Nystrom , Bijoyraj Sahu
IPC分类号： B41J2/045 , H01L21/306
CPC分类号： B41J2/1629 , B41J2/161 , B41J2/1631 , B41J2/1642 , B41J2/1646 , B41J2002/14241
摘要： A print head including a jet stack can be formed using semiconductor device manufacturing techniques. A blanket metal layer, a blanket piezoelectric element layer, and a blanket conductive layer can be formed over a semiconductor substrate such as a semiconductor wafer or wafer section. The piezoelectric element layer and the blanket conductive layer can be patterned to provide a plurality of transducer piezoelectric elements and top electrodes respectively, while the metal layer forms a bottom electrode for the plurality of transducers. Subsequently, the semiconductor substrate can be patterned to form a body plate for the print head jet stack. Forming a print head jet stack using semiconductor device manufacturing techniques can provide a high resolution device with small feature sizes.
摘要翻译： 可以使用半导体器件制造技术形成包括喷射堆叠的打印头。 可以在诸如半导体晶片或晶片部分的半导体衬底上形成覆盖金属层，覆盖层压电元件层和覆盖层导电层。 压电元件层和覆盖层导电层可以被图案化以分别提供多个换能器压电元件和顶电极，而金属层形成用于多个换能器的底电极。 随后，可以对半导体衬底进行图案化以形成用于打印头喷射叠层的主体板。 使用半导体器件制造技术形成打印头喷射堆叠可以提供具有小特征尺寸的高分辨率设备。
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公开(公告)号：US20210321526A1
公开(公告)日：2021-10-14
申请号：US17359342
申请日：2021-06-25
申请人： Devdatta Prakash Kulkarni , Maria De La Luz Belmont Velazquez , Andres Ramirez Macias , Sandeep Ahuja , Tejas Shah , Bijoyraj Sahu
发明人： Devdatta Prakash Kulkarni , Maria De La Luz Belmont Velazquez , Andres Ramirez Macias , Sandeep Ahuja , Tejas Shah , Bijoyraj Sahu
摘要： Techniques for liquid cooling systems are disclosed. In one embodiment, a hermetically sealed container includes an integrated circuit component and a two-phase coolant. As the integrated circuit component generates heat, the coolant boils, rising to a lid of the container. A cold plate mated with the lid absorbs heat from the lid, causing condensation of the coolant on the underside of the lid. The coolant then drips back down towards the integrated circuit component. Other embodiments are disclosed.
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公开(公告)号：US20190306985A1
公开(公告)日：2019-10-03
申请号：US15942263
申请日：2018-03-30
申请人： Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
发明人： Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
摘要： A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.
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公开(公告)号：US20210108860A1
公开(公告)日：2021-04-15
申请号：US17130906
申请日：2020-12-22
摘要： A variable conductance heat pipe (VCHP) is utilized as a “passive heat switch” to regulate a characteristic temperature of an integrated circuit component. The VCHP is located between an integrated circuit component and a cold plate and comprises a working fluid and a non-condensable gas in a chamber. When the component is not operational, the VCHP blocks the flow of heat from the component to the cold plate. As component power consumption increases, the working fluid pressure increases and compresses the non-condensable gas toward the cooler region of the cold plate to eventually create a low thermal resistance path between the component and the cold plate. By introducing negative feedback into the thermal management solution, the VCHP keeps the characteristic temperature within a narrow range. This can alleviate stress on package components (e.g., solder joints) due to excessive thermal cycling, which can extend the lifetime of the component.
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