公开(公告)号：US20070042679A1

公开(公告)日：2007-02-22

申请号：US10558257

申请日：2004-05-19

申请人： Kazuto Hirokawa ,  Yoichi Kobayashi ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yasuo Tsukuda

发明人： Kazuto Hirokawa ,  Yoichi Kobayashi ,  Shunsuke Nakai ,  Shinrou Ohta ,  Yasuo Tsukuda

IPC分类号： B24B49/00 ,  B24B29/00

CPC分类号： B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24B49/12 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/3212

摘要： A substrate polishing apparatus (10) polishes a substrate (20) to a flat mirror finish. The substrate polishing apparatus (10) has a polishing table (12) against which a substrate (20) is pressed, a light-emitting and light-receiving device (24) to emit measurement light from the polishing table (12) to the substrate (20) and to receive reflected light from the substrate (20) for measuring a film on the substrate (20), a fluid supply passage (42) for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber (68) provided at a light-emitting and light-receiving position of the polishing table (12), and a fluid supply control device (56, 58) for controlling supply of the measurement fluid to the fluid chamber (68).

摘要翻译： 基板研磨装置（10）将基板（20）抛光成平面镜面。 基板研磨装置（10）具有：被加压基板（20）的研磨台（12），从研磨台（12）向基板发射测定光的发光和受光装置（24） （20）接收来自基板（20）的反射光，用于测量基板（20）上的薄膜;流体供给通道（42），用于将测量光和反射光通过的测量流体通过， 设置在所述研磨台（12）的发光和受光位置处的流体室（68）和用于控制向所述流体室（68）供给所述测量流体的流体供应控制装置（56,​​58） 。