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21.发明申请INTEGRATING OPTOELECTRONIC COMPONENTS INTO A MOLDED COMMUNICATIONS MODULE HAVING INTEGRATED PLASTIC CIRCUIT STRUCTURES 有权将光电组件集成到具有集成塑料电路结构的模制通信模块中公开(公告)号：US20080145060A1
公开(公告)日：2008-06-19
申请号：US11958068
申请日：2007-12-17
CPC分类号： G02B6/4201 , G02B6/423 , G02B6/4246 , G02B6/4255 , G02B6/4274
摘要： Integrated optical subassemblies (OSA) such as integrated transmit and receive optical subassemblies that may be implemented with an optical transceiver module that includes a molded body. The integrated OSA includes a mounting surface defined on a vertical portion of the molded body, a wall extending about the mounting surface, at least one optoelectronic device, such as a laser diode or a photodiode mounted on a transimpendence amplifier, positioned on the mounting surface, a plurality of bond pads included on the mounting surface in electrical connection with the at least one optoelectronic device, a plurality of conductive feedthroughs defined through the mounting surface, each feedthrough being in electrical communication with a corresponding one of the bond pads; and an optical fiber port that engages the wall extending about the mounting surface, wherein the optical fiber port is configured for receiving an optical fiber cable.
摘要翻译： 集成光学子组件（OSA），例如集成的发射和接收光学子组件，其可以由包括模制体的光学收发器模块来实现。 集成的OSA包括限定在成型体的垂直部分上的安装表面，围绕安装表面延伸的壁，至少一个位于安装表面上的光电子器件，例如安装在经周期放大器上的激光二极管或光电二极管 包括在所述安装表面上的与所述至少一个光电子器件电连接的多个接合焊盘，通过所述安装表面限定的多个导电馈通，每个馈通与相应的一个接合焊盘电连通; 以及与围绕安装面延伸的壁接合的光纤端口，其中，所述光纤端口被配置为接收光纤电缆。
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