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公开(公告)号:US06469386B1
公开(公告)日:2002-10-22
申请号:US09492402
申请日:2000-01-27
申请人: Kyu-han Lee , Sang-hun Lee , Sung-il Kang , Se-chul Park
发明人: Kyu-han Lee , Sang-hun Lee , Sung-il Kang , Se-chul Park
IPC分类号: H01L2348
CPC分类号: C23C28/021 , C23C28/023 , C23C28/027 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48664 , H01L2224/49171 , H01L2224/85464 , H01L2924/00014 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/2075
摘要: A lead frame for a semiconductor package and a method for manufacturing the lead frame. In the manufacture of the lead frame, a protective layer is formed with nickel (Ni) or Ni alloy on a metal substrate, an intermediate layer is then formed with palladium (Pd) or Pd alloy on the protective layer. Then, Pd and gold (Au) are alternately plated on the surface of the intermediate layer to form an outermost layer including both Pd and Au particles thereon.
摘要翻译: 用于半导体封装的引线框架和用于制造引线框架的方法。 在引线框架的制造中,在金属基板上用镍(Ni)或Ni合金形成保护层,然后在保护层上用钯(Pd)或Pd合金形成中间层。 然后,将Pd和金(Au)交替地电镀在中间层的表面上,以形成其上包括Pd和Au颗粒的最外层。