公开(公告)号：US20110018952A1

公开(公告)日：2011-01-27

申请号：US12797980

申请日：2010-06-10

Applicant: Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J25/304 ,  B32B38/10 ,  G01D15/10

CPC classification number: B41J2/3359 ,  Y10T29/49083

Abstract: There are provided a method of manufacturing a thermal head having a hollow portion at a position opposing a heating resistor, the manufacturing method assuring a sufficient strength to an upper plate substrate of the thermal head. The manufacturing method includes: processing a top surface of the upper plate substrate bonded to a support substrate to thin the upper plate substrate to a thickness T; wherein the processing comprises processing the top surface of the upper plate substrate so that a roughness Ra of the top surface of the upper plate substrate satisfies the following expression:: Ra≦loge(T2)/(3×106)+6.5×10−6.

Abstract translation: 提供了一种在与加热电阻器相对的位置处制造具有中空部分的热敏头的方法，该制造方法确保了对热敏头的上板基板具有足够的强度。 该制造方法包括：处理结合到支撑基板上的上板基板的上表面，将上板基板薄化成厚度T; 其特征在于，所述处理包括对所述上板基板的上表面进行处理，使得所述上板基板的上表面的粗糙度Ra满足下式：Ra＆nlE; loge（T2）/（3×106）+ 6.5×10- 6。

公开(公告)号：US07852361B2

公开(公告)日：2010-12-14

申请号：US12286873

申请日：2008-10-02

Applicant: Noriyoshi Shoji ,  Toshimitsu Morooka ,  Norimitsu Sanbongi ,  Yoshinori Sato ,  Keitaro Koroishi

Inventor： Noriyoshi Shoji ,  Toshimitsu Morooka ,  Norimitsu Sanbongi ,  Yoshinori Sato ,  Keitaro Koroishi

IPC: B41J2/335

CPC classification number: B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3355 ,  B41J2/33585

Abstract: Provided is a heating resistance element component, including: a supporting substrate; an insulating film laminated on the supporting substrate; a plurality of heating resistors formed on the insulating film, the plurality of heating resistors being arranged in a zigzag shape along a main scanning direction and having a substantially square shape; a common wire connected to one end of each of the plurality of heating resistors; individual wires each connected to another end of the each of the plurality of heating resistors; and concave portions formed in regions which are opposed to the plurality of heating resistors and are located on a surface of the supporting substrate, in which an arrangement pitch of the plurality of heating resistors in a sub-scanning direction is larger than an arrangement pitch of the plurality of heating resistors in a main scanning direction.

Abstract translation: 提供一种耐热元件部件，包括：支撑基板; 层叠在所述支撑基板上的绝缘膜; 形成在所述绝缘膜上的多个加热电阻体，所述多个加热电阻体沿着主扫描方向以锯齿形状排列并具有大致正方形的形状; 连接到所述多个加热电阻器中的每一个的一端的公共线; 各个电线各自连接到多个加热电阻器中的每一个的另一端; 以及凹部，形成在与所述多个加热电阻体相对的并且位于所述支撑基板的表面上的区域中，所述多个加热电阻器在副扫描方向上的排列间距大于所述支撑基板的排列间距 多个加热电阻器在主扫描方向上。

公开(公告)号：US07768541B2

公开(公告)日：2010-08-03

申请号：US12254504

申请日：2008-10-20

Applicant: Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Yoshinori Sato ,  Norimitsu Sanbongi

Inventor： Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Yoshinori Sato ,  Norimitsu Sanbongi

IPC: B41J2/335

CPC classification number: H05B3/283 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/3355 ,  B41J2/3358 ,  B41J2/33585 ,  B41J2/3359 ,  G03G15/2053 ,  H05B3/0095

Abstract: Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.

Abstract translation: 本发明提供一种加热电阻元件，包括：包括玻璃材料的绝缘基板; 通过加热至从绝缘基板的表面附着的退火点到软化点的温度而与绝缘基板结合的蓄热层，并且包含与绝缘基板的玻璃材料相同的材料; 以及加热电阻器，其设置在所述蓄热层上，在所述绝缘基板和所述蓄热层中的至少一个接合面上，所述绝缘基板和所述蓄热层中的至少一个在所述蓄热层中设置有凹部 与加热电阻器相对的区域以形成中空部分。 因此，抑制由热膨胀系数差引起的变形，提高印刷品质。

公开(公告)号：US20100071414A1

公开(公告)日：2010-03-25

申请号：US12460780

申请日：2009-07-24

Applicant: Toshimitsu Morooka ,  Keitaro Koroishi ,  Yoshinori Sato ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Toshimitsu Morooka ,  Keitaro Koroishi ,  Yoshinori Sato ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: C03B19/00

CPC classification number: B41J2/33535 ,  B41J2/33585 ,  B41J2/3359

Abstract: Provided is a manufacturing method for a thermal head, which includes: a concave portion forming step of forming a plurality of concave portions on a surface of a collective substrate; a bonding step of thermally fusion bonding an insulating film to the surface of the collective substrate including the plurality of concave portions formed thereon in the concave portion forming step; and a heating resistor forming step of forming a plurality of heating resistors on the insulating film so as to be opposed to the plurality of concave portions, in which the concave portion forming step includes setting any one of the plurality of concave portions as a reference, and setting sizes of the plurality of concave portions other than the any one of the plurality of concave portions so as to become larger as a distance from the any one thereof increases.

Abstract translation: 本发明提供一种热敏头的制造方法，其特征在于，包括：在集合基板的表面上形成多个凹部的凹部形成工序; 在所述凹部形成工序中，使绝缘膜与包含形成在其上的所述多个凹部的所述集合基板的表面热熔融接合的接合工序; 以及加热电阻器形成步骤，在所述绝缘膜上形成多个加热电阻器，以与所述多个凹部相对，所述凹部形成步骤包括将所述多个凹部中的任一个设定为基准， 以及多个凹部中的任何一个以外的多个凹部的设定尺寸随着距离其中任一个的距离而变大。

公开(公告)号：US20090231408A1

公开(公告)日：2009-09-17

申请号：US12381702

申请日：2009-03-16

Applicant: Noriyoshi Shoji ,  Norimitsu Sanbongi ,  Yoshinori Sato ,  Toshimitsu Morooka ,  Keitaro Koroishi

Inventor： Noriyoshi Shoji ,  Norimitsu Sanbongi ,  Yoshinori Sato ,  Toshimitsu Morooka ,  Keitaro Koroishi

IPC: B41J2/345 ,  H05B3/03

CPC classification number: B41J2/33525 ,  B41J2/33535 ,  B41J2/3357 ,  B41J2/33585 ,  B41J2/3359 ,  Y10T29/49083

Abstract: To reduce a plate thickness of an insulating film, a heating resistor element component is provided, which includes: a supporting substrate; an insulating film disposed on a surface of the supporting substrate; a plurality of heating resistors arranged at intervals on the insulating film; a common wire connected to one end of each of the plurality of heating resistors; and individual wires each connected to another end of each of the plurality of heating resistors, in which: the surface of the supporting substrate is provided with a concave portion in a region thereof, the region being opposed to heating portions of the plurality of heating resistors; and when the insulating film is superimposed on the supporting substrate, the insulating film includes a heterogeneous phase formed through irradiation of a phemtosecond laser at least in a region thereof, the region being opposed to the concave portion.

Abstract translation: 为了减小绝缘膜的板厚，提供了一种加热电阻器元件，其包括：支撑基板; 设置在所述支撑基板的表面上的绝缘膜; 绝缘膜间隔布置的多个加热电阻体; 连接到所述多个加热电阻器中的每一个的一端的公共线; 以及各自连接到所述多个加热电阻器的每一个的另一端的单独的线，其中：所述支撑基板的表面在其区域中设置有凹部，所述区域与所述多个加热电阻器的加热部分相对 ; 并且当所述绝缘膜重叠在所述支撑基板上时，所述绝缘膜包括至少在其区域中通过照射所述像形激光而形成的非均相，所述区域与所述凹部相对。

公开(公告)号：US20090102912A1

公开(公告)日：2009-04-23

申请号：US12254570

申请日：2008-10-20

Applicant: Keitaro KOROISHI ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Yoshinori Sato ,  Norimitsu Sanbongi

Inventor： Keitaro KOROISHI ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Yoshinori Sato ,  Norimitsu Sanbongi

IPC: B41J2/335

CPC classification number: H05B3/16 ,  B41J2/3357 ,  B41J2/33585 ,  Y10T29/49083

Abstract: Provided is a heating resistor element, including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces between the heating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the concave portion (16) has a curvature radius of 10 μm or more at each corner thereof. Accordingly, occurrence of stress concentration caused by heat or a load can be suppressed to improve durability, and both a sufficient strength and heating efficiency are realized.

Abstract translation: 提供一种加热电阻元件，包括：绝缘基板（9）; 与绝缘基板（9）的表面接合的蓄热层（10）; 以及设置在所述蓄热层（10）上的加热电阻器（11），其中：在所述加热基板（9）和所述蓄热层（10）的至少一个接合面上，所述绝缘基板 （9）和蓄热层（10）在与发热电阻体（11）相对的区域设有凹部（16），形成中空部（17）。 并且所述凹部（16）的每个角部的曲率半径为10μm以上。 因此，能够抑制由热或负荷引起的应力集中的发生，提高耐久性，并且能够实现充分的强度和加热效率。

公开(公告)号：US20090102911A1

公开(公告)日：2009-04-23

申请号：US12254504

申请日：2008-10-20

Applicant: Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Yoshinori Sato ,  Norimitsu Sanbongi

Inventor： Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Yoshinori Sato ,  Norimitsu Sanbongi

IPC: B41J2/335

CPC classification number: H05B3/283 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/3355 ,  B41J2/3358 ,  B41J2/33585 ,  B41J2/3359 ,  G03G15/2053 ,  H05B3/0095

Abstract: Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.

Abstract translation: 本发明提供一种加热电阻元件，包括：包括玻璃材料的绝缘基板; 通过加热至从绝缘基板的表面附着的退火点到软化点的温度而与绝缘基板结合的蓄热层，并且包含与绝缘基板的玻璃材料相同的材料; 以及加热电阻器，其设置在所述蓄热层上，在所述绝缘基板和所述蓄热层中的至少一个接合面上，所述绝缘基板和所述蓄热层中的至少一个在所述蓄热层中设置有凹部 与加热电阻器相对的区域以形成中空部分。 因此，抑制由热膨胀系数差引起的变形，提高印刷品质。

公开(公告)号：US08850691B2

公开(公告)日：2014-10-07

申请号：US13397900

申请日：2012-02-16

Applicant: Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Yoshinori Sato ,  Norimitsu Sanbongi

Inventor： Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Yoshinori Sato ,  Norimitsu Sanbongi

IPC: H05B3/00 ,  H05B3/16 ,  B41J2/335

CPC classification number: H05B3/16 ,  B41J2/3357 ,  B41J2/33585 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/49826

Abstract: A manufacturing method for a heating resistor element includes a concave portion forming step, a bonding step and a resistor forming step. The concave portion forming step includes forming a concave portion on at least one of bonded surfaces between an insulating substrate and a heat accumulating layer. The bonding step causes the bonded surfaces between the insulating substrate and the heat accumulating layer to adhere to each other to bond the insulating substrate and the heat accumulating layer. The resistor forming step includes forming a heating resistor at a position on the heat accumulating layer. The position is opposed to the concave portion. The concave portion forming step further includes processing an inner surface of the concave portion on a side of the insulating substrate to have surface roughness Ra of 0.2 μm or more.

Abstract translation: 一种加热电阻元件的制造方法包括凹部形成步骤，接合步骤和电阻器形成步骤。 凹部形成工序包括在绝缘基板和蓄热层的至少一个接合面上形成凹部。 接合步骤使得绝缘基板和蓄热层之间的接合表面彼此粘附以将绝缘基板和蓄热层结合。 电阻器形成步骤包括在蓄热层的位置形成发热电阻体。 位置与凹部相对。 所述凹部形成工序还包括对所述绝缘基板侧的所述凹部的内表面进行处理，使表面粗糙度Ra为0.2μm以上。

公开(公告)号：US08629892B2

公开(公告)日：2014-01-14

申请号：US13401894

申请日：2012-02-22

Applicant: Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J2/335

CPC classification number: B41J2/33585

Abstract: A thermal printer has a support substrate with a concave portion in a surface thereof, and an upper substrate bonded to the surface of the support substrate and including a convex portion at a position corresponding to the concave portion. A heating resistor is provided on a surface of the upper substrate at a position straddling the convex portion. A pair of electrodes is provided on both sides of the heating resistor, with each of the electrodes being formed in a region outside of the convex portion. The convex portion extends at a height greater than each of the electrodes. At least one of the pair of electrodes has a thin portion connected to the heating resistor in a region corresponding to the concave portion, and a thick portion connected to the heating resistor and having a thickness greater than that of the thin portion.

Abstract translation: 热敏打印机具有在其表面上具有凹部的支撑基板，以及粘合到支撑基板的表面的上基板，并且在与凹部对应的位置处包括凸部。 在上部基板的与凸部对置的位置的表面设置有加热电阻体。 在加热电阻器的两侧设置一对电极，每个电极形成在凸部外侧的区域。 凸部以比每个电极高的高度延伸。 所述一对电极中的至少一个在与所述凹部对应的区域中具有连接到所述加热电阻器的薄部分，以及连接到所述加热电阻器并且具有大于所述薄部分的厚度的厚度部分。

公开(公告)号：US08368733B2

公开(公告)日：2013-02-05

申请号：US12928260

申请日：2010-12-07

Applicant: Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J2/335

CPC classification number: B41J2/33545 ,  B41J2/33585

Abstract: A thermal head includes a substrate main body including a flat plate-shaped support substrate and a flat plate-shaped upper substrate which are bonded to each other in a stacked state. A rectangular heating resistor is formed on a surface of the flat plate-shaped upper substrate. A bonding surface of the flat plate-shaped support substrate includes a concave portion that forms a cavity portion in a region opposed to the rectangular heating resistor and the concave portion includes a groove formed in an inner wall thereof and recessed along a depth direction of the concave portion within a range of a width of the rectangular heating resistor. The thermal head is capable of enhancing heat-insulating performance while maintaining mechanical strength of the upper substrate.

Abstract translation: 热敏头包括基板主体，其包括以叠层状态彼此接合的平板状支撑基板和平板状上基板。 在平板状的上基板的表面上形成矩形的加热电阻体。 平板状支撑基板的接合面包括在与矩形加热电阻体相对的区域中形成空腔部的凹部，凹部具有形成在其内壁中的凹槽，沿着该方向的深度方向凹陷 在矩形发热电阻体的宽度范围内的凹部。 热头能够在保持上基板的机械强度的同时提高绝热性能。