公开(公告)号：US20140131850A1

公开(公告)日：2014-05-15

申请号：US13673124

申请日：2012-11-09

Applicant: ANALOG DEVICES, INC.

Inventor： Li Chen ,  Thomas Kieran Nunan ,  Kuang L. Yang

IPC: B81B7/00 ,  B81C3/00

CPC classification number: B81C3/001 ,  B81B7/007 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/035

Abstract: A microchip has a base die with a conductive interconnect and an isolation trench around at least a portion of the conductive interconnect, and a cap die secured to the base die. A seal, formed from a metal material, is positioned between the base die and the cap die to secure them together. The microchip also has a blocking apparatus, between the isolation trench and the metal seal, that at least in part prevents the metal material from contacting the interconnect.

Abstract translation: 微芯片具有基底裸片，其具有导电互连和围绕导电互连的至少一部分的隔离沟槽，以及固定到基模的帽模。 由金属材料形成的密封件位于基模和盖模之间，以将它们固定在一起。 微芯片还具有在隔离沟槽和金属密封件之间的阻挡装置，至少部分地防止金属材料与互连件接触。