公开(公告)号：US10234906B2

公开(公告)日：2019-03-19

申请号：US15829372

申请日：2017-12-01

Applicant: Apple Inc.

Inventor： Scott Myers ,  Richard Heley ,  Matthew Theobald ,  Adam Stagnaro ,  Tang Tan ,  Richard Dinh ,  David Pakula

IPC: G06F1/16 ,  H05K5/03 ,  H05K5/02 ,  H04M1/02 ,  H01Q1/24 ,  H01Q1/22

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

公开(公告)号：US20180164853A1

公开(公告)日：2018-06-14

申请号：US15892310

申请日：2018-02-08

Applicant: Apple Inc.

Inventor： Scott A. Myers ,  Matthew Theobald ,  Richard Heley ,  Adam Stagnaro ,  Richard Hung Minh Dinh ,  David A. Pakula ,  Tang Yew Tan

IPC: G06F1/16 ,  H04M1/02 ,  H01Q1/22 ,  H01Q1/24 ,  H05K5/02 ,  H05K5/03

CPC classification number: G06F1/1656 ,  G06F1/1626 ,  G06F1/1658 ,  G06F1/1684 ,  G06F1/1698 ,  H01Q1/2258 ,  H01Q1/241 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/0274 ,  H05K5/02 ,  H05K5/0208 ,  H05K5/03 ,  Y10T29/49002 ,  Y10T29/49169

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assembles can include a window through which display circuitry can provide content to a user of the device.

公开(公告)号：US09898049B2

公开(公告)日：2018-02-20

申请号：US15168194

申请日：2016-05-30

Applicant: Apple Inc.

Inventor： Scott A. Myers ,  Matthew Theobald ,  Richard Heley ,  Adam Stagnaro ,  Richard Hung Minh Dinh ,  David A. Pakula ,  Tang Yew Tan

IPC: G06F1/16 ,  H04M1/02 ,  H05K5/03 ,  H05K5/02 ,  H01Q1/22 ,  H01Q1/24

CPC classification number: G06F1/1656 ,  G06F1/1626 ,  G06F1/1658 ,  G06F1/1684 ,  G06F1/1698 ,  H01Q1/2258 ,  H01Q1/241 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/0274 ,  H05K5/02 ,  H05K5/0208 ,  H05K5/03 ,  Y10T29/49002 ,  Y10T29/49169

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.