公开(公告)号：US20210216116A1

公开(公告)日：2021-07-15

申请号：US17111482

申请日：2020-12-03

Applicant: Au Optronics Corporation

Inventor： Chan-Jui Liu ,  Chun-Cheng Cheng ,  Pin-Miao Liu

IPC: G06F1/18 ,  G09F9/30

Abstract: A flexible electronic device including a flexible substrate, a plurality of first signal lines, a plurality of first transmission lines, a plurality of first through holes, and a plurality of first conductive structures is provided. The flexible substrate has a first surface and a second surface opposite to the first surface. The first signal lines are located on the first surface and have a first extending direction. The first transmission lines are located on the second surface and have a second extending direction. A first included angle is provided between the first extending direction and the second extending direction. An angle of the first included angle is between 10° and 80°. The first through holes penetrate through the flexible substrate. The first conductive structures are located in the first through holes and are electrically connected to the first signal lines and the first transmission lines.

公开(公告)号：US20210013247A1

公开(公告)日：2021-01-14

申请号：US17037666

申请日：2020-09-30

Applicant: Au Optronics Corporation

Inventor： Peng-Bo Xi ,  Chun-Cheng Cheng

IPC: H01L27/12 ,  H01L25/16 ,  H01L23/544

Abstract: A manufacturing method of a display panel includes providing a substrate having a first surface and a second surface opposite to the first surface; forming a high-shielding position layer on the first surface, wherein the light-shielding positioning layer has at least one first alignment pattern; forming a transparent material layer on the second surface; forming a photoresist layer on the transparent material layer; performing an exposure process, such that a light beam passes through the at least one first alignment pattern to penetrate through the substrate and the transparent material layer to the photoresist layer; performing a developing process to pattern the photoresist layer and form a patterned photoresist layer; and performing an etching process to pattern the transparent positioning layer having at least one second alignment pattern. In a direction perpendicular to the substrate, at least one first alignment pattern overlaps with at least one second alignment pattern.

公开(公告)号：US20200373333A1

公开(公告)日：2020-11-26

申请号：US16726846

申请日：2019-12-25

Applicant: Au Optronics Corporation

Inventor： Yu-Hsing Liang ,  Hsiu-Hua Wang ,  Chan-Jui Liu ,  Pin-Miao Liu ,  Chun-Cheng Cheng

IPC: H01L27/12

Abstract: An array substrate includes a substrate as well as a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer and a conductive structure sequentially formed thereon. The first insulating layer has a first opening communicated with a through hole of the substrate. The first conductive layer includes a first ring pattern extending from top of the first insulating layer into the first opening. The second insulating layer has a second opening communicated with the first opening. The second conductive layer includes a second ring pattern extending from top of the second insulating layer into the second opening. The first ring pattern laterally protrudes toward an axis of the through hole from the second ring pattern. The conductive structure extends from above the second insulating layer to a bottom surface of the substrate through the first and second openings and the through hole.