公开(公告)号：US20230060538A1

公开(公告)日：2023-03-02

申请号：US17460060

申请日：2021-08-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q1/22 ,  H01Q1/38 ,  H01L23/66

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.

公开(公告)号：US20230037915A1

公开(公告)日：2023-02-09

申请号：US17396601

申请日：2021-08-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Ya-Wen LIAO

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/42

Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.

公开(公告)号：US20210398921A1

公开(公告)日：2021-12-23

申请号：US16907049

申请日：2020-06-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  An-Ping CHIEN

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48 ,  H01Q1/38

Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

公开(公告)号：US20210005772A1

公开(公告)日：2021-01-07

申请号：US16923876

申请日：2020-07-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN

IPC: H01L31/14 ,  H01L31/0216 ,  H01L31/18 ,  H01L33/44 ,  H01L33/52 ,  H01L31/0203

Abstract: An optical device includes a substrate, a light receiving component, an encapsulant, a coupling layer and a light shielding layer. The light receiving component is disposed on the substrate. The encapsulant covers the light receiving component. The coupling layer is disposed on at least a portion of the encapsulant. The light shielding layer is disposed on the coupling layer.

公开(公告)号：US20180130937A1

公开(公告)日：2018-05-10

申请号：US15347658

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN

IPC: H01L35/32 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L23/3736 ,  H01L23/38 ,  H01L35/34

Abstract: An electronic module includes a first base layer and at least one via. The first base layer has a first surface and a second surface opposite the first surface, and defines at least one first hole. The first base layer includes a first metal. The via is disposed in the first hole of the first base layer. The via includes a thermoelectric material. A value of Z×T for the thermoelectric material is greater than a value of Z×T for the first metal, wherein Z is a thermoelectric figure of merit, T is temperature (in K), and the value of Z×T for the thermoelectric material is greater than 0.5.