METHOD FOR BONDING SUBSTRATES, TOUCH SUBSTRATE AND DISPLAY DEVICE
    22.
    发明申请
    METHOD FOR BONDING SUBSTRATES, TOUCH SUBSTRATE AND DISPLAY DEVICE 审中-公开
    用于接合衬底,触摸衬底和显示器件的方法

    公开(公告)号:US20160361907A1

    公开(公告)日:2016-12-15

    申请号:US14771429

    申请日:2015-01-13

    摘要: The present disclosure provides a method for bonding substrates, a touch substrate and a display device. In the process of manufacturing a touch display panel and the display device by the method for bonding substrates provided in the present disclosure, by steps such as arranging an easily-removed layer at a surrounding of a first substrate, coating and procuring light curing adhesive and removing the easily-removed layer, the light curing adhesive may be formed into a desired shape (including irregular shapes). In addition, an adhesive layer of the light curing adhesive has a uniform thickness, a smooth surface and an edge slope angle approaching to 90°. Furthermore, bonding bubbles may be reduced, and phenomenon such as lack of adhesive and adhesive overflow may be suppressed in the bonding process, thereby guaranteeing optical performance of the display device.

    摘要翻译: 本公开提供了一种用于接合基板,触摸基板和显示装置的方法。 在通过本公开中提供的接合基板的方法制造触摸显示面板和显示装置的过程中,通过诸如在第一基板的周围布置容易去除的层的步骤,涂覆并获得光固化粘合剂和 除去容易去除的层,光固化粘合剂可以形成为期望的形状(包括不规则形状)。 此外,光固化粘合剂的粘合剂层具有均匀的厚度,光滑的表面和接近90°的边缘倾斜角。 此外,可以减少接合气泡,并且在接合过程中可能抑制粘合剂和粘合剂溢出不足等现象,从而保证显示装置的光学性能。