公开(公告)号：US20190220723A1

公开(公告)日：2019-07-18

申请号：US16367595

申请日：2019-03-28

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva ,  Brian Nester

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07722 ,  G06K19/0723 ,  G06K19/07769 ,  G06K19/07771 ,  G06K19/07773

Abstract: A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.

公开(公告)号：US10275703B2

公开(公告)日：2019-04-30

申请号：US15887585

申请日：2018-02-02

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06F19/00 ,  G06K19/077 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q7/06 ,  G06K19/02

Abstract: RF shielding material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient RF shielding material is utilized to track and conform to the antenna.

公开(公告)号：US20180157954A1

公开(公告)日：2018-06-07

申请号：US15887585

申请日：2018-02-02

Applicant: CompoSecure, LLC

Inventor： John Herslow ,  Adam Lowe ,  Luis Dasilva

IPC: G06K19/077 ,  G06K19/02 ,  H01Q7/06 ,  H01Q1/52 ,  H01Q1/22

CPC classification number: G06K19/07773 ,  G06K19/02 ,  G06K19/07771 ,  H01Q1/2225 ,  H01Q1/526 ,  H01Q7/06

Abstract: RF shielding material utilized in a smart metal card as a shield between a metal layer and an antenna does not occupy a complete layer. Instead, only sufficient RF shielding material is utilized to track and conform to the antenna.