ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240196519A1

    公开(公告)日:2024-06-13

    申请号:US18587832

    申请日:2024-02-26

    Inventor: Yusuke FUJII

    Abstract: Provided are: an electronic device including a wiring board having a mounting surface, a ground electrode that defines a ground region on the mounting surface, an electronic component that is located on the mounting surface and is disposed in the ground region, an insulating protective layer that is disposed in the ground region and covers the electronic component, and an electromagnetic wave shielding layer that is provided to extend over the insulating protective layer and the ground electrode and that covers the insulating protective layer and is electrically connected to the ground electrode, the electromagnetic wave shielding layer being a solidified product of an ink for forming an electromagnetic wave shielding layer, in which a void ratio S1, which is a void ratio of a portion of the electromagnetic wave shielding layer located on the ground electrode, is lower than a void ratio S2, which is a void ratio of a portion of the electromagnetic wave shielding layer located on the insulating protective layer; and a manufacturing method thereof.

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