公开(公告)号：US20240365465A1

公开(公告)日：2024-10-31

申请号：US18641621

申请日：2024-04-22

申请人： Murata Manufacturing Co., Ltd.

发明人： Yoshihito OTSUBO ,  Takuma KUROYANAGI ,  Tomomi YASUDA

IPC分类号： H05K1/02

CPC分类号： H05K1/0243 ,  H05K1/0218 ,  H05K1/0242 ,  H05K2201/0715

摘要： A high frequency module includes a mounting board, a first electronic component, a second electronic component, and a shield member. The mounting board has a main surface. The first electronic component and the second electronic component are disposed on the main surface of the mounting board. The shield member is disposed on the main surface of the mounting board. The shield member is positioned between the first electronic component and the second electronic component, and is adjacent to the first electronic component and the second electronic component.

公开(公告)号：US12101874B2

公开(公告)日：2024-09-24

申请号：US17962286

申请日：2022-10-07

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Eunseok Hong

IPC分类号： H05K1/02

CPC分类号： H05K1/0219 ,  H05K1/0278 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09609

摘要： A rigid flexible printed circuit board (RFPCB) may include: a first base conductive layer; a first rigid conductive layer spaced apart from the first base conductive layer in a first direction; a second rigid conductive layer spaced apart from the first base conductive layer in the first direction and spaced apart from the first rigid conductive layer in a second direction intersecting the first direction; a base cover layer spaced apart from the first base conductive layer in the first direction and positioned closer to the first base conductive layer than to the first rigid conductive layer and the second rigid conductive layer; a transmission line positioned between the first base conductive layer and the base cover layer; and a dummy metal layer disposed on the base cover layer, positioned between the first rigid conductive layer and the second rigid conductive layer, and overlapping the transmission line in the first direction.

公开(公告)号：US20240237222A1

公开(公告)日：2024-07-11

申请号：US18364578

申请日：2023-08-03

申请人： Samsung Display Co., LTD.

发明人： HYEONJI KIM ,  JUYEOP SEONG ,  HEE-KWON LEE

IPC分类号： H05K1/18 ,  H01L25/18 ,  H05K1/02 ,  H10K59/90

CPC分类号： H05K1/189 ,  H01L25/18 ,  H05K1/0209 ,  H05K1/0218 ,  H10K59/90 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10128

摘要： A display device includes a display substrate including a display area, a pixel in the display area, a pad area adjacent to the display area, and a pad in the pad area, a driving chip on the display substrate, in the pad area, and a circuit board which is on the display substrate and electrically connected to the display substrate at the pad, the circuit board defining a groove of the circuit board and covering the driving chip at the groove.

公开(公告)号：US20240206077A1

公开(公告)日：2024-06-20

申请号：US18583868

申请日：2024-02-22

申请人： FUJIFILM Corporation

发明人： Norihide SHIMOHARA

IPC分类号： H05K3/12 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/107 ,  C09D11/322 ,  C09D11/52 ,  C09D11/54 ,  H01L21/56 ,  H01L23/552 ,  H05K1/02 ,  H05K1/09 ,  H05K3/28

CPC分类号： H05K3/125 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/107 ,  C09D11/322 ,  C09D11/52 ,  C09D11/54 ,  H01L21/56 ,  H01L23/552 ,  H05K1/0218 ,  H05K3/1208 ,  H05K3/284 ,  H05K1/095 ,  H05K2201/0715 ,  H05K2203/1469

摘要： Provided is a manufacturing method of an electronic device, the method including: a step of preparing an electronic substrate including a wiring board, an electronic component disposed on the wiring board, and a ground electrode having an organic acid on a surface thereof; and a step of applying an ink for forming a conductive layer onto at least a part of the ground electrode having the organic acid on the surface thereof, to form a conductive layer that is a cured film of the ink for forming a conductive layer, in which the organic acid includes at least one compound selected from the group consisting of a monocarboxylic acid having a molecular weight of less than 350 and a dicarboxylic acid having a molecular weight of less than 350.

公开(公告)号：US20240172405A1

公开(公告)日：2024-05-23

申请号：US18553148

申请日：2022-03-29

申请人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

发明人： Takahiko KATSUKI ,  Hiroshi TAJIMA ,  Sirou YAMAUCHI

IPC分类号： H05K9/00 ,  H05K1/02

CPC分类号： H05K9/0086 ,  H05K1/0218 ,  H05K2201/0715

摘要： An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer. Multiple openings are formed in the metal layer; the openings include openings (A) including island-shaped metal layer fragments, each opening (A) having island-shaped metal layer fragments formed therein, and the openings (A) including island-shaped metal layer fragments include openings (A1) including one or more island-shaped metal layer fragments. Each opening (A1) defines an opening (A) including island-shaped metal layer fragments in which a total area of the island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).

公开(公告)号：US20240097321A1

公开(公告)日：2024-03-21

申请号：US18525735

申请日：2023-11-30

申请人： Google LLC

发明人： Yao Ding ,  Qi Qi

IPC分类号： H01Q1/52 ,  H01Q1/50 ,  H05K1/02

CPC分类号： H01Q1/526 ,  H01Q1/50 ,  H05K1/0216 ,  H05K2201/0715 ,  H05K2201/10098

摘要： This document describes apparatuses and techniques for providing a flexible connector between a secondary circuit board and a main logic board with a permeability shield to increase impedance of the flexible connector to reduce antenna loss from an antenna via the flexible connector to the main logic board. For example, an apparatus includes a secondary circuit board supporting one or more control pads and an antenna. A flexible connector includes a plurality of conductive traces configured to electrically couple the one or more control pads of the secondary circuit board to a coupling on a main logic board. A permeability shield is configured to be disposed along one or more portions of the flexible connector. The permeability shield is configured to increase impedance of the flexible connector to reduce antenna loss of the antenna via the control pads and the flexible connector to the main logic board.

公开(公告)号：US11855494B2

公开(公告)日：2023-12-26

申请号：US17508687

申请日：2021-10-22

申请人： Andreas Stihl AG & Co. KG

发明人： Philipp Harjung ,  Martin Fuerst ,  Alexander Ruehle

IPC分类号： H02K11/02 ,  H02K11/026 ,  H02K17/30 ,  H03H1/00

CPC分类号： H02K11/026 ,  H02K17/30 ,  H03H1/0007 ,  H05K2201/0715

摘要： The disclosure relates to a filter circuit on an electric motor which has electrical connections at a connection end for connection to a supply voltage (U). The filter circuit consists of at least one capacitor bridge arranged between the connections of the electric motor for radio interference suppression. For increased electromagnetic compatibility (EMC), the filter circuit is arranged on a circuit board and held on the connection end of the electric motor. The circuit board has a capacitor bridge with interference suppression capacitors, which is connected between the electrical connections of the electric motor, wherein an interference suppression capacitor has a longitudinal axis between its electrical connections in the longitudinal direction. The interference suppression capacitors are arranged on the circuit board with their longitudinal axes aligned in different spatial directions.

公开(公告)号：US11812552B2

公开(公告)日：2023-11-07

申请号：US17221159

申请日：2021-04-02

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Chul Mun Kang ,  Sang Jong Lee ,  Hyun Sang Kwak ,  Chi Hyeon Jeong ,  Seong Hwan Lee

IPC分类号： H05K1/02

CPC分类号： H05K1/0298 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0227 ,  H05K1/0221 ,  H05K2201/0715

摘要： A printed circuit board, includes: a first insulating layer on which a wiring line is disposed; a second insulating layer covering an upper portion of the wiring line; a first conductive shield wall spaced apart from two opposing sides of the wiring line in a width direction of the wiring line, and extending in a length direction of the wiring line; and a second conductive shield wall spaced apart from two opposing ends of the first conductive shield wall in the length direction, and extending the a width direction. At least one of the first conductive shield wall or the second conductive shield wall includes a plurality of via walls each extending in a thickness direction of the first insulating layer and the second insulating layer and having a gap is disposed therebetween.

公开(公告)号：US11765828B2

公开(公告)日：2023-09-19

申请号：US18094683

申请日：2023-01-09

申请人： Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Ren Xiong ,  Qiang Tang

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

CPC分类号： H05K1/118 ,  H05K1/0237 ,  H05K1/111 ,  H05K1/189 ,  H05K3/3457 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/10128

摘要： A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate, the first wiring portion and the second wiring portion are spaced apart from each other and are electrically connected to the first bridge end and the second bridge end, respectively; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion for a first functional wiring line on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively. The wiring layout of the flexible printed circuit is simple and is easy to be manufactured.

公开(公告)号：US11751331B2

公开(公告)日：2023-09-05

申请号：US17389564

申请日：2021-07-30

申请人： Samsung Display Co., LTD.

发明人： Kyu Min Han ,  Seung Hwan Cheong

IPC分类号： H05K1/02 ,  H05K1/11

CPC分类号： H05K1/118 ,  H05K1/0218 ,  H05K2201/0715 ,  H05K2201/10128

摘要： A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.