公开(公告)号：US20240306288A1

公开(公告)日：2024-09-12

申请号：US18547742

申请日：2021-09-29

申请人： HITACHI ASTEMO, LTD.

发明人： Takashi OGURA

IPC分类号： H05K1/02

CPC分类号： H05K1/0231 ,  H05K1/0215

摘要： An electronic device includes: a control circuit board on which a control circuit is mounted; a connection wiring connected to the control circuit board; and a metal housing that houses the control circuit board and the connection wiring, in which the connection wiring includes a signal wiring layer, a first connector provided on one end side of the signal wiring layer and electrically connecting the signal wiring layer and the control circuit board, a second connector provided on the other end side of the signal wiring layer, and a ground wiring layer arranged at a predetermined interval from the signal wiring layer, and in which the ground wiring layer is electrically connected to the metal housing via the second connector, and is not electrically connected to the control circuit board in a state where the signal wiring layer and the control circuit board are electrically connected via the first connector.

公开(公告)号：US20240244740A1

公开(公告)日：2024-07-18

申请号：US18388204

申请日：2023-11-09

申请人： ACBEL POLYTECH INC.

发明人： Yu-Heng LIN ,  Cheng-Chi YANG ,  Yung-Han KUO

IPC分类号： H05K1/02 ,  H01R4/30

CPC分类号： H05K1/0215 ,  H01R4/305

摘要： A ground point fixing device for a power supply module includes an engaging part and a fastening part. The engaging part includes an engaging body, a joining portion and an engaging portion. The engagement body has a body outer diameter and a body surface larger than a grounding hole on a power supply module circuit board. The joining portion is disposed on the body surface and has a joining portion outer diameter smaller than the grounding hole. The engagement portion is disposed on the body surface and around an outer circumference of the joining portion. The joining portion is passed through the grounding hole to be connected to the fastening part, so that the engagement portion of the engaging part is engaged in the grounding hole, and the fastening part and the engagement body of the engaging part are respectively fixed on an upper surface and a lower surface of the circuit board.

公开(公告)号：US20240196516A1

公开(公告)日：2024-06-13

申请号：US18554815

申请日：2021-04-15

申请人： AES Global Holdings PTE Ltd.

发明人： Yihong Zhang ,  Yuk Man Shing ,  Wai Chiu Or ,  Wai Man Lo

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K1/0215 ,  H05K1/115 ,  H05K3/3405 ,  H05K2201/09354 ,  H05K2201/1034 ,  H05K2201/10984 ,  H05K2203/0285

摘要： Various configurations of a grounding element or conductive element for a printed circuit board (PCB), as well as a process for manufacturing, are disclosed. For example, a PCB can include a solder grounding element connecting a copper track to a metal substrate, where the solder grounding element is applied via ultrasonic soldering during a manufacturing process. In another example, a PCB can include a spring pin grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include an auto splice grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include a press fit pin grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include a clip pin grounding element connecting a copper track to a metal substrate.

公开(公告)号：US20240188245A1

公开(公告)日：2024-06-06

申请号：US18554224

申请日：2022-04-18

申请人： Sony Interactive Entertainment Inc.

发明人： Katsushi Ito ,  Kazutaka Eto ,  Kazuya Odagiri ,  Sho Kobayashi

IPC分类号： H05K7/12 ,  H01Q1/22 ,  H05K1/02 ,  H05K9/00

CPC分类号： H05K7/12 ,  H01Q1/2291 ,  H05K1/0215 ,  H05K9/0098 ,  H05K2201/10098

摘要： Provided is an electronic apparatus in which a state where a cable is in contact with a ground part can be stably maintained for a long period of time. An electronic apparatus includes a shield that is in contact with a ground pattern on a circuit board and that functions as a ground part. The cable extends from a front antenna, is connected to the circuit board, and passes between the shield and a first cushioning member. An inner surface of the housing presses the first cushioning member against the shield.

公开(公告)号：US20240172398A1

公开(公告)日：2024-05-23

申请号：US18385191

申请日：2023-10-30

申请人： Micron Technology, Inc.

发明人： Deepu Narasimiah Subhash ,  Suresh Reddy Yarragunta ,  Koneri Sathyanarayana Guptha Amith

IPC分类号： H05K7/20 ,  G06F1/20 ,  H05K1/02

CPC分类号： H05K7/205 ,  G06F1/206 ,  H05K1/0215 ,  H05K7/20509 ,  H05K1/18 ,  H05K2201/09163

摘要： Aspects of the present disclosure configure a memory sub-system processor to use a triangular shaped metal bracket to improve heat dissipation to improve a data transfer rate. The triangular shaped metal bracket being physically attached to an edge of the PCB at a base portion of the triangular shaped metal bracket. The triangular shaped metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base portion along with a heat spreader on a primary and secondary side of the bracket. The triangular shaped metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least a host device through a vertex portion of the triangular shaped metal bracket.

公开(公告)号：US11991818B2

公开(公告)日：2024-05-21

申请号：US17720069

申请日：2022-04-13

申请人： Delta Electronics, Inc.

发明人： Jui-Ching Lee ,  Po-Heng Chao ,  Do Chen ,  Ching-Ho Chou

IPC分类号： H05K1/02 ,  H05K7/12 ,  H05K7/14

CPC分类号： H05K1/0215 ,  H05K7/12 ,  H05K7/1417

摘要： An electronic device is provided and includes a circuit board and a casing. The circuit board includes a plate body, a perforation and a ground wire. The perforation penetrates through the plate body, the ground wire is electrically coupled with the plate body and crosses over the perforation. The casing includes a bottom plate and a clamping structure. The clamping structure is disposed on the bottom plate and includes a first clamping part and a second clamping part. The circuit board is disposed in the casing, and the clamping structure penetrates through the plate body through the perforation, so that the circuit board is positioned on the casing, and the ground wire is clamped by the first clamping part and the second clamping part of the clamping structure. Consequently, the circuit board is grounded with the casing.

公开(公告)号：US20240164018A1

公开(公告)日：2024-05-16

申请号：US18419212

申请日：2024-01-22

申请人： DELL PRODUCTS L.P.

发明人： Umesh CHANDRA ,  Douglas WALLACE ,  Bhyrav MUTNURY

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/111 ,  H05K1/0215 ,  H05K1/025 ,  H05K2201/10318 ,  H05K2201/10636

摘要： A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

公开(公告)号：US11956888B2

公开(公告)日：2024-04-09

申请号：US17398922

申请日：2021-08-10

申请人： Delta Electronics, Inc.

发明人： Chia-Hsien Chu ,  Yi-Hua Chang

IPC分类号： H05K1/02 ,  H05K3/30 ,  H05K5/00

CPC分类号： H05K1/0215 ,  H05K3/301 ,  H05K5/006

摘要： An electronic device includes a casing, a circuit board and a grounding assembly. The circuit board has a first surface and a second surface, wherein an input terminal and an output terminal are disposed on the second surface. The grounding assembly comprises a conducting terminal, a first grounding element and a second grounding element. The conducting terminal is disposed on the first surface of the circuit board, and the first grounding element is disposed adjacent to the conducting terminal. The first grounding element penetrates the circuit board and electrically couples with the conducting terminal and the casing, and the second grounding element correspondingly penetrates the circuit board and the conducting element, so that a first portion of the second grounding element electrically couples with the input terminal and the output terminal of the circuit board, and a second portion of the second grounding element electrically couples with the conducting terminal.

公开(公告)号：US11924959B2

公开(公告)日：2024-03-05

申请号：US17724353

申请日：2022-04-19

申请人： DELL PRODUCTS L.P.

发明人： Sandor Farkas ,  Mark Smith ,  Bhyrav Mutnury

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/11

CPC分类号： H05K1/0203 ,  H05K1/0215 ,  H05K1/111 ,  H05K2201/066 ,  H05K2201/093

摘要： An information handling system includes a PCB, a CPU, a power distribution hat, and a heat sink. The PCB includes a first power contact on a first surface of the PCB and a first ground contact on a second surface of the PCB. The CPU includes a substrate and is affixed and electrically coupled to the first surface of the PCB by a first surface of the substrate. A second surface of the substrate includes a second power contact and a second ground contact. The power distribution hat couples the first power contact with the second power contact. The heat sink couples the first ground contact with the second ground contact.

公开(公告)号：US11887911B2

公开(公告)日：2024-01-30

申请号：US17011755

申请日：2020-09-03

申请人： KIOXIA CORPORATION

发明人： Daigo Suzuki ,  Kosuke Awaga

IPC分类号： H01L25/18 ,  H01L23/433 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K5/00 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L25/18 ,  H05K1/0204 ,  H05K1/0271 ,  H05K1/147 ,  H05K1/189 ,  H05K5/006 ,  H05K7/20445 ,  H05K1/0215 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10189

摘要： A semiconductor storage device includes a housing, an interface substrate attached to the housing, an insulating substrate in the housing, a first flexible substrate connecting the insulating substrate and the interface substrate, a first integrated circuit on a first surface of the insulating substrate, and a first heat conductor arranged on a second surface of the insulating substrate that is opposite to the first surface, and contacting a first inner surface of the housing.