公开(公告)号：US20130327093A1

公开(公告)日：2013-12-12

申请号：US14000427

申请日：2012-02-09

申请人： Gerhard Kalkowski ,  Stefan Risse ,  Ramona Eberhardt

发明人： Gerhard Kalkowski ,  Stefan Risse ,  Ramona Eberhardt

IPC分类号： C03B23/203

CPC分类号： C03B23/203 ,  B32B3/266 ,  B32B17/06 ,  C03B23/20 ,  C04B37/001 ,  C04B37/04 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/52 ,  C04B2237/62 ,  G02B5/1847 ,  G02B7/183

摘要： The invention relates to a method of producing lightweight structural elements which are produced as a composition construction element having at least one cover plate and one carrier element which are connected to one another. A carrier element, at which at least one apertures and/or at least one cut-out is/are formed and at least one further element, which is a cover plate, are connected to one another. A carrier element and at least one cover plate can be formed from a glass, a glass ceramic material, a ceramic material and/or silicon having an oxide surface layer which is formed at least in the bonding region of the elements to be connected to one another. The carrier element should have at least a double thickness with respect to the thickness of a cover plate. The surfaces of the cover plate(s) and of the carrier element to be connected to one another should be intensely cleaned in their bonding regions and should be smoothed such that a roughness of the surface is achieved there, such that they are in direct touching contact with at least 80% of their bonding surface with an active compression source and in this respect a thermal treatment is carried out at a temperature of at least 100° C. and maintaining of the temperature over a period of at least 0.5 h to establish a bond connection of the cover plate(s) and the carrier element. In this respect, at least one cover plate should be connected to a surface of the carrier element at which at least one opening of an aperture or of a cut-out is arranged.

摘要翻译： 本发明涉及一种生产轻质结构元件的方法，该方法是作为具有彼此连接的至少一个盖板和一个载体元件的组合物构造元件而制造的。 至少一个孔和/或至少一个切口被形成的载体元件和作为盖板的至少一个另外的元件彼此连接。 载体元件和至少一个盖板可以由玻璃，玻璃陶瓷材料，陶瓷材料和/或具有氧化物表面层的硅形成，所述氧化物表面层至少形成在要连接到元件的元件的接合区域中 另一个。 载体元件应当相对于盖板的厚度具有至少两倍的厚度。 要连接的盖板和载体元件的表面应在其接合区域进行强烈清洁，并应平滑，以使表面的粗糙度达到，使其直接接触 与至少80％的粘合表面与活性压缩源接触，在这方面热处理在至少100℃的温度下进行，并保持温度至少0.5小时以建立 盖板和载体元件的接合连接。 在这方面，至少一个盖板应该连接到载体元件的表面，在该表面上布置有孔或切口的至少一个开口。