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公开(公告)号:US20180308589A1
公开(公告)日:2018-10-25
申请号:US16019893
申请日:2018-06-27
IPC分类号: G21C3/07 , B32B37/06 , B23K26/20 , B23K37/00 , B23K1/008 , C04B35/565 , C22C21/02 , C04B37/02 , C04B37/00 , B23K1/005 , B32B37/00
CPC分类号: G21C3/07 , B23K1/0008 , B23K1/0056 , B23K1/008 , B23K1/19 , B23K1/20 , B23K26/20 , B23K35/02 , B23K35/025 , B23K35/286 , B23K37/00 , B23K2103/18 , B23K2103/52 , B32B37/00 , B32B37/06 , C04B35/565 , C04B37/006 , C04B37/026 , C04B2235/3826 , C04B2237/121 , C04B2237/128 , C04B2237/16 , C04B2237/365 , C04B2237/38 , C04B2237/40 , C04B2237/403 , C04B2237/59 , C04B2237/592 , C04B2237/595 , C04B2237/60 , C04B2237/72 , C22C21/02 , G21Y2004/10 , Y02E30/40
摘要: A method for fabricating assemblies that includes providing a first component that further includes silicon carbide and that has an upper portion and a tapered lower portion; providing a second component that further includes silicon carbide and that has an upper portion that is adapted to receive the tapered lower portion of the first component; providing a predetermined amount of multiphase Al—Si braze foil; grinding the Al—Si braze foil into a powder; mixing a predetermined amount of braze paste binder with the Al—Si powder to form a slurry; uniformly applying the slurry to the tapered lower portion of the first component; uniformly applying the slurry to the upper portion of the second component and inserting the tapered lower portion of the first component into the upper portion of the second component; and heating the applied slurry to a temperature of 725° C. to 1450° C. for a predetermined period of time.
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2.
公开(公告)号:US20180257997A1
公开(公告)日:2018-09-13
申请号:US15879376
申请日:2018-01-24
发明人: Young Wook KIM , Seung Hoon JANG
IPC分类号: C04B37/00 , C04B35/565 , C04B35/64
CPC分类号: C04B37/001 , C04B35/565 , C04B35/575 , C04B35/64 , C04B37/005 , C04B2235/3206 , C04B2235/3217 , C04B2235/3225 , C04B2235/3826 , C04B2235/383 , C04B2235/3834 , C04B2235/602 , C04B2235/6567 , C04B2235/6581 , C04B2235/6586 , C04B2235/96 , C04B2235/963 , C04B2237/083 , C04B2237/365 , C04B2237/52 , C04B2237/70
摘要: The present invention relates to joined silicon carbide (SiC) ceramics and a method for processing the same. And, most particularly, the joined silicon carbide (SiC) ceramics and the method for processing the same provide a method for processing joined silicon carbide (SiC) ceramics including the steps of sintering silicon carbide substrates configuring the joined ceramics, processing a joined silicon carbide ceramics preparation by layering a non-sintered silicon carbide bond having a same composition as the silicon carbide substrate between at least two substrates selected from the sintered silicon carbide substrates, and processing the joined silicon carbide ceramics by performing heat treatment on the joined silicon carbide ceramics preparation. According to the above-described invention, by using a bond having the same composition as the silicon carbide substrate, since residual stress-free joined ceramics can be processed, joined silicon carbide ceramics having a high strength corresponding to 65 to 190% of a strength of the substrate may be processed.
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公开(公告)号:US20180213639A1
公开(公告)日:2018-07-26
申请号:US15576424
申请日:2016-05-13
申请人: Rogers Germany GmbH
CPC分类号: H05K1/0306 , C04B37/026 , C04B2237/12 , C04B2237/124 , C04B2237/125 , C04B2237/126 , C04B2237/127 , C04B2237/34 , C04B2237/343 , C04B2237/346 , C04B2237/348 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/407 , C04B2237/52 , C04B2237/708 , C04B2237/86
摘要: A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterised by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 μm; heating the base material and the additional layer on the first surface to at least partially melt the solder layer and connecting the base material to the at least one additional layer.
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公开(公告)号:US20180162779A1
公开(公告)日:2018-06-14
申请号:US15894286
申请日:2018-02-12
IPC分类号: C04B35/528 , C04B37/02 , C04B35/645 , C04B35/573 , C04B35/52 , B22F7/06 , B01J3/06 , B32B18/00 , C22C26/00
CPC分类号: C04B35/528 , B01J3/065 , B01J2203/0655 , B22F7/062 , B32B18/00 , C04B35/52 , C04B35/573 , C04B35/645 , C04B37/021 , C04B37/026 , C04B2235/427 , C04B2237/083 , C04B2237/122 , C04B2237/123 , C04B2237/16 , C04B2237/363 , C04B2237/365 , C04B2237/704 , C22C26/00 , C22C2204/00 , Y10T156/10 , Y10T428/30
摘要: A polycrystalline diamond (PCD) compact and method for making the compact are provided. The method includes bringing a first PCD wafer and a second PCD wafer together at an interface in the presence of a bonding agent to form an unbonded assembly and bonding the wafers together at the interface at a pressure and temperature at which diamond is thermodynamically stable. The first PCD wafer is more thermally stable than the second PCD wafer.
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公开(公告)号:US20180080144A1
公开(公告)日:2018-03-22
申请号:US15566247
申请日:2016-04-06
发明人: Masayuki TANNO , Jun ABE , Koji KATO , Yoshinori KUWABARA
IPC分类号: C30B29/30 , C30B29/60 , C30B31/02 , C30B33/06 , C01D15/02 , C01G33/00 , C01G35/00 , H03H9/02
CPC分类号: C30B29/30 , C01D15/02 , C01G33/00 , C01G35/00 , C01P2002/90 , C04B37/00 , C04B37/02 , C04B2237/343 , C04B2237/365 , C30B29/605 , C30B31/02 , C30B33/04 , C30B33/06 , H03H9/02559
摘要: [Object]It is an object of the present invention to provide a lithium tantalate single crystal substrate which undergoes only small warpage, is free from cracks and scratches, has better temperature non-dependence characteristics and a larger electromechanical coupling coefficient than a conventional Y-cut LiTaO3 substrate.[Means to Solve the Problems]The lithium tantalate single crystal substrate of the present invention is a rotated Y-cut LiTaO3 single crystal substrate having a crystal orientation of 36° Y-49° Y cut characterized in that: the substrate is diffused with Li from its surface into its depth such that it has a Li concentration profile showing a difference in the Li concentration between the substrate surface and the depth of the substrate; and the substrate is treated with single polarization treatment so that the Li concentration is substantially uniform from the substrate surface to a depth which is equivalent to 5-15 times the wavelength of either a surface acoustic wave or a leaky surface acoustic wave propagating in the LiTaO3 substrate surface.
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公开(公告)号:US20180030840A1
公开(公告)日:2018-02-01
申请号:US15711567
申请日:2017-09-21
CPC分类号: F01D9/02 , C04B37/005 , C04B2237/083 , C04B2237/365 , C04B2237/38 , C04B2237/61 , C04B2237/76 , C04B2237/84 , F01D5/189 , F01D5/284 , F01D5/288 , F01D9/041 , F01D9/044 , F05D2260/20 , F05D2300/211 , F05D2300/6033 , Y02T50/672 , Y02T50/673 , Y02T50/676 , Y02T50/6765
摘要: One aspect of the present disclosure includes a turbine vane assembly comprising a vane made from ceramic matrix composite material having an outer wall extending between a leading edge and a trailing edge and between a first end and an opposing second end; an endwall made at least partially from a ceramic matrix composite material configured to engage the first end of the vane; and a retaining region including corresponding bi-cast grooves formed adjacent the first end of the vane and a receiving aperture formed in the endwall; wherein a bond is formed in the retaining region to join the vane and endwall together.
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公开(公告)号:US09862651B2
公开(公告)日:2018-01-09
申请号:US14633652
申请日:2015-02-27
申请人: NGK Insulators, Ltd.
发明人: Mitsuhiro Ito
IPC分类号: B01D46/24 , C04B38/00 , C04B28/24 , C04B35/565 , C04B37/00 , C04B41/85 , C04B41/00 , C04B41/50 , C04B111/00 , C04B111/34
CPC分类号: C04B38/0006 , B01D46/2418 , B01D46/2448 , B01D2046/2496 , B32B2264/101 , B32B2264/107 , C04B28/24 , C04B35/565 , C04B37/005 , C04B41/009 , C04B41/5089 , C04B41/85 , C04B2111/00793 , C04B2111/0081 , C04B2111/343 , C04B2235/3234 , C04B2235/3418 , C04B2235/3481 , C04B2235/3826 , C04B2235/3873 , C04B2235/5292 , C04B2237/062 , C04B2237/08 , C04B2237/09 , C04B2237/341 , C04B2237/343 , C04B2237/346 , C04B2237/365 , C04B2237/368 , Y10T428/24149 , C04B14/20 , C04B14/324 , C04B24/383 , C04B38/0019 , C04B38/10 , C04B38/0074 , C04B38/0645 , C04B35/00 , C04B35/195 , C04B35/478 , C04B35/584 , C04B41/5059
摘要: A honeycomb structure has a plurality of pillar honeycomb segments with a porous partition wall that defines a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid and a bonding layer that bonds side surfaces of the plurality of honeycomb segments one another, the bonding layer contains a plurality of plate-shaped particles, the plate-shaped particles are laminated in a thickness direction X of the bonding layer at a cross section of the bonding layer cut off to the thickness direction of the bonding layer, the number of particles α meets Expression: number of particles α>10, and the number of particles α and the number of particles β meet a relationship of Expression: (number of particles α/number of particles β)>3.
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公开(公告)号:US20170368803A1
公开(公告)日:2017-12-28
申请号:US15628148
申请日:2017-06-20
IPC分类号: B32B18/00 , C04B35/565 , B32B15/04 , C04B41/45
CPC分类号: B32B18/00 , B32B15/04 , C04B35/565 , C04B37/00 , C04B37/003 , C04B37/005 , C04B37/023 , C04B37/025 , C04B37/045 , C04B41/4501 , C04B2235/5244 , C04B2235/96 , C04B2235/9607 , C04B2237/08 , C04B2237/083 , C04B2237/12 , C04B2237/122 , C04B2237/16 , C04B2237/30 , C04B2237/341 , C04B2237/343 , C04B2237/36 , C04B2237/363 , C04B2237/365 , C04B2237/368 , C04B2237/38 , C04B2237/52 , C04B2237/58 , C04B2237/59 , C04B2237/708 , C04B2237/72 , C04B2237/84
摘要: An example article may include a component, a substrate including a first ceramic, a joining layer between the component and the substrate, and a joint surface coating between the substrate and the joining layer. The joint surface coating may include a diffusion barrier layer including a second ceramic material, and a compliance layer including at least one of a metal or a metalloid. An example technique may include holding a first joining surface of a coated component adjacent a second joining surface of a second component. The example technique may further include heating at least one of the coated component, the second component, and a braze material, and brazing the coated component by allowing the braze material to flow in a region between the first joining surface and the second joining surface.
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公开(公告)号:US09850173B2
公开(公告)日:2017-12-26
申请号:US14593682
申请日:2015-01-09
申请人: The Boeing Company
发明人: William P. Keith
CPC分类号: C04B35/76 , B32B1/08 , B32B5/02 , B32B18/00 , B32B2250/40 , B32B2307/30 , B32B2605/18 , C04B37/005 , C04B2235/5208 , C04B2235/5224 , C04B2235/5228 , C04B2235/9607 , C04B2237/34 , C04B2237/343 , C04B2237/361 , C04B2237/365 , C04B2237/38 , C04B2237/385 , C04B2237/76 , C04B2237/84
摘要: A hybrid sandwich ceramic matrix composite (CMC) may comprise a first facesheet, a second facesheet, and a core between and bonded to both of the first facesheet and the second facesheet. The first facesheet and the second facesheet may each include filaments in a ceramic matrix. The hybrid sandwich CMC may be configured for exposure to a thermal gradient in which the first facesheet is exposed to a higher temperature environment than the second facesheet. The first facesheet and the second facesheet may have at least closely matching coefficients of thermal expansion, and the first facesheet may have a higher compressive strength than the second facesheet.
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10.
公开(公告)号:US09791662B2
公开(公告)日:2017-10-17
申请号:US14511773
申请日:2014-10-10
发明人: Oliver Baldus , Volker Schmidt
CPC分类号: G02B7/182 , C04B37/042 , C04B37/045 , C04B2237/10 , C04B2237/12 , C04B2237/365 , F16M13/00 , F16M2200/08 , G02B7/183
摘要: A carrier structure (100), particularly for optical components, includes a carrier body (10) which is formed from ceramic with hollows (11), and at least one cover layer (21, 22) which is formed from glass, arranged on at least one surface of the carrier body (10), and is connected to the carrier body (10) by means of at least one bond connection (23, 24) produced by means of anodic bonding. Methods for producing the carrier structure (100) and the use of the carrier structure as a mirror body, carrier for optical components and/or mechanical carrier for dynamically moved components are also described.
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