公开(公告)号：US20130337159A1

公开(公告)日：2013-12-19

申请号：US13920534

申请日：2013-06-18

Applicant: H.C. Starck Inc.

Inventor： Steven A. Miller ,  Prabhat Kumar ,  Richard Wu ,  Shuwei Sun ,  Stefan Zimmermann ,  Olaf Schmidt-Park

IPC: C23C14/34

CPC classification number: C23C14/3414 ,  B22F1/0014 ,  C22C1/045 ,  C23C4/134 ,  C23C14/0057 ,  C23C14/0089 ,  C23C14/0641 ,  C23C14/08 ,  C23C14/14 ,  C23C24/04 ,  H01J37/3426 ,  H01J2237/332

Abstract: In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and comprising a sputtering-target material is provided, the sputtering-target material (i) comprising a metal, (ii) defining a recessed furrow therein, and (iii) having a first grain size and a first crystalline microstructure. A powder is spray-deposited within the furrow to form a layer therein, the layer (i) comprising the metal, (ii) having a second grain size finer than the first grain size, and (iii) having a second crystalline microstructure more random than the first crystalline microstructure. Spray-depositing the powder within the furrow forms a distinct boundary line between the layer and the sputtering-target material.

Abstract translation: 在各种实施例中，提供了最初通过铸锭冶金或粉末冶金形成并且包括溅射靶材料的溅射靶，溅射靶材料（i）包括金属，（ii）在其中限定凹槽，以及（iii） 具有第一晶粒尺寸和第一晶体微结构。 将粉末喷涂在沟槽内以在其中形成层，层（i）包含金属，（ii）具有比第一粒度更细的第二粒度，和（iii）具有更随机的第二结晶微结构 比第一个结晶微结构。 将粉末喷射沉积在沟槽内，在层和溅射靶材料之间形成明显的边界线。