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公开(公告)号：US20210285980A1
公开(公告)日：2021-09-16
申请号：US17196101
申请日：2021-03-09
Applicant: Infineon Technologies AG
Inventor： Gernot BINDER , Ferdinand GASTINGER , Stephanie JANKOWSKI , Thomas LASSLEBEN
Abstract: A sensor device includes a magnetic field sensor component, including a chip carrier having a connection conductor and a magnetic field sensor chip arranged on the chip carrier, and a magnet, wherein the magnetic field sensor component is arranged on a mounting surface of the magnet, wherein the mounting surface has an elevation and the connection conductor is bent around the elevation.
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公开(公告)号：US20210131827A1
公开(公告)日：2021-05-06
申请号：US17064944
申请日：2020-10-07
Applicant: Infineon Technologies AG
Inventor： Armin SATZ , Gernot BINDER
Abstract: An angle sensor for detecting a rotation angle of a shaft, on the axial end of which a permanent magnet is fitted. The permanent magnet has a north pole and a south pole that lie opposite one another across a rotation axis of the shaft. A sensor arrangement includes at least four sensor elements that are arranged with equidistant angles between them on a sensor element circle. The ferromagnetic element is arranged concentrically with a center of the sensor element circle and, when viewed in the direction of the midaxis of the sensor element circle, is point-symmetrical with respect to the center. The angle sensor is arranged relative to the axial end of the shaft such that the rotation axis of the shaft is substantially concentric with the center of the sensor element circle and the sensor arrangement is arranged between the permanent magnet and the ferromagnetic element.
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公开(公告)号：US20210011095A1
公开(公告)日：2021-01-14
申请号：US16923583
申请日：2020-07-08
Applicant: Infineon Technologies AG
Inventor： Gernot BINDER , Riccardo DAPRETTO , Diego LUNARDINI , Mario MOTZ , Volker STRUTZ
IPC: G01R33/00
Abstract: A sensor device comprises an electrically conductive chip carrier, wherein the chip carrier comprises an auxiliary structure, wherein the auxiliary structure comprises a first precalibration current terminal and a second precalibration current terminal, a magnetic field sensor chip arranged on a mounting surface of the chip carrier, wherein the magnetic field sensor chip comprises a sensor element, wherein the shape of the auxiliary structure is embodied such that an electrical precalibration current flowing from the first precalibration current terminal to the second precalibration current terminal through the auxiliary structure induces a predefined precalibration magnetic field at the location of the sensor element, wherein during measurement operation of the precalibrated sensor device, no precalibration current flows between the first precalibration current terminal and the second precalibration current terminal.
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公开(公告)号：US20180196080A1
公开(公告)日：2018-07-12
申请号：US15909136
申请日：2018-03-01
Applicant: Infineon Technologies AG
Inventor： Gernot BINDER
Abstract: A magnetic sensor module includes a magnetic sensor having an in-plane axis and an out-of-plane axis, and including a differential pair of sensor elements spaced apart from each other. The differential pair of sensor elements are configured to generate measurement values in response to sensing a bias magnetic field. The magnetic sensor module further includes a back bias magnet including two opposing poles, where the back bias magnet is magnetized in a magnetized direction that is parallel to the in-plane axis and generates the bias magnetic field; a first magnetic flux guide disposed at a first pole and configured to redirect a first portion of the bias magnetic field towards the magnetic sensor along the in-plane axis; and a second magnetic flux guide disposed at a second pole and configured to redirect a second portion of the bias magnetic field towards the back bias magnet along the magnetized direction.
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