公开(公告)号：US20180286556A1

公开(公告)日：2018-10-04

申请号：US15477080

申请日：2017-04-01

Applicant: Intel Corporation

Inventor： Amit K. Jain ,  Sameer Shekhar ,  John T. Vu

IPC: H01F27/02 ,  H01F41/04 ,  H01F27/29 ,  H01F27/06

Abstract: An inductor of an integrated circuit can include one or more magnetically transparent and non-conductive layers, a plurality of conductive elements, and a plurality of through hole conductor elements. The plurality of conductive elements can be disposed about opposite sides of each of the one or more non-conductive layers. The plurality of through hole conductive elements can be disposed through the one or more non-conductive layers and electrically coupling selected ones of the plurality of conductive elements in one or more conductive paths configured such that a magnetic field generated in response to a current flow in the one or more conductive paths opposes changes in the current flow.