公开(公告)号：US20220200149A1

公开(公告)日：2022-06-23

申请号：US17448722

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Maruti TAMRAKAR ,  Jayprakash THAKUR

IPC: H01Q9/04 ,  H01Q5/392 ,  H01Q21/06

Abstract: Examples relate to concepts for patch antennas and particular to a method for forming a multiband patch antenna. A multiband patch antenna may comprise a ground layer and an excitation layer, comprising a first excitation patch, a second excitation patch and a feeding patch, wherein the patch is arranged to excite the first excitation patch and the second excitation simultaneously.

公开(公告)号：US20220200123A1

公开(公告)日：2022-06-23

申请号：US17455928

申请日：2021-11-22

Applicant: Intel Corporation

Inventor： Jayprakash THAKUR ,  Prasanna PICHUMANI ,  Maruti TAMRAKAR ,  Doddi RAGHAVENDRA ,  Sagar GUPTA

IPC: H01Q1/02 ,  H01Q1/12 ,  H01Q9/04

Abstract: Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.