公开(公告)号：US20230337406A1

公开(公告)日：2023-10-19

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu BAWA ,  Ruander CARDENAS ,  Kathiravan D ,  Jia Yan GO ,  Chin Kung GOH ,  Jeff KU ,  Prakash Kurma RAJU ,  Baomin LIU ,  Twan Sing LOO ,  Mikko MAKINEN ,  Columbia MISHRA ,  Juha PAAVOLA ,  Prasanna PICHUMANI ,  Daniel RAGLAND ,  Kannan RAJA ,  Khai Ern SEE ,  Javed SHAIKH ,  Gokul SUBRAMANIAM ,  George Baoci SUN ,  Xiyong TIAN ,  Hua YANG ,  Mark CARBONE ,  Vivek PARANJAPE ,  Nehakausar PINJARI ,  Hari Shanker THAKUR ,  Christopher MOORE ,  Gustavo FRICKE ,  Justin HUTTULA ,  Gavin SUNG ,  Sammi WY LIU ,  Arnab SEN ,  Chun-Ting LIU ,  Jason Y. JIANG ,  Gerry JUAN ,  Shih Wei NIEN ,  Lance LIN ,  Evan KUKLINSKI

IPC: H05K7/20 ,  H01L23/34 ,  G06F1/20

CPC classification number: H05K7/20963 ,  H01L23/34 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2099 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20154

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20230024409A1

公开(公告)日：2023-01-26

申请号：US17903278

申请日：2022-09-06

Applicant: Intel Corporation

Inventor： Smit KAPILA ,  Prakash Kurma RAJU ,  Abhishek SRIVASTAV ,  Prasanna PICHUMANI ,  Raghavendra Subramanya Setty KANIVIHALLI

IPC: H05K7/20 ,  G06F1/20 ,  G10K11/16

Abstract: A noise suppressing heat exchanger (also referred to as heat sink) includes a plurality of heat dissipating fins formed with baffles. The baffles suppress noise from a fan by slowing air flow and creating internal reflections within the heat exchanger that reflect noise away from the air flow path, absorbing sound energy and potentially setting up standing waves which dissipate noise via destructive interference. Other embodiments may be described and/or claimed.

公开(公告)号：US20220200165A1

公开(公告)日：2022-06-23

申请号：US17448724

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Maruti TAMRAKAR ,  Sagar GUPTA ,  Jayprakash THAKUR ,  Prasanna PICHUMANI

IPC: H01Q21/06 ,  H01Q13/10 ,  H01Q1/38

Abstract: A slot antenna assembly for a portable electronic device is disclosed. The assembly includes a first slot antenna having a first slot through a substrate from an outer surface of the substrate to an inner surface of the substrate. The assembly also includes a second slot antenna including a second slot through the substrate from the outer surface of the substrate to the inner surface of the substrate. An isolator includes at least one of an isolation slot and a conductor. The isolation slot includes a substrate isolation slot which extends through the substrate between the first and second slot antennas; and a conductor. The conductor connects the inner surface of the substrate between the first and second antennas to an opposite inner surface of an opposite substrate opposite the inner surface between the first and second antennas.

公开(公告)号：US20250046983A1

公开(公告)日：2025-02-06

申请号：US18361952

申请日：2023-07-31

Applicant: Intel Corporation

Inventor： Bala SUBRAMANYA ,  Prakash KURMA RAJU ,  Jayprakash THAKUR ,  Zaman Zaid MULLA ,  Praveen KUMAR ,  Yagnesh Vinodrai WAGHELA ,  Maruti TAMRAKAR ,  Prasanna PICHUMANI ,  Harry SKINNER

IPC: H01Q1/22 ,  H01Q1/40 ,  H01Q1/48 ,  H01Q1/52

Abstract: Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

公开(公告)号：US20240055779A1

公开(公告)日：2024-02-15

申请号：US18347587

申请日：2023-07-06

Applicant: Intel Corporation

Inventor： Maruti TAMRAKAR ,  Prathibha PEDDIREDDY ,  Jayprakash THAKUR ,  Anoop PARCHURU ,  Prasanna PICHUMANI

IPC: H01Q21/28

CPC classification number: H01Q21/28

Abstract: A circuitry including a first antenna configured to communicate via a first RAT; including a substrate; and a second antenna located on the substrate of the first antenna configured to communicate via a second RAT, wherein communication via the first RAT does not interfere with communication via the second RAT.

公开(公告)号：US20230198122A1

公开(公告)日：2023-06-22

申请号：US17557059

申请日：2021-12-21

Applicant: Intel Corporation

Inventor： Maruti TAMRAKAR ,  Prasanna PICHUMANI ,  Jayprakash THAKUR ,  Sagar GUPTA

IPC: H01Q1/22 ,  H04M1/02

CPC classification number: H01Q1/2266 ,  H04M1/026

Abstract: A communication device including a chassis; and a wireless communication interface arranged at least in part on a mounting structure, wherein the chassis houses the wireless communication interface, wherein the wireless communication interface comprises an antenna; and wherein the chassis comprises a recess, and wherein the mounting structure is rotatably arranged in the recess.

公开(公告)号：US20220200123A1

公开(公告)日：2022-06-23

申请号：US17455928

申请日：2021-11-22

Applicant: Intel Corporation

Inventor： Jayprakash THAKUR ,  Prasanna PICHUMANI ,  Maruti TAMRAKAR ,  Doddi RAGHAVENDRA ,  Sagar GUPTA

IPC: H01Q1/02 ,  H01Q1/12 ,  H01Q9/04

Abstract: Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.