公开(公告)号：US5870286A

公开(公告)日：1999-02-09

申请号：US915059

申请日：1997-08-20

申请人： Matthew Allen Butterbaugh ,  Roger Duane Hamilton ,  Sukhvinder Singh Kang

发明人： Matthew Allen Butterbaugh ,  Roger Duane Hamilton ,  Sukhvinder Singh Kang

IPC分类号： H01L23/40 ,  H05K1/02 ,  H05K7/20

CPC分类号： H05K1/0206 ,  H01L23/4093 ,  H01L2224/16 ,  H05K2201/10598 ,  H05K3/0061

摘要： An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which permits heat to flow to the heat sink while maintaining electrical isolation between the vias. The heat sink is held on the board by push pin assemblies including springs that compress the interface pad between the circuit board and the heat sink. The body of each push pin assembly includes flexing legs supporting locking barbs, and flex of the legs is limited by a strut defining a closed end slot in the shank of the body.

摘要翻译： 电路板顶部的电子模块阵列由固定在电路板底部的散热片冷却。 通孔将热量通过板传递到兼容的接口焊盘，其允许热量流过散热器，同时保持通孔之间的电隔离。 散热器通过包括弹簧的推销组件保持在电路板上，弹簧压缩电路板和散热器之间的接口焊盘。 每个推销组件的主体包括支撑锁定倒钩的弯曲腿，并且腿的弯曲受限于在主体的柄部中限定封闭端部狭槽的支柱。