公开(公告)号：US20150194321A1

公开(公告)日：2015-07-09

申请号：US14151499

申请日：2014-01-09

Applicant: Micron Technology, Inc.

Inventor： Guangjun Yang ,  Mark Kiehlbauch

IPC: H01L21/3205 ,  H01L21/3213 ,  H01L21/768

CPC classification number: H01L21/76897 ,  H01L21/31111 ,  H01L21/31116 ,  H01L21/32134 ,  H01L21/32137

Abstract: A method of processing a polysilicon-comprising composition comprises forming a first wall comprising at least one recess in polysilicon. A second wall comprising polysilicon is formed. Material other than polysilicon is deposited within the at least one recess and over the polysilicon of the second wall. The material is etched selectively relative to polysilicon to expose polysilicon of the second wall and to leave the material within the at least one recess in the first wall. The exposed polysilicon of the second wall is etched selectively relative to the material within the at least one recess in the first wall. Other methods are disclosed.

Abstract translation: 一种处理含多晶硅的组合物的方法包括形成包含多晶硅中的至少一个凹部的第一壁。 形成包括多晶硅的第二壁。 除了多晶硅之外的材料沉积在第二壁的至少一个凹部内和多晶硅上。 相对于多晶硅选择性地蚀刻材料以暴露第二壁的多晶硅并且将材料留在第一壁中的至少一个凹部内。 相对于第一壁中的至少一个凹部内的材料选择性地蚀刻第二壁的暴露的多晶硅。 公开了其他方法。

公开(公告)号：US20130186431A1

公开(公告)日：2013-07-25

申请号：US13792482

申请日：2013-03-11

Applicant: Micron Technology, Inc.

Inventor： Mark Kiehlbauch ,  Paul A. Morgan ,  Gurtej S. Sandhu

IPC: H01L21/306

CPC classification number: H01L21/306 ,  H01J37/3233 ,  H01J37/3244 ,  H01L21/31111 ,  H01L21/31116

Abstract: Some embodiments include utilization of both plasma and aerosol to treat substrate surfaces. The plasma and aerosol may be utilized simultaneously, or sequentially. In some embodiments, the plasma forms a plasma sheath over the substrate surfaces, with the plasma sheath having an electric field gradient therein. The aerosol comprises liquid particles charged to a polarity, and such polarity is transferred to contaminants on the substrate surfaces through interaction with the aerosol. The polarity may be used to assist in dislodging the contaminants from the substrate surfaces. The electric field of the plasma sheath may then sweep the contaminants away from the substrate surfaces. In some embodiments, multiple different aerosols are formed to remove multiple different types of materials from substrate surfaces. Some embodiments include apparatuses configured for treating substrate surfaces with both plasma and aerosol.

Abstract translation: 一些实施例包括利用等离子体和气溶胶来处理衬底表面。 等离子体和气溶胶可以同时或顺序地使用。 在一些实施例中，等离子体在衬底表面上形成等离子体护套，等离子体护套在其中具有电场梯度。 气雾剂包含充电到极性的液体颗粒，并且这种极性通过与气溶胶的相互作用转移到基底表面上的污染物。 极性可用于帮助从衬底表面移除污染物。 然后，等离子体护套的电场可以将污染物从衬底表面扫除。 在一些实施例中，形成多个不同的气溶胶以从基底表面去除多种不同类型的材料。 一些实施例包括被配置用于用等离子体和气溶胶两者处理衬底表面的装置。