摘要:
A solid-state imaging device which has a wiring substrate, a solid-state image sensor having a face opposite to a pixel area fixed to the wiring substrate, and a transparent cover fixed to the solid-state image sensor through an adhesive layer so as to oppose the pixel area of the solid-state image sensor. The wiring substrate has, on a side opposing the transparent cover, a cavity being provided with plural connecting terminals. The solid-state image sensor is fixed to a bottom face of the cavity in a state where the solid-state image sensor falls into the cavity. The connecting terminals of the cavity are connected with a connecting terminals of the solid-state image sensor, respectively through a wiring which falls into the cavity.
摘要:
A filter for absorbing radiation of a selected wave length emitted from a mercury vapor lamp is disclosed. The filter comprises a device for providing an ozone-containing gas layer positioned between the mercury vapor lamp and an object to be illuminated, which may be formed by providing a transparent space filled with the ozone-containing gas between the lamp and the object. This provides a relatively large sized filter which has a simple construction.
摘要:
A camera module (1) is an assembly of a lens holder (4) and a wiring board (2). The lens holder (4) holds an optical structure (3) which forms an image of a subject. The wiring board (2) has formed thereon a solid-state image sensing element (21) which converts the image of the subject formed by the optical structure (3) to electrical signals. Grease (7) is applied to the camera module (1) in such a manner that the grease is not present in an optical path in the optical structure (3). The grease (7) catches the dust (D) produced during manufacture and while in use, thereby prevented the dust (D) from causing image defects. A solid-state image sensing device is thus provided which is capable of preventing the dust produced during manufacture and while in use from causing image defects.
摘要:
The solid image capture device 100 in accordance with the present invention is detachably fixed to a wiring board 1 and applies pressure to the side faces of a transparent lid section 3 in a direction normal to the faces, so as to nip and secure the transparent lid section 3. The mechanism allows a solid image capture element 2 to be attached to and detached from the wiring board 1. The solid image capture element 2 is readily positioned precisely on the wiring board 1.
摘要:
A solid-state image pickup apparatus 100 of the present invention includes a transparent cover section 24 which is provided so as to be spaced from a lens section, the transparent cover section 24 being provided (i) so as to face a light-receiving section of a solid-state image sensing device 22 and (ii) so as to have a gap between the solid-state image sensing device 22 and the transparent cover section 24. Furthermore, the transparent cover section 24 is provided with a positioning mark which serves as a reference for positioning the lens section in consideration of the solid-state image sensing device 22. Consequently, it is possible to provide a shock-resistant solid-state image pickup apparatus in which a lens section and an image pickup section are positionally aligned with high accuracy.
摘要:
A camera module 100a includes a lens unit 1a, which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 2a, which has a solid-state image sensor 24. A position adjustment of the lens 11 is performed by moving the lens 11 independently of the lens holder 12, by use of electromagnetic force. This allows a fine adjustment of a position of the lens 11, thereby improving the alignment precision of the lens 11. Thus, a solid-state image sensing device is provided, which can make fine adjustments of focal lengths.
摘要:
A solid image capture device 100 in accordance with the present invention includes a holder 4 securing a lens barrel 8a onto a transparent lid section 3. When the holder 4 is in engagement with an external section of the transparent lid section 3, the holder 4 presses down the lens barrel 8a to secure the lens barrel 8a to the transparent lid section 3.
摘要:
A camera module 1 includes: an optical structure 3 that forms a subject image; a solid-state image pickup element 21 that converts, into an electrical signal, a subject image formed by the optical structure 3; a lens holder 4, holding the optical structure 3 therein, which contains the solid-state image pickup element 21; and a cushioning member 34, disposed between the optical structure 3 and the lens holder 4 so as to avoid an optical path of the optical structure 3, which absorbs the impact of contact between the optical structure 3 and the lens holder 4, the cushioning member being made of nonmetallic material. This makes it possible to provide a small solid-state image pickup device while preventing dust from being generated when the camera module 1 is manufactured or used.
摘要:
A camera module 100a includes a lens unit 1a which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 2a which includes a solid-state image sensor 24 and a transparent lid section 26 which is arranged so as to face the receiving surface of the solid-state image sensor 24, provided with a space S therebetween. The lens holder 12 blocks unnecessary light to the transparent lid section 26 by engaging the lens holder 12 with a whole periphery part of the transparent lid section 26. Thus, it is possible to provide a solid-state image sensing device, which realizes adequate camera function by blocking unnecessary light to the transparent lid section.
摘要:
A camera module 100a includes a lens unit 1a, which includes a lens 11 and a lens holder 12 holding the lens 11 therein, and an image sensing unit 2a, which has a solid-state image sensor 24. A position adjustment of the lens 11 is performed by moving the lens 11 independently of the lens holder 12, by use of electromagnetic force. This allows a fine adjustment of a position of the lens 11, thereby improving the alignment precision of the lens 11. Thus, a solid-state image sensing device is provided, which can make fine adjustments of focal lengths.