公开(公告)号：US20220199548A1

公开(公告)日：2022-06-23

申请号：US17644043

申请日：2021-12-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi GOTO ,  Masayuki Aoike ,  Mikiko Fukasawa

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor device includes first and second members. In the first member, a first electronic circuit including a semiconductor element is formed. The second member is joined to an area of part of a first surface of the first member, and includes a second electronic circuit including a semiconductor element formed of a semiconductor material different from that of the semiconductor element of the first electronic circuit. An interlayer insulating film covers the second member and an area of the first surface of the first member to which the second member is not joined. An inter-member connection wire on the interlayer insulating film couples the first and second electronic circuits through an opening in the interlayer insulating film. A shield structure including a first metal pattern disposed on the interlayer insulating film shields a shielded circuit, which is part of the first electronic circuit, in terms of radio frequencies.

公开(公告)号：US10580748B2

公开(公告)日：2020-03-03

申请号：US16210614

申请日：2018-12-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsushi Kurokawa ,  Masayuki Aoike ,  Takayuki Tsutsui

IPC: H01L23/00 ,  H01L27/088 ,  H01L29/165 ,  H01L29/205 ,  H01L29/737 ,  H01L27/082 ,  H01L21/8234 ,  H01L21/8222 ,  H03F3/213 ,  H03F3/195

Abstract: A first wiring is disposed above operating regions of plural unit transistors formed on a substrate. A second wiring is disposed above the substrate. An insulating film is disposed on the first and second wirings. First and second cavities are formed in the insulating film. As viewed from above, the first and second cavities entirely overlap with the first and second wirings, respectively. A first bump is disposed on the insulating film and is electrically connected to the first wiring via the first cavity. A second bump is disposed on the insulating film and is electrically connected to the second wiring via the second cavity. As viewed from above, at least one of the plural operating regions is disposed within the first bump and is at least partially disposed outside the first cavity. The planar configuration of the first cavity and that of the second cavity are substantially identical.