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公开(公告)号:US20180198181A1
公开(公告)日:2018-07-12
申请号:US15866794
申请日:2018-01-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Mikiko Fukasawa
IPC: H01P1/202 , H04W72/08 , H04B1/18 , H04B1/04 , H03H7/12 , H03F1/32 , H03H7/01 , H03F3/24 , H03F3/195
CPC classification number: H01P1/202 , H03F1/3247 , H03F3/195 , H03F3/24 , H03F2200/451 , H03H7/0115 , H03H7/12 , H03H7/1758 , H03H7/1766 , H03H2210/025 , H03H2210/036 , H04B1/0475 , H04B1/18 , H04W72/08
Abstract: When a plurality of RF signals having different frequency bands are output at the same time by carrier aggregation, a switch element allows parallel connection between two capacitance elements such that a low pass filter has a first cut-off frequency that is lower than the frequency of an intermodulation distortion signal generated by the carrier aggregation. When an RF signal of a frequency band is output, the switch element releases parallel connection between the two capacitance elements such that the low pass filter has a second cut-off frequency that is higher than the first cut-off frequency.
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公开(公告)号:US20180316076A1
公开(公告)日:2018-11-01
申请号:US16031112
申请日:2018-07-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Mikiko Fukasawa
IPC: H01P1/202 , H04B1/18 , H04W72/08 , H03F1/32 , H03H7/01 , H03F3/24 , H03F3/195 , H03H7/12 , H04B1/04
CPC classification number: H01P1/202 , H03F1/32 , H03F1/3247 , H03F1/565 , H03F3/195 , H03F3/24 , H03F3/245 , H03F2200/294 , H03F2200/451 , H03H7/0115 , H03H7/12 , H03H7/1758 , H03H7/1766 , H03H2210/025 , H03H2210/036 , H04B1/0475 , H04B1/18 , H04W72/08
Abstract: When a plurality of RF signals having different frequer bands are output at the same time by carrier aggregation, a switch element allows parallel connection between two capacitance elements such that a low pass filter has a first cut-off frequency that is lower than the frequency of an intermodulation distortion signal generated by the carrier aggregation. When an RF signal of a frequency band is output, the switch element releases parallel connection between the two capacitance elements such that the low pass filter has a second cut-off frequency that is higher than the first cut-off frequency.
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公开(公告)号:US10044084B2
公开(公告)日:2018-08-07
申请号:US15866794
申请日:2018-01-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Mikiko Fukasawa
IPC: H04B1/10 , H01P1/202 , H03F3/24 , H03H7/01 , H03H7/12 , H03F3/195 , H03F1/32 , H04B1/04 , H04B1/18 , H04W72/08
CPC classification number: H01P1/202 , H03F1/32 , H03F1/3247 , H03F1/565 , H03F3/195 , H03F3/24 , H03F3/245 , H03F2200/294 , H03F2200/451 , H03H7/0115 , H03H7/12 , H03H7/1758 , H03H7/1766 , H03H2210/025 , H03H2210/036 , H04B1/0475 , H04B1/18 , H04W72/08
Abstract: When a plurality of RF signals having different freque bands are output at the same time by carrier aggregation, a switch element allows parallel connection between two capacitance elements such that a low pass filter has a first cut-off frequency that is lower than the frequency of an intermodulation distortion signal generated by the carrier aggregation. When an RF signal of a frequency band is output, the switch element releases parallel connection between the two capacitance elements such that the low pass filter has a second cut-off frequency that is higher than the first cut-off frequency.
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公开(公告)号:US12184243B2
公开(公告)日:2024-12-31
申请号:US17546831
申请日:2021-12-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Mikiko Fukasawa , Satoshi Goto , Shunji Yoshimi , Yuji Takematsu , Mitsunori Samata
Abstract: A second member is joined in surface contact with a first surface of a first member including a semiconductor region made from an elemental semiconductor. The second member includes a radio-frequency amplifier circuit made from a compound semiconductor. A conductive protrusion projects from the second member toward a side opposite to the first member. The first member includes a temperature measurement element that detects a temperature.
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公开(公告)号:US10297892B2
公开(公告)日:2019-05-21
申请号:US16031112
申请日:2018-07-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Mikiko Fukasawa
IPC: H01P1/202 , H04B1/18 , H04W72/08 , H03F1/32 , H03F3/24 , H03H7/01 , H03H7/12 , H03F3/195 , H04B1/04 , H03F1/56
Abstract: When a plurality of RF signals having different frequer bands are output at the same time by carrier aggregation, a switch element allows parallel connection between two capacitance elements such that a low pass filter has a first cut-off frequency that is lower than the frequency of an intermodulation distortion signal generated by the carrier aggregation. When an RF signal of a frequency band is output, the switch element releases parallel connection between the two capacitance elements such that the low pass filter has a second cut-off frequency that is higher than the first cut-off frequency.
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公开(公告)号:US12087711B2
公开(公告)日:2024-09-10
申请号:US17548718
申请日:2021-12-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Satoshi Goto , Shunji Yoshimi , Mikiko Fukasawa
IPC: H03F3/21 , H01L23/66 , H01L25/065 , H03F1/56 , H03F3/19
CPC classification number: H01L23/66 , H01L25/0657 , H03F3/21 , H01L2223/6655 , H01L2225/06517 , H03F1/56 , H03F2200/222 , H03F2200/387 , H03F2200/451
Abstract: In a semiconductor device, when a first surface of a first member is viewed in plan, at least one switch circuit including a switch is disposed within the first surface. A second member is joined to the first surface of the first member in surface contact with the first surface. The second member includes a plurality of transistors that are made of a compound semiconductor and form a radio-frequency amplifier circuit. A first conductive protrusion protrudes from the second member on an opposite side to the first member. The first member includes a circuit element disposed between the radio-frequency amplifier circuit and the at least one switch circuit in a plan view, the circuit element not forming the switch circuit.
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公开(公告)号:US11804450B2
公开(公告)日:2023-10-31
申请号:US17644043
申请日:2021-12-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Satoshi Goto , Masayuki Aoike , Mikiko Fukasawa
IPC: H01L23/552 , H01L23/49 , H01L23/00 , H01L23/498
CPC classification number: H01L23/552 , H01L23/49822 , H01L24/24 , H01L24/94 , H01L24/97 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/48 , H01L2224/05569 , H01L2224/1357 , H01L2224/13147 , H01L2224/16227 , H01L2224/24146 , H01L2224/4813 , H01L2224/94 , H01L2224/97 , H01L2924/10253 , H01L2924/10329
Abstract: A semiconductor device includes first and second members. In the first member, a first electronic circuit including a semiconductor element is formed. The second member is joined to an area of part of a first surface of the first member, and includes a second electronic circuit including a semiconductor element formed of a semiconductor material different from that of the semiconductor element of the first electronic circuit. An interlayer insulating film covers the second member and an area of the first surface of the first member to which the second member is not joined. An inter-member connection wire on the interlayer insulating film couples the first and second electronic circuits through an opening in the interlayer insulating film. A shield structure including a first metal pattern disposed on the interlayer insulating film shields a shielded circuit, which is part of the first electronic circuit, in terms of radio frequencies.
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公开(公告)号:US20220199548A1
公开(公告)日:2022-06-23
申请号:US17644043
申请日:2021-12-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Satoshi GOTO , Masayuki Aoike , Mikiko Fukasawa
IPC: H01L23/552 , H01L23/00 , H01L23/498
Abstract: A semiconductor device includes first and second members. In the first member, a first electronic circuit including a semiconductor element is formed. The second member is joined to an area of part of a first surface of the first member, and includes a second electronic circuit including a semiconductor element formed of a semiconductor material different from that of the semiconductor element of the first electronic circuit. An interlayer insulating film covers the second member and an area of the first surface of the first member to which the second member is not joined. An inter-member connection wire on the interlayer insulating film couples the first and second electronic circuits through an opening in the interlayer insulating film. A shield structure including a first metal pattern disposed on the interlayer insulating film shields a shielded circuit, which is part of the first electronic circuit, in terms of radio frequencies.
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公开(公告)号:US12183648B2
公开(公告)日:2024-12-31
申请号:US17554043
申请日:2021-12-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Mikiko Fukasawa , Satoshi Goto , Shunji Yoshimi
IPC: H03F3/14 , H01L23/367 , H01L23/66 , H03F3/195
Abstract: In a semiconductor device, when a first surface of a first member is viewed in plan, a plurality of circuit blocks are disposed in an inner region of the first surface. The second member is joined to the first surface of the first member in surface contact with the first surface. The second member includes one or more circuit blocks. A conductive protrusion protrudes from the second member on an opposite side to the first member. One of the circuit blocks in the second member constitutes a first amplifier circuit including a plurality of first transistors that are connected in parallel to each other. At least one of the circuit blocks in the first member overlaps at least one circuit block in the second member in a plan view.
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公开(公告)号:US11489493B2
公开(公告)日:2022-11-01
申请号:US16781058
申请日:2020-02-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Mikiko Fukasawa , Kazuhiko Ishimoto
Abstract: A current control circuit controls a base current of a first transistor included in a bias circuit outputting a bias current to a power amplifier based on a base-collector voltage of the first transistor. The current control circuit includes a first circuit that outputs a signal associated with the base-collector voltage of the first transistor, and a second circuit that, based on the signal, provides electrical continuity between a base of the first transistor and a reference potential.
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