公开(公告)号：US20140267893A1

公开(公告)日：2014-09-18

申请号：US14289820

申请日：2014-05-29

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  G02B7/021 ,  G02B7/023 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00

Abstract: An image pickup unit according to the embodiment includes an image pickup device chip having a rectangular shape in plan view, a transparent substrate which is equal in plan view dimensions to the image pickup device chip and is joined to the image pickup device chip, and a lens unit joined to the transparent substrate with the center of a light receiving portion of the image pickup chip aligned with the optical axis, in which, two locking portions are formed in the transparent substrate and two locked portions of the lens unit which is equal to or smaller than the image pickup device chip in plan view dimensions are fitted into or abut on the corresponding locking portions respectively.

Abstract translation: 根据实施例的图像拾取单元包括在平面图中具有矩形形状的图像拾取器件芯片，与图像拾取器件芯片相似的平面图形尺寸的透明基板并且连接到图像拾取器件芯片，以及 透镜单元与透明基板接合，其中图像拾取芯片的光接收部分的中心与光轴对准，其中在透明基板中形成两个锁定部分，并且透镜单元的两个锁定部分等于 或小于平面图中的图像拾取装置芯片分别装配到或抵靠在相应的锁定部分上。

公开(公告)号：US20130119501A1

公开(公告)日：2013-05-16

申请号：US13734086

申请日：2013-01-04

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA

IPC: H01L31/0232 ,  H01L31/18

CPC classification number: H01L31/02327 ,  H01L23/3114 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469 ,  H01L31/18 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/33 ,  H01L2924/00

Abstract: An image pickup apparatus includes: an image pickup device disposed in a first principal surface of a silicon substrate, the image pickup device sensing infrared light; an electrode pad disposed on the first principal surface; a front-face wiring connecting the image pickup device and the electrode pad; an external connection terminal disposed on a second principal surface of the silicon substrate; a back-face wiring connecting the electrode pad and the external connection terminal via a substrate through-hole extending from the second principal surface side through the silicon substrate to a back face of the electrode pad; and a light blocking layer disposed on the second principal surface, the light blocking layer covering a trench portion surrounding the image pickup device and a region surrounded by the trench portion.

Abstract translation: 一种图像拾取装置包括：设置在硅衬底的第一主表面中的图像拾取装置，所述图像拾取装置感测红外光; 设置在所述第一主表面上的电极焊盘; 连接图像拾取装置和电极垫的正面布线; 设置在所述硅衬底的第二主表面上的外部连接端子; 经由从所述第二主面侧穿过所述硅衬底延伸到所述电极焊盘的背面的衬底通孔而将所述电极焊盘和所述外部连接端子连接的背面布线; 以及设置在所述第二主表面上的遮光层，所述遮光层覆盖围绕所述图像拾取装置的沟槽部分和由所述沟槽部分包围的区域。