PHASE SHIFT MASK AND METHOD OF FORMING PATTERNS USING THE SAME
    21.
    发明申请
    PHASE SHIFT MASK AND METHOD OF FORMING PATTERNS USING THE SAME 有权
    相移片掩模和使用其形成图案的方法

    公开(公告)号:US20150293438A1

    公开(公告)日:2015-10-15

    申请号:US14604459

    申请日:2015-01-23

    Abstract: A method of forming a pattern includes: preparing a target substrate including a photoresist layer on a base substrate; aligning a phase shift mask to the target substrate, the phase shift mask including a mask substrate comparted into a first region including a first sub region and second sub regions at sides of the first sub region, and second regions at sides of the first region, the phase shift mask including a phase shift layer on the mask substrate corresponding to the first region; fully exposing the photoresist layer at the first sub region and the second regions by utilizing the phase shift mask; and removing the photoresist layer at the first sub region and the second regions to form first and second photoresist patterns corresponding to the second sub regions. Transmittance of the phase shift layer is selected to fully expose the photoresist layer in the first sub region.

    Abstract translation: 形成图案的方法包括:在基底基板上制备包括光致抗蚀剂层的目标基板; 将相移掩模对准目标衬底,所述相移掩模包括掩模衬底,所述掩模衬底分别包括在所述第一子区域的侧面处包括第一子区域和第二子区域的第一区域,以及所述第一区域的侧面处的第二区域, 所述相移掩模包括对应于所述第一区域的所述掩模基板上的相移层; 通过利用相移掩模使第一子区和第二区的光致抗蚀剂层完全曝光; 以及去除所述第一子区域和所述第二区域处的所述光致抗蚀剂层,以形成对应于所述第二子区域的第一和第二光致抗蚀剂图案。 选择相移层的透射率以完全暴露第一子区域中的光致抗蚀剂层。

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