公开(公告)号：US20130341758A1

公开(公告)日：2013-12-26

申请号：US13907808

申请日：2013-05-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hwan Soo LEE ,  Hye Yeon CHA ,  Jung Min PARK ,  Kang Heon HUR ,  Moon Soo PARK

IPC: H01L49/02

CPC classification number: H01L28/10 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/292

Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a through-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.

Abstract translation: 这里公开了一种芯片电感器。 根据本发明的芯片电感器包括形成有通孔的基板，形成在基板上的导电线圈，被填充以包围导电线圈以形成芯的上部树脂复合磁性层 在基板的中心部分上，形成在基板的底部的下部树脂复合磁性层和形成在上部和下部树脂复合磁性层两侧的外部电极。