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    POWER INDUCTOR AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    POWER INDUCTOR AND MANUFACTURING METHOD THEREOF 审中-公开
    功率电感器及其制造方法

    公开(公告)号：US20140292469A1

    公开(公告)日：2014-10-02

    申请号：US14164640

    申请日：2014-01-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hye Yeon CHA ,  Hwan Soo LEE ,  Moon Soo PARK ,  Young Do KWEON

    IPC: H01F27/28

    CPC classification number: H01F17/0013 ,  H01F2017/002

    Abstract: Disclosed herein is a power inductor including: an opening part penetrating through the insulating layer; an upper coil electrode pattern formed on an upper surface of the insulating layer and having a form in which it is wound around the opening part; a lower coil electrode pattern formed on a lower surface of the insulating layer and having a form in which it is wound around the opening part; and metal layers plated on a surface of the innermost pattern of the upper coil electrode pattern and a surface of the innermost pattern of the lower coil electrode pattern, wherein the metal layers plated on the surfaces of the innermost patterns of the upper and lower coil electrode patterns are extended to an inner wall of the opening part to thereby be connected to each other.

    Abstract translation: 这里公开了一种功率电感器，包括：穿透绝缘层的开口部; 上部线圈电极图案，形成在绝缘层的上表面上，并且具有缠绕在开口部上的形式; 下部线圈电极图案，形成在所述绝缘层的下表面上，并具有卷绕在所述开口部上的形式; 并且镀在上部线圈电极图案的最内图案的表面上的金属层和下部线圈电极图案的最内部图案的表面，其中镀在上部和下部线圈电极的最内侧图案的表面上的金属层 图案被延伸到开口部分的内壁，从而彼此连接。

    POWER INDUCTOR AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    POWER INDUCTOR AND MANUFACTURING METHOD THEREOF 有权
    功率电感器及其制造方法

    公开(公告)号：US20140247101A1

    公开(公告)日：2014-09-04

    申请号：US14175478

    申请日：2014-02-07

    Applicant: Samsung Electro-Mechanics, Co., Ltd.

    Inventor： Hye Yeon CHA ,  Young Do KWEON ,  Young Seuck YOO ,  Hwan Soo LEE ,  Woon Chul CHOI

    IPC: H01F27/32 ,  H01F41/12

    CPC classification number: H01F41/12 ,  H01F27/2804 ,  H01F27/327 ,  H01F41/042 ,  H01F41/127 ,  H01F2027/2809 ,  Y10T29/4902

    Abstract: Disclosed herein are a power inductor in which aspect ratios of the innermost pattern and the outermost pattern are similar with those of the intermediate pattern and a manufacturing method thereof. The power inductor includes coil patterns formed on one surface or both surfaces of a core insulating layer; insulating patterns bonded to at least one of an innermost pattern and an outermost pattern of the coil patterns; metal layers plated on surfaces of the coil patterns; and an insulator covering the coil patterns including the metal layers.

    Abstract translation: 这里公开了功能电感器，其中最内图案和最外图案的纵横比与中间图案的纵横比相似，及其制造方法。 功率电感器包括形成在芯绝缘层的一个表面或两个表面上的线圈图案; 绝缘图案，其键合到线圈图案的最内图案和最外图案中的至少一个; 金属层镀在线圈图案的表面上; 以及覆盖包括金属层的线圈图案的绝缘体。

    COIL COMPONENT
    3.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20190019615A1

    公开(公告)日：2019-01-17

    申请号：US15826012

    申请日：2017-11-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hwan Soo LEE ,  Yoon Hee CHO ,  Sung Min SONG

    IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29 ,  H01F27/255

    Abstract: A coil component includes: a coil part including a coil conductor; and a body formed adjacently to the coil part and including first and second magnetic powder particles having different average particle sizes, wherein an average particle size of the first magnetic powder particles is smaller than an interval between adjacent patterns of the coil conductor, and an average particle size of the second magnetic powder particles is greater than the interval between the adjacent patterns of the coil conductor.

    INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    INDUCTOR AND METHOD FOR MANUFACTURING THE SAME 有权
    电感器及其制造方法

    公开(公告)号：US20140266543A1

    公开(公告)日：2014-09-18

    申请号：US14054451

    申请日：2013-10-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Moon Soo PARK ,  Seong Min CHIN ,  Hwan Soo LEE ,  Hye Yeon CHA

    IPC: H01F27/28 ,  H01F41/04

    CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F41/046 ,  Y10T29/4902

    Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a core substrate having a conductive pattern on the surface and a magnetic layer for covering the core substrate not to expose the conductive pattern, wherein the magnetic layer is made of a metal-polymer composite and has a multilayer structure.

    Abstract translation: 本发明涉及电感器。 根据本发明实施例的电感器包括：在表面上具有导电图案的芯基板和用于覆盖芯基板的磁性层不暴露导电图案，其中磁性层由金属聚合物 复合材料，并具有多层结构。

    COIL COMPONENT
    6.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20190122795A1

    公开(公告)日：2019-04-25

    申请号：US16017015

    申请日：2018-06-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hwan Soo LEE ,  Sung Min SONG ,  Yoon Hee CHO

    IPC: H01F5/04 ,  H01F27/32 ,  H01F1/14

    Abstract: A coil component includes a body including a coil including lead portions at both ends thereof and a magnetic material sealing the coil and external electrodes disposed on outer surfaces of the body and connected to the lead portions, respectively. An outer surface of the coil including at least one of an upper surface, a lower surface, and a side surface of the coil includes a surface area increasing portion.

    CHIP INDUCTOR
    8.
    发明申请
    CHIP INDUCTOR 有权
    芯片电感器

    公开(公告)号：US20160118178A1

    公开(公告)日：2016-04-28

    申请号：US14981679

    申请日：2015-12-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hwan Soo LEE ,  Hye Yeon CHA ,  Jung Min PARK ,  Kang Heon HUR ,  Moon Soo PARK

    IPC: H01F27/24 ,  H01F27/29 ,  H01F27/255 ,  H01F27/28

    CPC classification number: H01L28/10 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/292

    Abstract: Disclosed herein is a chip inductor. The chip inductor according to the present invention includes a substrate on which a trough-hole is formed, a conductive coil that is formed on the substrate, an upper resin composite magnetic layer that is filled to surround the conductive coil so that a core is formed on a center portion of the substrate, a lower resin composite magnetic layer that is formed on a bottom portion of the substrate, and an external electrode that is formed on both sides of the upper and lower resin composite magnetic layers.

    Abstract translation: 这里公开了一种芯片电感器。 根据本发明的片式电感器包括形成有槽孔的基板，形成在基板上的导电线圈，被填充以包围导电线圈以形成芯的上部树脂复合磁性层 在基板的中心部分上，形成在基板的底部的下部树脂复合磁性层和形成在上部和下部树脂复合磁性层两侧的外部电极。

    COIL COMPONENT
    9.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20190057801A1

    公开(公告)日：2019-02-21

    申请号：US15865484

    申请日：2018-01-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hwan Soo LEE ,  Yoon Hee CHO ,  Sung Min SONG

    IPC: H01F27/255 ,  H01F17/00 ,  H01F41/02 ,  H01F27/29 ,  B22F1/00 ,  H01F1/153 ,  C22C45/02 ,  C22C33/02 ,  H01F17/04

    Abstract: A coil component includes a body having a volume of 2.4 mm3 or less and including at least one coil member embedded therein, and first and second external electrodes partially or entirely formed on first and second surfaces of the body opposing each other, respectively, wherein the product of inductance Ls (μH) and S/l (mm) is 0.45 (μH·mm) or more to 0.75 (μH·mm) or less in which S (mm2) is an area of regions of the first and second external electrodes disposed on the first and second surfaces of the body, and 1 (mm) is a minimum spaced distance between the first and second external electrodes formed on the first and second surfaces of the body.

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