Electronic device for providing quality-customized image based on at least two sets of parameters

    公开(公告)号:US11012626B2

    公开(公告)日:2021-05-18

    申请号:US16432276

    申请日:2019-06-05

    Abstract: An electronic device is provided. The electronic device includes a camera, a display, a memory, a communication module, and a processor configured to identify a plurality of parameter sets related to image capturing from an external device using the communication module, provide, in a first preview, at least part of one or more images using the display during at least part of obtaining the one or more images using the camera, generate one or more first corrected images to which a first parameter set among the plurality of parameter sets is applied, using the one or more images, generate one or more second corrected images to which a second parameter set among the plurality of parameter sets is applied, using the one or more images, identify priority for the plurality of parameter sets, and provide, in a second preview, one or more among the one or more first corrected images and the one or more second corrected images according to the priority during at least part of providing the first preview.

    WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

    公开(公告)号:US20210123138A1

    公开(公告)日:2021-04-29

    申请号:US16894811

    申请日:2020-06-07

    Abstract: A wafer processing apparatus includes a reaction tube extending in a vertical direction, a door plate configured to load a boat into the reaction tube and positioned under the reaction tube to seal the reaction tube, the boat supporting a plurality of wafers thereon, a gas injector extending in the vertical direction along the boat within the reaction tube and including a plurality of ejection holes formed therein, a rotary mechanism configured to rotate the gas injector about its center axis to adjust an angle of the ejection hole toward the wafer, and a lift mechanism configured to move the gas injector upward and downward to adjust a height of the ejection hole on the wafer.

Patent Agency Ranking