公开(公告)号：US10829744B2

公开(公告)日：2020-11-10

申请号：US16224427

申请日：2018-12-18

Applicant: Samsung Electronics Co., Ltd. ,  Korea Advanced Institute of Science and Technology

Inventor： Hongsoon Rhee ,  Kijun Jeong ,  Jaehyung Lee ,  Jinhwan Park ,  Donghoon Hur

IPC: C12N9/10 ,  C12P19/04 ,  C07K14/195 ,  C12P19/18

Abstract: Provided is a recombinant microorganism having enhanced cellulose synthase gene stability, a method of producing cellulose by using the recombinant microorganism, and a method of preparing the recombinant microorganism.

公开(公告)号：US11837273B2

公开(公告)日：2023-12-05

申请号：US17872720

申请日：2022-07-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C29/02 ,  G11C29/50 ,  G11C5/04 ,  G11C7/10

CPC classification number: G11C11/4072 ,  G11C5/04 ,  G11C11/408 ,  G11C11/409 ,  G11C29/022 ,  G11C29/028 ,  G11C29/50008 ,  H01L23/49838 ,  H01L25/0655 ,  G11C7/109 ,  G11C7/1063 ,  G11C7/1075 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US20220400418A1

公开(公告)日：2022-12-15

申请号：US17804375

申请日：2022-05-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangtae Kim ,  Jaehyung Lee ,  Youngyong Lee

IPC: H04W36/00

Abstract: Provided are a user equipment (UE) supporting multi subscriber identity module (SIM) multi standby (MSMS), and an operating method of the UE. An operating method of a UE includes performing communication associated with a SIM of the UE with a network in a radio resource control (RRC) idle mode, triggering measurement of a neighbor cell based on a neighbor cell measurement rule that considers a measurement value of a serving cell signal and a number of cell reselection ping-pongs that occurred between the serving cell and the neighbor cell, and reselecting the neighbor cell based on at least one cell reselection criterion considering the measurement value and the number of cell reselection ping-pongs.

公开(公告)号：US09805769B2

公开(公告)日：2017-10-31

申请号：US14697634

申请日：2015-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C5/04 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C11/4072 ,  G11C29/02 ,  G11C29/50 ,  G11C7/10

CPC classification number: G11C11/4072 ,  G11C5/04 ,  G11C7/1063 ,  G11C7/1075 ,  G11C7/109 ,  G11C11/408 ,  G11C11/409 ,  G11C29/022 ,  G11C29/028 ,  G11C29/50008 ,  H01L23/49838 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US11408070B2

公开(公告)日：2022-08-09

申请号：US16894811

申请日：2020-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunho Choi ,  Junghoon Kim ,  Donghyouck Lee ,  Jaehyung Lee

IPC: C23C16/455 ,  H01L21/673 ,  C23C16/458

Abstract: A wafer processing apparatus includes a reaction tube extending in a vertical direction, a door plate configured to load a boat into the reaction tube and positioned under the reaction tube to seal the reaction tube, the boat supporting a plurality of wafers thereon, a gas injector extending in the vertical direction along the boat within the reaction tube and including a plurality of ejection holes formed therein, a rotary mechanism configured to rotate the gas injector about its center axis to adjust an angle of the ejection hole toward the wafer, and a lift mechanism configured to move the gas injector upward and downward to adjust a height of the ejection hole on the wafer.

公开(公告)号：US20210123138A1

公开(公告)日：2021-04-29

申请号：US16894811

申请日：2020-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunho Choi ,  Junghoon Kim ,  Donghyouck Lee ,  Jaehyung Lee

IPC: C23C16/455 ,  C23C16/458 ,  H01L21/673

Abstract: A wafer processing apparatus includes a reaction tube extending in a vertical direction, a door plate configured to load a boat into the reaction tube and positioned under the reaction tube to seal the reaction tube, the boat supporting a plurality of wafers thereon, a gas injector extending in the vertical direction along the boat within the reaction tube and including a plurality of ejection holes formed therein, a rotary mechanism configured to rotate the gas injector about its center axis to adjust an angle of the ejection hole toward the wafer, and a lift mechanism configured to move the gas injector upward and downward to adjust a height of the ejection hole on the wafer.

公开(公告)号：US10971208B2

公开(公告)日：2021-04-06

申请号：US16734821

申请日：2020-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C29/02 ,  G11C29/50 ,  G11C5/04 ,  G11C7/10

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US10734059B2

公开(公告)日：2020-08-04

申请号：US16674554

申请日：2019-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  G11C29/50 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C5/04 ,  G11C29/02 ,  H01L25/065 ,  G11C7/10

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US11729918B2

公开(公告)日：2023-08-15

申请号：US15733265

申请日：2018-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungtae Kim ,  Hyukjae Jang ,  Hoonhee Lee ,  Jaehyung Lee ,  Hyeyeon Jang

IPC: H05K5/00 ,  B32B7/14 ,  H04M1/02 ,  C04B37/00 ,  H04R7/18 ,  H04M1/03

CPC classification number: H05K5/0017 ,  B32B7/14 ,  C04B37/005 ,  H04M1/0266 ,  B32B2457/00 ,  H04M1/035 ,  H04R7/18

Abstract: According to various embodiments, an electronic device may include a housing including a first side, a second side facing away from the first side, and a lateral side surrounding a space between the first side and the second side, a front plate disposed on the first side of the housing, a display disposed between the front plate and the first side such that at least part thereof is exposed through the front plate, at least one functional member disposed between the display and the first side, and an adhesive member disposed between the functional member and the first side to attach the functional member to the housing, wherein adhesive member includes an adhesive portion for attaching the functional member and the first side, and at least one non-adhesive portion extending from the adhesive portion. Various other embodiments are possible.

公开(公告)号：US11417386B2

公开(公告)日：2022-08-16

申请号：US17205832

申请日：2021-03-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  H01L23/498 ,  G11C5/04 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  G11C29/02 ,  G11C29/50 ,  G11C7/10

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.