公开(公告)号：US11408070B2

公开(公告)日：2022-08-09

申请号：US16894811

申请日：2020-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunho Choi ,  Junghoon Kim ,  Donghyouck Lee ,  Jaehyung Lee

IPC: C23C16/455 ,  H01L21/673 ,  C23C16/458

Abstract: A wafer processing apparatus includes a reaction tube extending in a vertical direction, a door plate configured to load a boat into the reaction tube and positioned under the reaction tube to seal the reaction tube, the boat supporting a plurality of wafers thereon, a gas injector extending in the vertical direction along the boat within the reaction tube and including a plurality of ejection holes formed therein, a rotary mechanism configured to rotate the gas injector about its center axis to adjust an angle of the ejection hole toward the wafer, and a lift mechanism configured to move the gas injector upward and downward to adjust a height of the ejection hole on the wafer.

公开(公告)号：US20210123138A1

公开(公告)日：2021-04-29

申请号：US16894811

申请日：2020-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunho Choi ,  Junghoon Kim ,  Donghyouck Lee ,  Jaehyung Lee

IPC: C23C16/455 ,  C23C16/458 ,  H01L21/673

Abstract: A wafer processing apparatus includes a reaction tube extending in a vertical direction, a door plate configured to load a boat into the reaction tube and positioned under the reaction tube to seal the reaction tube, the boat supporting a plurality of wafers thereon, a gas injector extending in the vertical direction along the boat within the reaction tube and including a plurality of ejection holes formed therein, a rotary mechanism configured to rotate the gas injector about its center axis to adjust an angle of the ejection hole toward the wafer, and a lift mechanism configured to move the gas injector upward and downward to adjust a height of the ejection hole on the wafer.