Abstract:
The present disclosure relates to semiconductor devices and their fabrication methods. An example semiconductor device comprises a substrate including a logic cell region and a key region, a dummy active pattern on the key region, and a key pattern in the dummy active pattern. The key pattern includes a key cell that is recessed at an upper portion of the substrate. The key cell includes a bottom surface lower than a top surface of the dummy active pattern, and a plurality of inner lateral surfaces that surround the bottom surface. The inner lateral surfaces include a first inner lateral surface and a second inner lateral surface opposite to the first inner lateral surface. A ratio of a silicon atom surface density of the second inner lateral surface to a silicon atom surface density of the first inner lateral surface is in a range of about 0.9 to about 1.1.
Abstract:
A cooking appliance includes a main body forming a machine room; a cooking chamber arranged below the machine room; an intermediate flow path including a first suction port and formed between the machine room and the cooking chamber; and a fan configured to suction air into the intermediate flow path, wherein the machine room includes a second suction port through which air is suctioned, and an opening portion connected to the intermediate flow path, the opening portion includes a first opening portion and a second opening portion arranged at a farther distance from the fan than the first opening portion, and the second opening portion has an area larger than an area of the first opening portion.
Abstract:
An electronic device is provided. The electronic device includes a housing including a front surface, a rear surface opposite to the front surface, and a space between the front surface and the rear surface, a display located inside the housing and viewed through the front surface of the housing to the outside of the electronic device, a support member supporting the display by protruding from the side surface toward the inside of the housing, an optical sensor including a light emitting unit and a light receiving unit wherein the optical sensor is located on a rear surface of the display and overlaps at least one area of the display when viewed from top of the front surface; and a partition wall member formed of an elastic material wherein the partition wall member is located between the display and the optical sensor, and at least a part region of the partition wall member is located between the light emitting unit and the light receiving unit to separate the light emitting unit and the light receiving unit.
Abstract:
A key device comprises a housing in which a key hole is formed, a side key unit assembled at the key hole of the housing, and a gap of a predetermined thickness formed between a portion of the assembled side key unit located within the key hole and the key hole, wherein the gap is secured by processing any one or both of the side key unit located within the key hole or the housing in which the side key unit is assembled.
Abstract:
A method and apparatus of selecting profiles is provided that provides communication services of a terminal equipped with embedded Universal Integrated Circuit Card (eUICC) (or embedded Subscriber Identity Module (eSIM)) and Universal Integrated Circuit Card (UICC). The method of selecting a profile in a terminal including a plurality of subscriber identity module (SIMs) that differ from each other in type, includes selecting, when sensing a profile changing event, one of the plurality of SIMs according to a preset rule, selecting one of a plurality of profiles stored in the plurality of SIMs, and applying the selected profile to the terminal.