公开(公告)号：US20210183752A1

公开(公告)日：2021-06-17

申请号：US17120996

申请日：2020-12-14

Applicant: STMicroelectronics S.r.l.

Inventor： Michele DERAI ,  Roberto TIZIANI

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device comprises at least one semiconductor die electrically coupled to a set of electrically conductive leads, and package molding material molded over the at least one semiconductor die and the electrically conductive leads. At least a portion of the electrically conductive leads is exposed at a rear surface of the package molding material to provide electrically conductive pads. The electrically conductive pads comprise enlarged end portions extending at least partially over the package molding material and configured for coupling to a printed circuit board.

公开(公告)号：US20210183748A1

公开(公告)日：2021-06-17

申请号：US17124094

申请日：2020-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： Michele DERAI ,  Dario VITELLO

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

Abstract: A System in Package, SiP semiconductor device includes a substrate of laser direct structuring, LDS, material. First and second semiconductor die are arranged at a first and a second leadframe structure at opposite surfaces of the substrate of LDS material. Package LDS material is molded onto the second surface of the substrate of LDS material. The first semiconductor die and the package LDS material lie on opposite sides of the substrate of LDS material. A set of electrical contact formations are at a surface of the package molding material opposite the substrate of LDS material. The leadframe structures include laser beam processed LDS material. The substrate of LDS material and the package LDS material include laser beam processed LDS material forming at least one electrically-conductive via providing at least a portion of an electrically-conductive line between the first semiconductor die and an electrical contact formation at the surface of the package molding material opposite the substrate.

公开(公告)号：US20210050226A1

公开(公告)日：2021-02-18

申请号：US16994049

申请日：2020-08-14

Applicant: STMicroelectronics S.r.l.

Inventor： Michele DERAI ,  Giovanni GRAZIOSI

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L21/78

Abstract: Semiconductor dice are arranged on a substrate such as a leadframe. Each semiconductor die is provided with electrically-conductive protrusions (such as electroplated pillars or bumps) protruding from the semiconductor die opposite the substrate. Laser direct structuring material is molded onto the substrate to cover the semiconductor dice arranged thereon, with the molding operation leaving a distal end of the electrically-conductive protrusion to be optically detectable at the surface of the laser direct structuring material. Laser beam processing the laser direct structuring material is then performed with laser beam energy applied at positions of the surface of the laser direct structuring material which are located by using the electrically-conductive protrusions optically detectable at the surface of the laser direct structuring material as a spatial reference.

公开(公告)号：US20190115287A1

公开(公告)日：2019-04-18

申请号：US16151748

申请日：2018-10-04

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Michele DERAI ,  Federico Giovanni ZIGLIOLI

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

Abstract: A method of manufacturing semiconductor devices such as integrated circuits comprises: providing one or more semiconductor chips having first and second opposed surfaces, coupling the semiconductor chip or chips with a support substrate with the second surface towards the support substrate, embedding the semiconductor chip or chips coupled with the support substrate in electrically-insulating packaging material by providing in the packaging material electrically-conductive passageways. The electrically-conductive passageways comprise: electrically-conductive chip passageways towards the first surface of the at least one semiconductor chip, and/or electrically-conductive substrate passageways towards the support substrate.