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公开(公告)号：US20230221574A1
公开(公告)日：2023-07-13
申请号：US18096692
申请日：2023-01-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ju Ho KIM , Jung Hyun PARK , Dong Hoon LEE , Sang Hyun JI , Do Hwan KIM , Nam Keun OH
CPC classification number: G02B27/646 , H04N23/687 , H04N23/6812
Abstract: A sensor shifting actuator includes a fixed body; a moving body disposed in the fixed body and including an image sensor having an imaging surface; a supporting substrate disposed in the fixed body and configured to support the moving body so that the moving body is movable with respect to the fixed body in first and second directions parallel to the imaging surface of the image sensor; and a driver configured to move the moving body in either one or both of the first and second directions. The supporting substrate includes a movable portion coupled to the moving body, a fixed portion coupled to the fixed body, and a connection portion disposed between the movable portion and the fixed portion. The movable portion and the connection portion are movable together in the first direction, and the movable portion is movable with respect to the connection portion in the second direction.
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22.发明申请公开(公告)号：US20210181799A1
公开(公告)日：2021-06-17
申请号：US16821035
申请日：2020-03-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Ho SHIN , Ju Ho KIM
Abstract: The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.
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公开(公告)号：US20180090530A1
公开(公告)日：2018-03-29
申请号：US15449047
申请日：2017-03-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Sung JEONG , Ju Ho KIM
IPC: H01L27/146 , H04N5/225
CPC classification number: H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L2224/04105 , H01L2224/12105 , H01L2224/18 , H01L2224/24195 , H01L2224/24227 , H01L2924/15311 , H04N5/2257
Abstract: A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the active surface or the inactive surface of the sensor; and a second interconnection member disposed on the first interconnection member and the inactive surface or the active surface of the sensor. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the sensor. A camera module includes the fan-out sensor package.
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公开(公告)号：US20170372995A1
公开(公告)日：2017-12-28
申请号：US15457260
申请日：2017-03-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Han KIM , Masazumi AMAGAI , Ju Ho KIM , Tae Sung JEONG
IPC: H01L23/498 , H01L23/31 , H01L23/00
Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.
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Patent Agency Ranking
公开(公告)号：US20240085760A1
公开(公告)日：2024-03-14
申请号：US18112798
申请日：2023-02-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Ho KIM , Sanghyun JI , Dooseub SHIN , Donghoon LEE , Dohwan KIM , Jongeun PARK
IPC: G03B9/06
CPC classification number: G03B9/06
Abstract: An aperture module includes a reference plate, including a protruded pivot pin; a first-stage blade unit including a pair of first blades forming a first-diameter aperture having a diameter smaller than that of the central opening when pivoted about the pivot pin; a second-stage blade unit including a pair of second blades, wherein the second-stage blade unit is disposed on a second planar surface different from a first planar surface of the first-stage blade unit, and the pair of second blades forms a second-diameter aperture having a diameter smaller than the diameter of the first-diameter aperture when pivoted about the pivot pin; and an aperture driver including a driving pin configured to insert into the guide slot, the first blade slot, and the second blade slot, and move along the guide slot. A curvature of the first blade slot and a curvature of the second blade slot form different angles.
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公开(公告)号：US20230336872A1
公开(公告)日：2023-10-19
申请号：US18112186
申请日：2023-02-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Donghoon LEE , Ju Ho KIM , Sanghyun JI
CPC classification number: H04N23/687 , H04N23/54
Abstract: A camera module includes a lens barrel including a plurality of lenses, a case that accommodates the lens barrel, a sensor driver disposed in the case, and an image sensor mounted to the sensor driver, wherein, in an off state, a center of the image sensor is disposed in one direction with respect to an optical axis of the plurality of lenses.
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公开(公告)号：US20230224588A1
公开(公告)日：2023-07-13
申请号：US18084734
申请日：2022-12-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Ho KIM , Sang Hyun JI , Jung Hyun PARK , Doo Seub SHIN , Dong Hoon LEE , Do Hwan KIM
CPC classification number: H04N23/687 , H04N23/6812 , H04N23/67 , F03G7/06143 , F03G7/064
Abstract: A sensor actuator is provided. The sensor actuator includes a movable body on which an image sensor having an imaging plane is disposed; a fixed body configured to accommodate the movable body; and a driver configured to provide a driving force to move the image sensor, wherein the driver includes a wire portion having a plurality of wires of which lengths change when power is applied to the plurality of wires, wherein each of the plurality of wires is configured to have a first end coupled to the fixed body and a second end coupled to the movable body, and wherein one of the first end and the second end of each of the plurality of wires is connected to the fixed body or the movable body through an elastic portion.
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公开(公告)号：US20230156310A1
公开(公告)日：2023-05-18
申请号：US17967222
申请日：2022-10-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Su Bong JANG , Sang Jong LEE , Hee Soo YOON , Tae Ho YUN , Ju Ho KIM
IPC: H04N5/225 , H04N5/232 , H02K11/215 , H02K41/035
CPC classification number: H04N5/2253 , H04N5/23287 , H04N5/23258 , H02K11/215 , H02K41/0354 , H02K2201/18
Abstract: A sensor shifting module includes a fixed body; a movable body movably, disposed in the fixed body, comprising an image sensor having an imaging plane oriented in a first direction; a substrate configured to deform based on a movement of the movable body with respect to the fixed body; and a driver, configured to move the movable body in a direction orthogonal to the first direction, comprising a driving coil coupled to one of the fixed body and the movable body, and a driving yoke coupled to another of the fixed body and the movable body. The driving yoke is disposed to oppose the driving coil in the direction orthogonal to the first direction. When current is applied to the driving coil, the movable body is configured to move in the direction orthogonal to the first direction by electromagnetic interaction between the driving coil and the driving yoke.
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公开(公告)号：US20190163945A1
公开(公告)日：2019-05-30
申请号：US15966621
申请日：2018-04-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Ho KIM , Eun Sil KIM , Sang Kyu LEE , Jong Man KIM , Seok Hwan KIM
Abstract: A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.
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