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    FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
    2.
    发明申请
    FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开

    公开(公告)号：US20180302979A1

    公开(公告)日：2018-10-18

    申请号：US16018430

    申请日：2018-06-26

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Ha Il KIM ,  Dek Gin YANG

    IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

    Abstract: The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

    TOUCH PANEL, MANUFACTURING METHOD THEREOF, AND TOUCHSCREEN APPARATUS
    3.
    发明申请
    TOUCH PANEL, MANUFACTURING METHOD THEREOF, AND TOUCHSCREEN APPARATUS 审中-公开
    触控面板及其制造方法及触摸屏设备

    公开(公告)号：US20150177871A1

    公开(公告)日：2015-06-25

    申请号：US14185461

    申请日：2014-02-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Youn Soo KIM ,  Young Seuck YOO ,  Hyun Dong LEE ,  Sung HAN ,  Seung Min LEE ,  Seung Joo SHIN ,  Jae Ho SHIN

    IPC: G06F3/044

    CPC classification number: G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112

    Abstract: There are provided a touch panel, a manufacturing method thereof, and a touchscreen apparatus. A touch panel according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electrodes formed on an upper surface of the substrate and including conductive lines having a mesh form; and anti-reflective layers formed on upper surfaces of the conductive lines and voids of the substrate, wherein the anti-reflective layer formed on the upper surfaces of the conductive lines has a refractive index different from that of the anti-reflective layer formed on the voids of the substrate.

    Abstract translation: 提供了触摸面板，其制造方法和触摸屏设备。 根据本公开的示例性实施例的触摸面板包括：基板; 多个电极，形成在所述基板的上表面上并且包括具有网状的导电线; 以及形成在导电线的上表面上的抗反射层和基板的空隙，其中形成在导电线的上表面上的抗反射层具有与形成在导电线上的抗反射层的折射率不同的折射率 基体的空隙。

    METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
    4.
    发明申请
    METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开

    公开(公告)号：US20180376584A1

    公开(公告)日：2018-12-27

    申请号：US16118558

    申请日：2018-08-31

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Dek Gin YANG

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/02 ,  H05K3/46

    Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

    METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
    6.
    发明申请
    METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD 有权
    制造刚性柔性印刷电路板的方法

    公开(公告)号：US20130220535A1

    公开(公告)日：2013-08-29

    申请号：US13771834

    申请日：2013-02-20

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Dek Gin YANG

    IPC: H05K3/00

    CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/0026 ,  H05K3/0058 ,  H05K3/02 ,  H05K3/027 ,  H05K3/285 ,  H05K3/4644 ,  H05K3/4691 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/1082

    Abstract: The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

    Abstract translation: 本发明涉及制造刚柔柔性印刷电路板的方法，包括：在一个或两个表面上提供具有第一金属层的第一柔性膜; 通过图案化所述第一金属层形成电路图案; 在所述第一柔性膜的一个或两个表面上形成第二柔性膜，所述第二柔性膜在一个表面上具有第二金属层; 通过在刚性区域R中图案化第二金属层来形成电路图案; 在柔性区域F中的第二金属层上提供抗氧化保护层; 在所述第二柔性膜上层叠至少一个电路层; 并移除柔性区域F中的电路层。

    TOUCH SENSOR
    8.
    发明申请
    TOUCH SENSOR 审中-公开
    触摸传感器

    公开(公告)号：US20150212617A1

    公开(公告)日：2015-07-30

    申请号：US14272762

    申请日：2014-05-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Seuck YOO ,  Kang Heon HUR ,  Sung HAN ,  Dek Gin YANG ,  Jae Ho SHIN ,  Youn Soo KIM ,  Seung Joo SHIN ,  Hyun Dong LEE

    IPC: G06F3/044

    CPC classification number: G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112

    Abstract: Embodiments of the invention provide a touch sensor, including a window substrate, a first electrode pattern adhered onto one surface of the window substrate and including a first metal fine line formed by laminating at least two electrode layers on one surface of a base substrate, and a second electrode pattern including a second metal fine line formed by laminating at least two electrode layers on the other surface of the base substrate. According to an embodiment, the first and the second metal fine lines have a number of laminated electrode layers different from each other.

    Abstract translation: 本发明的实施例提供一种触摸传感器，包括窗口基板，粘附在窗户基板的一个表面上的第一电极图案，并且包括通过在基底基板的一个表面上层压至少两个电极层而形成的第一金属细线，以及 第二电极图案，包括通过在基底基板的另一个表面层叠至少两个电极层而形成的第二金属细线。 根据实施例，第一和第二金属细线具有彼此不同的多个层压电极层。

    METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME
    9.
    发明申请
    METHOD OF MANUFACTURING FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND FLYING TAIL TYPE RIGID-FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME 审中-公开
    制造飞翼尾部类型刚性柔性印刷电路板及其制造的飞行尾部类型刚性柔性印刷电路板的制造方法

    公开(公告)号：US20130213695A1

    公开(公告)日：2013-08-22

    申请号：US13771830

    申请日：2013-02-20

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Yang Je LEE ,  Jae Ho SHIN ,  Han II KIM ,  Dek Gin YANG

    IPC: H05K1/02

    CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4691

    Abstract: The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

    Abstract translation: 本发明涉及一种制造飞尾型刚柔柔性印刷电路板的方法及其制造的飞尾型刚柔柔性印刷电路板，并实现具有改善填充性能的飞尾型刚挠性印刷电路板 通过提供一种制造飞尾型刚性 - 柔性印刷电路板的方法，包括：提供在两个表面上具有第一内部电路图案层的基底基板; 在基底基板的刚性区域R上层叠第一绝缘层; 将在基底衬底的整个区域上延伸的至少一个电路层层叠在第一绝缘层上; 并且去除对应于柔性域F的电路层的一部分，其中电路层包括第二绝缘层和由其制造的飞尾型刚柔柔性印刷电路板。

    PRINTED CIRCUIT BOARD
    10.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20250126718A1

    公开(公告)日：2025-04-17

    申请号：US18741290

    申请日：2024-06-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Ho SHIN ,  Jae Woong CHOI

    IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K3/38

    Abstract: A printed circuit board includes a first substrate including a first antenna pattern; a second substrate disposed on a first substrate and including a second antenna pattern; a metal layer disposed between the first and second substrates; and a bonding layer disposed between the first and second substrates. At least one of the first and second substrates has a cavity having at least a portion disposed between the first and second antenna patterns, each of the first and second substrates includes an organic material, and the bonding layer includes an inorganic material.

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