Apparatus and method for performing artificial intelligence (AI) encoding and AI decoding on image

    公开(公告)号:US11810332B2

    公开(公告)日:2023-11-07

    申请号:US17495050

    申请日:2021-10-06

    CPC classification number: G06T9/002 G06N3/082 G06T3/4046

    Abstract: An artificial intelligence (AI) decoding method including obtaining image data generated from performing first encoding on a first image and AI data related to AI down-scaling of at least one original image related to the first image; obtaining a second image corresponding to the first image by performing first decoding on the image data; obtaining, based on the AI data, deep neural network (DNN) setting information for performing AI up-scaling of the second image; and generating a third image by performing the AI up-scaling on the second image via an up-scaling DNN operating according to the obtained DNN setting information. The DNN setting information is DNN information updated for performing the AI up-scaling of at least one second image via joint training of the up-scaling DNN and a down-scaling DNN used for the AI down-scaling.

    Apparatus and method for performing artificial intelligence (AI) encoding and AI decoding on image

    公开(公告)号:US11164340B2

    公开(公告)日:2021-11-02

    申请号:US17180358

    申请日:2021-02-19

    Abstract: An artificial intelligence (AI) decoding method including obtaining image data generated from performing first encoding on a first image and AI data related to AI down-scaling of at least one original image related to the first image; obtaining a second image corresponding to the first image by performing first decoding on the image data; obtaining, based on the AI data, deep neural network (DNN) setting information for performing AI up-scaling of the second image; and generating a third image by performing the AI up-scaling on the second image via an up-scaling DNN operating according to the obtained DNN setting information. The DNN setting information is DNN information updated for performing the AI up-scaling of at least one second image via joint training of the up-scaling DNN and a down-scaling DNN used for the AI down-scaling.

    Methods and apparatuses for performing artificial intelligence encoding and artificial intelligence decoding on image

    公开(公告)号:US10825205B2

    公开(公告)日:2020-11-03

    申请号:US16793605

    申请日:2020-02-18

    Abstract: Provided is an artificial intelligence (AI) decoding apparatus includes: a memory storing one or more instructions; and a processor configured to execute the one or more instructions stored in the memory, the processor is configured to: obtain AI data related to AI down-scaling an original image to a first image; obtain image data corresponding to an encoding result on the first image; obtain a second image corresponding to the first image by performing a decoding on the image data; obtain deep neural network (DNN) setting information among a plurality of DNN setting information from the AI data; and obtain, by an up-scaling DNN, a third image by performing the AI up-scaling on the second image, the up-scaling DNN being configured with the obtained DNN setting information, wherein the plurality of DNN setting information comprises a parameter used in the up-scaling DNN, the parameter being obtained through joint training of the up-scaling DNN and a down-scaling DNN, and wherein the down-scaling DNN is used to obtain the first image from the original image.

    METHODS OF FABRICATING SEMICONDUCTOR DEVICES

    公开(公告)号:US20250118600A1

    公开(公告)日:2025-04-10

    申请号:US18984957

    申请日:2024-12-17

    Abstract: A method of fabricating a semiconductor device includes forming a dielectric layer on a lower structure. The method includes forming an opening to penetrate through the dielectric layer. The method includes alternately repeating a first operation, in which a first sputtering deposition process is performed to form a first metal pattern in the opening, and a second operation, in which a second sputtering deposition process is performed to form a second metal pattern in the opening, two or more times to form a first metal layer. The method includes forming a second metal layer on the first metal layer in an electroplating manner, and planarizing the first and second metal layers. Moreover, first and second process times, during which the first sputtering deposition process and the second sputtering deposition process, respectively, are performed, are each about five seconds or less.

Patent Agency Ranking