公开(公告)号：US20080073025A1

公开(公告)日：2008-03-27

申请号：US11524401

申请日：2006-09-21

申请人： Jong Jin Lee ,  Young Hwan Shin ,  Jae Min Choi ,  Chang Yul Oh

发明人： Jong Jin Lee ,  Young Hwan Shin ,  Jae Min Choi ,  Chang Yul Oh

IPC分类号： B32B37/00

CPC分类号： B32B38/04 ,  B32B37/12 ,  B32B2038/047 ,  B32B2311/12 ,  B32B2457/08 ,  H05K3/0035 ,  H05K3/0097 ,  H05K3/025 ,  H05K3/421 ,  H05K2203/0152 ,  H05K2203/1388 ,  H05K2203/1536 ,  Y10T156/1052 ,  Y10T156/1082

摘要： Disclosed herein is a method of manufacturing a copper-clad laminate for Via-On-Pad application. The pad includes the steps of providing a first copper foil layer and a second copper foil layer, on the first surfaces of which protective layers are formed; placing two sets of a first copper foil layer, an insulating layer and a second copper foil layer above and below an adhesive layer, respectively; removing the protective layers, which have been respectively formed on the second copper foil layers, and parts of the second copper foil layers; forming via holes by removing parts of the insulating layers through the regions from which the parts of the second copper foil layers have been removed, using laser processing; and forming two copper-clad laminates by removing the protective layers, which have been respectively formed on one surface of one first copper foil layer and one surface of the other first copper foil layer, and the adhesive layer.

摘要翻译： 本文公开了一种制造用于Via-On-Pad应用的覆铜层压板的方法。 该垫包括在形成有保护层的第一表面上提供第一铜箔层和第二铜箔层的步骤; 在粘合剂层上分别放置两组第一铜箔层，绝缘层和第二铜箔层; 去除分别形成在第二铜箔层上的保护层和第二铜箔层的部分; 通过使用激光加工从已除去了第二铜箔层的部分的区域去除绝缘层的一部分来形成通孔; 并且通过去除分别形成在一个第一铜箔层的一个表面和另一个第一铜箔层的一个表面上的保护层和粘合剂层来形成两个覆铜层压板。