公开(公告)号：US12058819B2

公开(公告)日：2024-08-06

申请号：US17292492

申请日：2019-11-14

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Rintaro Ishii ,  Takenori Yanai ,  Yoshinori Matsuura

IPC: H05K3/46 ,  B32B9/00 ,  B32B9/04 ,  B32B15/04 ,  H05K1/09 ,  H05K3/38

CPC classification number: H05K3/4652 ,  B32B9/007 ,  B32B9/041 ,  B32B15/043 ,  H05K1/09 ,  H05K3/388 ,  B32B2307/748 ,  B32B2457/08 ,  H05K2201/0355

Abstract: There is provided a laminate in which a decrease in the release function of a release layer can be suppressed even when the laminate is heat-treated under either temperature condition of low temperature and high temperature. This laminate includes a carrier; an adhesion layer on the carrier and containing a metal M1 having a negative standard electrode potential; a release-assisting layer on a surface of the adhesion layer opposite to the carrier and containing a metal M2 (M2 is a metal other than an alkali metal and an alkaline earth metal); a release layer on a surface of the release-assisting layer opposite to the adhesion layer; and a metal layer on a surface of the release layer opposite to the release-assisting layer, and T2/T1, a ratio of a thickness of the release-assisting layer, T2, to a thickness of the adhesion layer, T1, is more than 1 and 20 or less.

公开(公告)号：US20240254286A1

公开(公告)日：2024-08-01

申请号：US18534022

申请日：2023-12-08

Applicant: NexFlex Co., Ltd.

Inventor： Hyuk Jun KIM ,  Dae Nyoun KIM ,  Yun Jeong JO ,  Ki Hoon KIM ,  Ra Mi LEE

IPC: C08G73/16 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  C08G73/10

CPC classification number: C08G73/16 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  C08G73/1067 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2307/204 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08

Abstract: A polyesterimide resin composition, a polyesterimide resin layer, a flexible metal foil laminate, and methods of preparing the polyesterimide resin composition, the polyesterimide resin layer, and the flexible metal foil laminate are provided. The polyesterimide resin composition includes a compound having a structural unit represented by Chemical Formula 1:




In Chemical Formula 1, m and n are mole fractions, and “m+n=1” “0.2≤m≤0.8” and “0.2≤n≤0.8” are satisfied. Ar1 and Ar2 are the same as or different from each other and are each independently a tetravalent organic group having at least one aromatic ring. R1, R2, and R4 to R6 each independently include at least one of —H, —F, —CH3, —OCH3, —CF3, and —OCF3. R3 is an ester group and includes —COO— or —OOC—.

公开(公告)号：US12036776B2

公开(公告)日：2024-07-16

申请号：US17331744

申请日：2021-05-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke Kamitsubo ,  Tsuyoshi Katsube ,  Ryosuke Takada

IPC: B32B27/08 ,  B32B3/02 ,  B32B3/26 ,  B32B7/025 ,  B32B7/027 ,  B32B15/08 ,  B32B27/18 ,  B32B27/30 ,  B32B37/10 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: B32B27/08 ,  B32B3/02 ,  B32B3/266 ,  B32B15/08 ,  B32B27/18 ,  B32B27/304 ,  B32B37/10 ,  H05K1/028 ,  H05K1/036 ,  H05K1/115 ,  H05K3/321 ,  H05K3/4046 ,  H05K3/4076 ,  H05K3/429 ,  H05K3/4623 ,  B32B7/025 ,  B32B7/027 ,  B32B2305/34 ,  B32B2305/55 ,  B32B2307/202 ,  B32B2307/536 ,  B32B2307/732 ,  B32B2457/08 ,  H05K2203/0235

Abstract: A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.

公开(公告)号：US20240215161A1

公开(公告)日：2024-06-27

申请号：US18600472

申请日：2024-03-08

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Hirokazu KOMORI ,  Hiroyuki YOSHIMOTO ,  Masaji KOMORI ,  Yuki UEDA ,  Junpei TERADA

IPC: H05K1/03 ,  B32B5/02 ,  B32B15/082 ,  B32B15/20 ,  B32B17/10 ,  B32B27/12 ,  B32B27/20 ,  B32B27/32 ,  C08F214/26 ,  C08J5/18 ,  C08K3/36 ,  C08K7/18

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/024 ,  B32B15/082 ,  B32B15/20 ,  B32B17/10 ,  B32B27/12 ,  B32B27/20 ,  B32B27/322 ,  C08F214/262 ,  C08J5/18 ,  C08K3/36 ,  C08K7/18 ,  B32B2262/101 ,  B32B2264/1021 ,  B32B2457/08 ,  C08F2800/10 ,  C08J2327/18 ,  H05K2201/015

Abstract: A laminate, including a fluororesin sheet; and a base material. The fluororesin sheet including a fluororesin composition containing: a melt moldable fluororesin; and a silica. The fluororesin is a tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer and/or a tetrafluoroethylene-hexafluoropropylene copolymer having 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; a blending ratio of the spherical silica to a total amount of the fluororesin and the silica is 50% by mass or higher and 70% by mass or lower; the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower and a melt flow rate (MFR) of 1.0 g/10 min or higher and 30 g/10 min or lower. Also disclosed is a substrate for circuits including the fluororesin sheet used as a part in a multilayer structure.

公开(公告)号：US12021039B2

公开(公告)日：2024-06-25

申请号：US18183250

申请日：2023-03-14

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takahiro Hayashi

IPC: H01L23/544 ,  B32B3/30 ,  B32B15/20

CPC classification number: H01L23/544 ,  B32B3/30 ,  B32B15/20 ,  B32B2457/08

Abstract: Disclosed is a wiring substrate whose orientation can be easily recognized and which can prevent occurrence of a failure which would otherwise occur after a semiconductor device is mounted on the wiring substrate, or after an electronic component composed of the wiring substrate and the semiconductor device mounted thereon is mounted on a base substrate or the like. The wiring substrate includes a base substrate, and a metallic member disposed on a first face of the base substrate. The metallic member has a shape which is plane symmetric with respect to a plane which extends through a center of the first face and is perpendicular to the first face. A recess is formed, as a partial dent, on one of outer surfaces of the metallic member.

公开(公告)号：US20240165934A1

公开(公告)日：2024-05-23

申请号：US18552743

申请日：2022-03-31

Applicant: TAIYO HOLDINGS CO., LTD.

Inventor： Shoko MISHIMA ,  Shoya SEKIGUCHI ,  Kota OKI ,  Nobuhiro ISHIKAWA

IPC: B32B27/28 ,  B32B27/08 ,  B32B27/20 ,  C08L71/12

CPC classification number: B32B27/285 ,  B32B27/08 ,  B32B27/20 ,  C08L71/12 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2264/1021 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2307/732 ,  B32B2371/00 ,  B32B2457/08

Abstract: Provided is a curable resin laminate capable of easily producing an insulating layer having low dielectric properties and excellent adhesion (peel strength) to a conductor layer. A curable resin laminate includes: a first resin layer including a first curable composition, and a second resin layer including a second curable composition and laminated on the first resin layer. The second resin layer has a thickness of 5 to 35% relative to a total thickness of the first resin layer and the second resin layer, the first curable composition contains (A1) a polyphenylene ether and a filler, and a content rate (MB1) of the filler is 30% by mass or more relative to a total solid content. The second curable composition contains (A2) a polyphenylene ether, and a content rate (MB2) of a filler is 40% by mass or less relative to a solid content, MB1>MB2, and (A1) and (A2) have a slope that is less than 0.6, calculated by a conformation plot.

公开(公告)号：US11970591B2

公开(公告)日：2024-04-30

申请号：US17287911

申请日：2018-12-25

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yundong Meng ,  Kehong Fang

IPC: C08J5/24 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  C08L9/00 ,  C08L9/06 ,  C08L71/12 ,  C08L83/16 ,  H05K1/03

CPC classification number: C08J5/244 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  C08L9/00 ,  C08L9/06 ,  C08L71/12 ,  C08L83/16 ,  H05K1/0366 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/1021 ,  B32B2307/3065 ,  B32B2457/08 ,  C08J2309/00 ,  C08J2309/06 ,  C08J2371/12 ,  C08J2383/16 ,  C08J2409/00 ,  C08J2409/06 ,  C08J2471/12 ,  C08J2483/16 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/03 ,  H05K2201/029

Abstract: Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.

公开(公告)号：US11963297B2

公开(公告)日：2024-04-16

申请号：US17279629

申请日：2019-12-24

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Hirokazu Komori ,  Hiroyuki Yoshimoto ,  Masaji Komori ,  Yuki Ueda ,  Junpei Terada

IPC: H05K1/03 ,  B32B5/02 ,  B32B15/082 ,  B32B15/20 ,  B32B17/10 ,  B32B27/12 ,  B32B27/20 ,  B32B27/32 ,  C08F214/26 ,  C08J5/18 ,  C08K3/36 ,  C08K7/18

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/024 ,  B32B15/082 ,  B32B15/20 ,  B32B17/10 ,  B32B27/12 ,  B32B27/20 ,  B32B27/322 ,  C08F214/262 ,  C08J5/18 ,  C08K3/36 ,  C08K7/18 ,  B32B2262/101 ,  B32B2264/1021 ,  B32B2457/08 ,  C08F2800/10 ,  C08J2327/18 ,  H05K2201/015

Abstract: A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

公开(公告)号：US20240092963A1

公开(公告)日：2024-03-21

申请号：US18091307

申请日：2022-12-29

Applicant: AAC Technologies (Nanjing) Co., Ltd.

Inventor： Hongyuan Wang ,  Yilan Zhang ,  Rui Pan ,  Hezhi Wang

IPC: C08G14/06 ,  B32B7/12 ,  B32B15/01 ,  B32B15/20 ,  C08G59/24 ,  C08G59/28 ,  C08G73/10 ,  C08G73/12

CPC classification number: C08G14/06 ,  B32B7/12 ,  B32B15/01 ,  B32B15/20 ,  C08G59/245 ,  C08G59/28 ,  C08G73/1021 ,  C08G73/12 ,  B32B2311/12 ,  B32B2457/08

Abstract: This application provides a resin composition and an adhesive. The resin composition is composed of benzoxazine and a resin. The benzoxazine is synthesized from a primary amine-capped flexible polyimide oligomer, an aldehyde and a monofunctional phenolic compound. The resin contains one or more of an epoxy resin, a maleimide resin, and a cyanate ester resin containing two or more functional groups. The resin is 0.1%-70% by weight of the benzoxazine.

公开(公告)号：US11901331B2

公开(公告)日：2024-02-13

申请号：US17647275

申请日：2022-01-06

Applicant: IMMUNOLIGHT, LLC

Inventor： Zakaryae Fathi ,  James Clayton ,  Harold Walder ,  Frederic A. Bourke, Jr.

IPC: C08K3/00 ,  H01L23/00 ,  B41J2/175 ,  C09J4/00 ,  A61B17/00 ,  A61L24/06 ,  B32B37/12 ,  B32B37/18 ,  B32B38/00 ,  C09J133/08 ,  C09K11/02 ,  C09K11/77 ,  H01L25/065 ,  H01L25/00 ,  B32B3/26 ,  B32B7/14 ,  B32B9/04 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  H01L23/522

CPC classification number: H01L24/83 ,  A61B17/0057 ,  A61L24/06 ,  B32B3/266 ,  B32B7/14 ,  B32B9/04 ,  B32B37/1284 ,  B32B37/18 ,  B32B38/0008 ,  B41J2/17559 ,  C08K3/00 ,  C09J4/00 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J133/08 ,  C09K11/02 ,  C09K11/777 ,  C09K11/7769 ,  H01L23/5226 ,  H01L24/32 ,  H01L25/0657 ,  H01L25/50 ,  B32B2037/1253 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2457/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/15311 ,  Y10T428/2852 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/83192 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/92125 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/83192 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00

Abstract: A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.