公开(公告)号：US20200312779A1

公开(公告)日：2020-10-01

申请号：US16456392

申请日：2019-06-28

Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.

Inventor： Kerui XI ,  Feng QIN ,  Jine LIU ,  Xiaohe LI ,  Tingting CUI

IPC: H01L23/544 ,  H01L23/48 ,  H01L23/31 ,  H01L21/683 ,  H01L21/56 ,  H01L21/02

Abstract: Chip package method and chip package structure are provided. The chip package method includes: providing a transparent substrate including a first side and a second side; coating the first side of the transparent substrate with an organic polymer material layer; depositing a protective layer on the organic polymer material layer; forming alignment parts on the protective layer; attaching a plurality of chips including metal pins; forming an encapsulating layer on the protective layer; polishing the encapsulating layer to expose the metal pins; forming a first insulating layer; forming first through holes in the first insulating layer; forming metal parts extending along sidewalls of the first through holes; and irradiating the second side of the transparent substrate by a laser to lift off the transparent substrate. The metal parts are insulated from each other and electrically connected to the metal pins.