公开(公告)号：US11450457B2

公开(公告)日：2022-09-20

申请号：US16963183

申请日：2019-01-31

Applicant: TDK ELECTRONICS AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Gerald Kloiber ,  Thomas Bernert

IPC: H01C1/14 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/02 ,  H01R12/53 ,  H01R43/02

Abstract: In a method for fastening a contact element (5, 6) in an electrical component (1), a contact element (5, 6) is arranged on a contact surface (3, 4) of a base body (2) of the component (1) and a laser beam (18) is directed onto a region (16, 17) of the contact element (5, 6) in such a way that the base body (2) is not located in the beam direction (24) of the laser beam (18). The contact element (5, 6) is partially melted by the laser beam (18), so that the molten material (7, 8) wets the contact surface (3, 4) and produces fastening of the contact element (5, 6) on the contact surface (3, 4).