公开(公告)号：US20220283040A1

公开(公告)日：2022-09-08

申请号：US17637768

申请日：2020-09-16

Applicant: TDK Electronics AG

Inventor： Anke Weidenfelder ,  Jan Ihle ,  Thomas Stendel ,  Lutz Heiner Kirsten

IPC: G01K7/22 ,  H01C7/04 ,  H05K1/18

Abstract: In an embodiment a sensor element includes a carrier having an electrically insulating material, a top side and a bottom side, an NTC thermistor arranged on the top side of the carrier and at least two first electrodes configured for electrically contacting the sensor element, wherein the first electrodes are arranged on the top side of the carrier, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration in an electrically insulating manner.

公开(公告)号：US20220238260A1

公开(公告)日：2022-07-28

申请号：US17617760

申请日：2020-07-03

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Christl Lisa Mead ,  Thomas Bernert ,  Sebastian Redolfi ,  Marko Vrabelj

IPC: H01C7/04 ,  H01C7/00 ,  H05K1/18 ,  H01C1/14 ,  H01C17/075

Abstract: An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.

公开(公告)号：US20250155305A1

公开(公告)日：2025-05-15

申请号：US18839674

申请日：2023-02-08

Applicant: TDK Electronics AG

Inventor： Markus Eberstein ,  Thomas Stendel ,  Benjamin Bohl

IPC: G01L9/00 ,  B23K26/21

Abstract: In an embodiment a pressure sensor arrangement includes a sensor element having a top side and a bottom side, wherein the sensor element comprises a membrane configured to be exposed to a medium and at least one detection element configured to measure a pressure of the medium, a substrate serving as a carrier of the sensor element, wherein the substrate comprises glass and a connection interface, produced by laser welding, arranged between the sensor element and the substrate, wherein the sensor element and the substrate are mechanically firmly and hermetically connected to one another at the connection interface.

公开(公告)号：US11450457B2

公开(公告)日：2022-09-20

申请号：US16963183

申请日：2019-01-31

Applicant: TDK ELECTRONICS AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Gerald Kloiber ,  Thomas Bernert

IPC: H01C1/14 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/02 ,  H01R12/53 ,  H01R43/02

Abstract: In a method for fastening a contact element (5, 6) in an electrical component (1), a contact element (5, 6) is arranged on a contact surface (3, 4) of a base body (2) of the component (1) and a laser beam (18) is directed onto a region (16, 17) of the contact element (5, 6) in such a way that the base body (2) is not located in the beam direction (24) of the laser beam (18). The contact element (5, 6) is partially melted by the laser beam (18), so that the molten material (7, 8) wets the contact surface (3, 4) and produces fastening of the contact element (5, 6) on the contact surface (3, 4).

公开(公告)号：US12080451B2

公开(公告)日：2024-09-03

申请号：US17887375

申请日：2022-08-12

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Gerald Kloiber ,  Thomas Bernert

IPC: H01C1/14 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/02 ,  H01R12/53 ,  H01R43/02

CPC classification number: H01C1/1413 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/029 ,  H01R12/53 ,  H01R43/0221

Abstract: An electrical component includes a base body having a contact surface on which a contact element is fastened by a solidified molten material, wherein the material is formed by a molten region of the contact element.

公开(公告)号：US12033774B2

公开(公告)日：2024-07-09

申请号：US17617760

申请日：2020-07-03

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Christl Lisa Mead ,  Thomas Bernert ,  Sebastian Redolfi ,  Marko Vrabelj

IPC: H01C7/04 ,  H01C1/14 ,  H01C7/00 ,  H01C17/075 ,  H05K1/18

CPC classification number: H01C7/042 ,  H01C1/14 ,  H01C7/006 ,  H01C17/075 ,  H05K1/182 ,  H05K2201/10196

Abstract: An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.

公开(公告)号：US20220392674A1

公开(公告)日：2022-12-08

申请号：US17887375

申请日：2022-08-12

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Gerald Kloiber ,  Thomas Bernert

IPC: H01C1/14 ,  B23K26/21 ,  G01K1/14 ,  G01K7/22 ,  H01C7/04 ,  H01C17/28 ,  H01R4/02 ,  H01R12/53 ,  H01R43/02

Abstract: An electrical component includes a base body having a contact surface on which a contact element is fastened by a solidified molten material, wherein the material is formed by a molten region of the contact element.